Menu
Home
People
Places
Arts
History
Plants & Animals
Science
Life & Culture
Technology
Reference.org
Wafer-level packaging
open-in-new
<h2 id="see-also">See also</h2> <ul><li><a href="/facts/List_of_electronic_component_packaging_types/fazIw78t">List of electronic component packaging types</a></li> <li><a href="/facts/Chip-scale_package/Eahg8W83">Chip-scale package</a></li> <li><a href="/facts/Wafer-scale_integration/5PkljCmr">Wafer-scale integration</a></li> <li><a href="/facts/Wafer_bonding/aW5sSa4t">Wafer bonding</a></li></ul> <h2 id="further-reading">Further reading</h2> <ul><li>Shichun Qu; Yong Liu (2014). <i>Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications</i>. Springer. <a href="/facts/ISBN_(identifier)/15AdSPa9">ISBN</a> 978-1-4939-1556-9.</li></ul> <h2 id="references">References</h2> <ol> <li id="fn:1"><p>Korczynski, Ed (May 5, 2014). "Wafer-level packaging of ICs for mobile systems of the future". Semiconductor Manufacturing & Design Community. Archived from the original on August 16, 2018. Retrieved September 24, 2018. <a href="http://semimd.com/blog/2014/05/05/wafer-level-packaging-of-ics-for-mobile-systems-of-the-future/" target="_blank">http://semimd.com/blog/2014/05/05/wafer-level-packaging-of-ics-for-mobile-systems-of-the-future/</a> <a href="#fnref:1" class="footnote-back-ref">↩</a></p></li> <li id="fn:2"><p>By Aaron Mamiit, Tech Times. “Apple Wants a Slimmer iPhone 7 and Will Reportedly Use Fan-Out Packaging Technology.” April 1, 2016. Retrieved April 8, 2016. <a href="http://www.techtimes.com/articles/146148/20160401/apple-wants-a-slimmer-iphone-7-and-will-reportedly-use-fan-out-packaging-technology.htm" target="_blank">http://www.techtimes.com/articles/146148/20160401/apple-wants-a-slimmer-iphone-7-and-will-reportedly-use-fan-out-packaging-technology.htm</a> <a href="#fnref:2" class="footnote-back-ref">↩</a></p></li> <li id="fn:3"><p>By Yoni Heisler, BGR. “Report details new tech Apple is using to make the iPhone 7 thinner and lighter.” March 31, 2016. Retrieved April 14, 2016. <a href="http://bgr.com/2016/03/31/iphone-7-thinner-lighter-fan-out-packaging/" target="_blank">http://bgr.com/2016/03/31/iphone-7-thinner-lighter-fan-out-packaging/</a> <a href="#fnref:3" class="footnote-back-ref">↩</a></p></li> <li id="fn:4"><p>By Mark LaPedus, Semiconductor Engineering. “Fan-Out Packaging Gains Steam.” November 23, 2015. Retrieved May 23, 2016. <a href="http://semiengineering.com/fan-out-packaging-gains-steam/" target="_blank">http://semiengineering.com/fan-out-packaging-gains-steam/</a> <a href="#fnref:4" class="footnote-back-ref">↩</a></p></li> <li id="fn:5"><p>"Wafer Level Chip Scale Package (WLCSP)" (PDF). www.nxp.com. Retrieved 2023-11-19. <a href="https://www.nxp.com/docs/en/application-note/AN3846.pdf" target="_blank">https://www.nxp.com/docs/en/application-note/AN3846.pdf</a> <a href="#fnref:5" class="footnote-back-ref">↩</a></p></li> <li id="fn:6"><p>"Improving Redistribution Layers for Fan-out Packages and SiPs". 15 September 2022. <a href="https://semiengineering.com/improving-redistribution-layers-for-fan-out-packages-and-sips/" target="_blank">https://semiengineering.com/improving-redistribution-layers-for-fan-out-packages-and-sips/</a> <a href="#fnref:6" class="footnote-back-ref">↩</a></p></li> <li id="fn:7"><p>"Stats ChipPAC - Wafer Level CSP (WLCSP) - a FIWLP Technology". www.statschippac.com. <a href="http://www.statschippac.com/packaging/packaging/waferlevel/wlcsp.aspx" target="_blank">http://www.statschippac.com/packaging/packaging/waferlevel/wlcsp.aspx</a> <a href="#fnref:7" class="footnote-back-ref">↩</a></p></li> <li id="fn:8"><p>"WLCSP Overview, Market and Applications". November 11, 2018. <a href="https://anysilicon.com/wlcsp-overview-market-applications/" target="_blank">https://anysilicon.com/wlcsp-overview-market-applications/</a> <a href="#fnref:8" class="footnote-back-ref">↩</a></p></li> <li id="fn:9"><p>"Fan-Out Wars Begin". 5 February 2018. <a href="https://semiengineering.com/fan-out-wars-begin/" target="_blank">https://semiengineering.com/fan-out-wars-begin/</a> <a href="#fnref:9" class="footnote-back-ref">↩</a></p></li> <li id="fn:10"><p>By Leon Spencer, ZDNet. “Raspberry Pi 2 power crashes when exposed to xenon flash.” February 9, 2015. Retrieved February 5, 2016. <a href="https://www.zdnet.com/article/raspberry-pi-2-power-crashes-when-exposed-to-xenon-flash/" target="_blank">https://www.zdnet.com/article/raspberry-pi-2-power-crashes-when-exposed-to-xenon-flash/</a> <a href="#fnref:10" class="footnote-back-ref">↩</a></p></li> </ol>