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FOUP
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<h2 id="fosb">FOSB</h2> <p>FOSB is an acronym for Front Opening Shipping Box. FOSBs are used for transporting wafers between manufacturing facilities.<a class="footnote-ref" id="fnref:8" href="#fn:8"><sup>8</sup></a> </p> <h2 id="manufacturers">Manufacturers</h2> <ul><li>ePAK</li> <li>3S Korea</li> <li>CKplas</li> <li>Dainichi Shoji</li> <li><a href="/facts/Entegris/slnlM81Q">Entegris</a></li> <li>E-SUN System Technology</li> <li>Gudeng Precision</li> <li><a href="https://www.miraial.co.jp/en/product/300mm-fosb/">Mirail</a></li> <li><a href="https://www.shinpoly.co.jp/en/product/product/semiconductor/wafercases.html">Shin-Etsu Polymer</a></li></ul> <h2 id="see-also">See also</h2> <ul><li><a href="/facts/Smif_interface/htazCjzD">SMIF</a></li> <li><a href="/facts/Wafer_fabrication_equipment/2lAbPPna">Wafer fabrication equipment</a></li></ul> <h2 id="references">References</h2> <ol> <li id="fn:1"><p>Yoshio Nishi; Robert Doering (9 July 2007). Handbook of Semiconductor Manufacturing Technology, Second Edition. CRC Press. pp. 33–. ISBN 978-1-4200-1766-3. <a href="978-1-4200-1766-3" target="_blank">978-1-4200-1766-3</a> <a href="#fnref:1" class="footnote-back-ref">↩</a></p></li> <li id="fn:2"><p>Mikhail Baklanov; Paul S. Ho; Ehrenfried Zschech (17 February 2012). Advanced Interconnects for ULSI Technology. John Wiley & Sons. pp. 291–. ISBN 978-1-119-96686-9. <a href="978-1-119-96686-9" target="_blank">978-1-119-96686-9</a> <a href="#fnref:2" class="footnote-back-ref">↩</a></p></li> <li id="fn:3"><p>Lars Mönch; John W. Fowler; Scott Mason (12 September 2012). Production Planning and Control for Semiconductor Wafer Fabrication Facilities: Modeling, Analysis, and Systems. Springer Science & Business Media. pp. 144–. ISBN 978-1-4614-4471-8. <a href="978-1-4614-4471-8" target="_blank">978-1-4614-4471-8</a> <a href="#fnref:3" class="footnote-back-ref">↩</a></p></li> <li id="fn:4"><p>Cassett, David Ian (2004). Radio frequency identification (RFID) applications in semiconductor manufacturing (Thesis thesis). Massachusetts Institute of Technology. <a href="https://dspace.mit.edu/handle/1721.1/28503" target="_blank">https://dspace.mit.edu/handle/1721.1/28503</a> <a href="#fnref:4" class="footnote-back-ref">↩</a></p></li> <li id="fn:5"><p>Lin, Tee; Zargar, Omid Ali; Lee, Tzu-Chieh; Sabusap, Dexter Lyndon; Li, Jian-Jie; Hu, Shih-Cheng; Khodadadi, Jay M.; Jamshideasli, Dourna; Leggett, Graham (2021-11-01). "Flow analysis of a front opening unified pod (FOUP) subjected to different fan filter unit (FFU) coverage area in mini-environment". International Journal of Thermofluids. 12: 100124. doi:10.1016/j.ijft.2021.100124. ISSN 2666-2027. <a href="https://doi.org/10.1016%2Fj.ijft.2021.100124" target="_blank">https://doi.org/10.1016%2Fj.ijft.2021.100124</a> <a href="#fnref:5" class="footnote-back-ref">↩</a></p></li> <li id="fn:6"><p>Yoshio, Nishi (2017), Handbook of Semiconductor Manufacturing Technology, CRC Press <a href="#fnref:6" class="footnote-back-ref">↩</a></p></li> <li id="fn:7"><p>"450mm FOUP/LPU system in advanced semiconductor manufacturing processes: A study on the minimization of oxygen content inside FOUP when the door is opened". IEEE: 1–4. September 2015. <a href="https://ieeexplore.ieee.org/document/7328897" target="_blank">https://ieeexplore.ieee.org/document/7328897</a> <a href="#fnref:7" class="footnote-back-ref">↩</a></p></li> <li id="fn:8"><p>Yoshio Nishi; Robert Doering (9 July 2007). Handbook of Semiconductor Manufacturing Technology, Second Edition. CRC Press. pp. 33–. ISBN 978-1-4200-1766-3. <a href="978-1-4200-1766-3" target="_blank">978-1-4200-1766-3</a> <a href="#fnref:8" class="footnote-back-ref">↩</a></p></li> </ol>