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Microchannel (microtechnology)
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<h2 id="materials">Materials</h2> <p>Different types of materials are required for the different uses of microchannels. These are the three main categories.<a class="footnote-ref" id="fnref:4" href="#fn:4"><sup>4</sup></a> </p> <h3>Polymeric and glass substrates</h3> <p><a href="/facts/Poly(methyl_methacrylate)/CnCRBo5F">Polymethyl methacrylate</a> (PMMA) is used as a solution to a wide range of microfluidic devices due to its low cost and easier fabricating methods.<a class="footnote-ref" id="fnref:5" href="#fn:5"><sup>5</sup></a> <a href="/facts/Silicone_rubber/3XMpD7m9">Silicon elastomers</a> can be used for situations in which elasticity and deformation is necessary.<a class="footnote-ref" id="fnref:6" href="#fn:6"><sup>6</sup></a> </p> <h3>Metallic substrates</h3> <p>Metallic substrates are often chosen for their advantageous <a href="/facts/Properties_of_metals%2c_metalloids_and_nonmetals/xIsFbSBT">metallic properties</a>, such as withstanding high temperatures and transferring heat faster. They can be subject to <a href="/facts/Corrosion/lIC7H4we">corrosion</a>.<a class="footnote-ref" id="fnref:7" href="#fn:7"><sup>7</sup></a><a class="footnote-ref" id="fnref:8" href="#fn:8"><sup>8</sup></a> </p> <h3>Semiconductors, ceramics and composites</h3> <p>Ceramic materials allow for high-temperature operation in comparison to metallic substrates and enable operation in harsh chemical environments in which metals cannot be used.<a class="footnote-ref" id="fnref:9" href="#fn:9"><sup>9</sup></a> </p> <h2 id="history">History</h2> <p>The concept of the microchannel was proposed for the first time by researchers Tuckerman and Pease of Stanford Electronics Laboratories in 1981.<a class="footnote-ref" id="fnref:10" href="#fn:10"><sup>10</sup></a> They suggested an effective method for designing microchannels in the laminar and fully developed flow.<a class="footnote-ref" id="fnref:11" href="#fn:11"><sup>11</sup></a> </p> <h2 id="common-uses">Common uses</h2> <p>Microchannels are extensively used in the pharmaceuticals, and biochemical industries due to short diffusion distances, higher interfacial area, and higher heat/mass transfer rates.<a class="footnote-ref" id="fnref:12" href="#fn:12"><sup>12</sup></a> </p> <h2 id="see-also">See also</h2> <ul><li><a href="/facts/Micro_process_engineering/8FjxIDVX">Micro process engineering</a></li> <li><a href="/facts/Microreactor/uokqUU9j">Microreactor</a></li></ul> <h2 id="sources">Sources</h2> <ul><li></li></ul> <h2 id="references">References</h2> <ol> <li id="fn:1"><p>Kandlikar, Satish G. (2006). Heat transfer and fluid flow in minichannels and microchannels. Amsterdam, the Netherlands: Elsevier B.V. pp. 450. ISBN 978-0-08-044527-4. <a href="978-0-08-044527-4" target="_blank">978-0-08-044527-4</a> <a href="#fnref:1" class="footnote-back-ref">↩</a></p></li> <li id="fn:2"><p>"Microchannels". 4Dcell. Retrieved 2022-07-15. <a href="https://www.4dcell.com/cell-culture-systems/microchannels/" target="_blank">https://www.4dcell.com/cell-culture-systems/microchannels/</a> <a href="#fnref:2" class="footnote-back-ref">↩</a></p></li> <li id="fn:3"><p>Puccio, Kris (2020-02-10). "Understanding Microchannel Heat Exchangers & Their Use Cases". Therma. Retrieved 2022-07-15. <a href="https://www.therma.com/microchannel-heat-exchangers/" target="_blank">https://www.therma.com/microchannel-heat-exchangers/</a> <a href="#fnref:3" class="footnote-back-ref">↩</a></p></li> <li id="fn:4"><p>Prakash, Shashi; Kumar, Subrata. "Fabrication of microchannels: A review". Journal of Engineering Manufacture. 229 (8). <a href="https://www.researchgate.net/publication/280923796" target="_blank">https://www.researchgate.net/publication/280923796</a> <a href="#fnref:4" class="footnote-back-ref">↩</a></p></li> <li id="fn:5"><p>Prakash, Shashi; Kumar, Subrata. "Fabrication of microchannels: A review". Journal of Engineering Manufacture. 229 (8). <a href="https://www.researchgate.net/publication/280923796" target="_blank">https://www.researchgate.net/publication/280923796</a> <a href="#fnref:5" class="footnote-back-ref">↩</a></p></li> <li id="fn:6"><p>Yuen, Michelle; Kramer, Rebecca. "Fabricating microchannels in elastomer substrates for stretchable electronics" (PDF). MSEC Science. <a href="https://www.eng.yale.edu/faboratory/publications/conference/2016/Yuen%20and%20Kramer%20-%202016%20-%20Fabricating%20Microchannels%20in%20Elastomer%20Substrates%20for%20Stretchable%20Electronics.pdf" target="_blank">https://www.eng.yale.edu/faboratory/publications/conference/2016/Yuen%20and%20Kramer%20-%202016%20-%20Fabricating%20Microchannels%20in%20Elastomer%20Substrates%20for%20Stretchable%20Electronics.pdf</a> <a href="#fnref:6" class="footnote-back-ref">↩</a></p></li> <li id="fn:7"><p>Prakash, Shashi; Kumar, Subrata. "Fabrication of microchannels: A review". Journal of Engineering Manufacture. 229 (8). <a href="https://www.researchgate.net/publication/280923796" target="_blank">https://www.researchgate.net/publication/280923796</a> <a href="#fnref:7" class="footnote-back-ref">↩</a></p></li> <li id="fn:8"><p>Andou, F.; Yamamoto, A.; Kawai, T.; Ohmori, H.; Ishida, T.; Takeuchi, Y. (2007-01-01), Arai, Eiji; Arai, Tatsuo (eds.), "MICROCHANNEL ARRAY CREATION BY MEANS OF ULTRAPRECISION MACHINING", Mechatronics for Safety, Security and Dependability in a New Era, Oxford: Elsevier, pp. 163–168, ISBN 978-0-08-044963-0, retrieved 2022-07-15 <a href="978-0-08-044963-0" target="_blank">978-0-08-044963-0</a> <a href="#fnref:8" class="footnote-back-ref">↩</a></p></li> <li id="fn:9"><p>Kee, Robert J.; Almand, Berkeley B.; Blasi, Justin M.; Rosen, Benjamin L.; Hartmann, Marco; Sullivan, Neal P.; Zhu, Huayang; Manerbino, Anthony R.; Menzer, Sophie; Coors, W. Grover; Martin, Jerry L. (2011-08-01). "The design, fabrication, and evaluation of a ceramic counter-flow microchannel heat exchanger". Applied Thermal Engineering. 31 (11): 2004–2012. Bibcode:2011AppTE..31.2004K. doi:10.1016/j.applthermaleng.2011.03.009. ISSN 1359-4311. <a href="https://www.sciencedirect.com/science/article/pii/S1359431111001414" target="_blank">https://www.sciencedirect.com/science/article/pii/S1359431111001414</a> <a href="#fnref:9" class="footnote-back-ref">↩</a></p></li> <li id="fn:10"><p>Tuckerman, D. B., & Pease, R. F. W. (1981). High-performance heat sinking for VLSI. IEEE Electron device letters, 2(5), 126-129. https://dx.doi.org/10.1109/EDL.1981.25367 <a href="/w/index.php?title=IEEE_Electron_device_letters&action=edit&redlink=1" target="_blank">/w/index.php?title=IEEE_Electron_device_letters&action=edit&redlink=1</a> <a href="#fnref:10" class="footnote-back-ref">↩</a></p></li> <li id="fn:11"><p>Salimpour, M. R., Al-Sammarraie, A. T., Forouzandeh, A., & Farzaneh, M. (2019). Constructal design of circular multilayer microchannel heat sinks. Journal of Thermal Science and Engineering Applications, 11(1), 011001. https://dx.doi.org/10.1115/1.4041196 <a href="https://dx.doi.org/10.1115/1.4041196" target="_blank">https://dx.doi.org/10.1115/1.4041196</a> <a href="#fnref:11" class="footnote-back-ref">↩</a></p></li> <li id="fn:12"><p>Jaiswal, P., Kumar, U., Biswas, K. G.(2021) Liquid-Liquid Flow through Micro Dimensional Reactors: A Review on Hydrodynamics, Mass Transfer, and Reaction Kinetics. Exp. Comput. Multiph. Flow 2021. https://doi.org/10.1007/s42757-020-0092-0 <a href="https://doi.org/10.1007/s42757-020-0092-0" target="_blank">https://doi.org/10.1007/s42757-020-0092-0</a> <a href="#fnref:12" class="footnote-back-ref">↩</a></p></li> </ol>