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Embedded wafer level ball grid array
open-in-new
<h2 id="process-steps">Process Steps</h2> <ol><li>Lamination of foil onto carrier (lamination tool)</li> <li>Chip placement onto wafer (<a href="/facts/Automated_storage_and_retrieval_system/NCeB3yH4">pick and place</a> tool)</li> <li><a href="/facts/Molding_(process)/1GkAeyCx">Molding</a> (mold press)</li> <li>De-bonding of carrier (de-bonding tool)</li> <li>Flip reconstructed wafer</li> <li>Ball drop reflow and wafer test</li></ol> <h2 id="advantages">Advantages</h2> <ul><li>Low cost (package and test)</li> <li>Minimal lateral package size and height</li> <li>Excellent electrical and thermal properties</li> <li>Number of realizable interconnects on the package is not restricted</li> <li>High integration potential for multi-die- and stacked packages</li> <li>Upcoming package standard</li></ul> <h2 id="disadvantages">Disadvantages</h2> <ul><li>Inspection and repair difficult since visual inspection is restricted</li> <li>Mechanical stress between package and board is transmitted stronger than for other package technologies</li></ul> <h2 id="see-also">See also</h2> <ul><li><a href="/facts/Chip-scale_package/Eahg8W83">Chip-scale package</a></li> <li><a href="/facts/Ball_grid_array/0sjfGthJ">Ball grid array</a></li></ul> <h2 id="external-links">External links</h2> <ul><li><a href="https://web.archive.org/web/20120305094749/http://www.infineonventures.com/cms/en/corporate/press/news/releases/2007/INFCOM200711-013.html">https://web.archive.org/web/20120305094749/http://www.infineonventures.com/cms/en/corporate/press/news/releases/2007/INFCOM200711-013.html</a></li> <li><a href="http://content.yudu.com/Library/A1mxrk/3DPackagingFebruaryi/resources/4.htm">http://content.yudu.com/Library/A1mxrk/3DPackagingFebruaryi/resources/4.htm</a></li> <li><a href="https://safe.nrao.edu/wiki/pub/Main/EuropeanMicrowaveWeek08/WFR14-1.pdf">https://safe.nrao.edu/wiki/pub/Main/EuropeanMicrowaveWeek08/WFR14-1.pdf</a></li> <li><a href="https://web.archive.org/web/20080517033548/http://www.ciol.com/Semicon/Tech-Watch/News-Reports/Infineon,-ASE-intro-eWLB-package-technology/131107101404/0/">https://web.archive.org/web/20080517033548/http://www.ciol.com/Semicon/Tech-Watch/News-Reports/Infineon,-ASE-intro-eWLB-package-technology/131107101404/0/</a></li> <li><a href="http://www.statschippac.com/services/packagingservices/waferlevelproducts/~/media/Files/Package%20Datasheets/eWLB.ashx">http://www.statschippac.com/services/packagingservices/waferlevelproducts/~/media/Files/Package%20Datasheets/eWLB.ashx</a></li> <li><a href="http://www.amkor.com/go/packaging/all-packages/cspnl/">http://www.amkor.com/go/packaging/all-packages/cspnl/</a></li> <li><a href="http://www.wsdmag.com/Articles/ArticleID/19576/19576.html">http://www.wsdmag.com/Articles/ArticleID/19576/19576.html</a></li> <li><a href="http://www.semineedle.com/posting/26088?snc=20641&snc=20641">eWLB hits the big time</a> Francoise von Trapp, Nov. 30, 2009<a href="https://web.archive.org/web/20120304003459/http://www.infoneedle.com/posting/26088?snc=20641&snc=20641">Archived</a> 2012-03-04 at the <a href="/facts/Wayback_Machine/nmQ3a6JC">Wayback Machine</a></li> <li><a href="https://ieeexplore.ieee.org/document/4147210">https://ieeexplore.ieee.org/document/4147210</a></li> <li><a href="https://web.archive.org/web/20110703111509/http://141.30.122.65/Keynotes/6-Plieninger-ESTC_Keynote_20060907.pdf">https://web.archive.org/web/20110703111509/http://141.30.122.65/Keynotes/6-Plieninger-ESTC_Keynote_20060907.pdf</a></li> <li><a href="https://web.archive.org/web/20090728202431/http://annualreport2008.infineon.com/de/template.asp?content=innovationen">https://web.archive.org/web/20090728202431/http://annualreport2008.infineon.com/de/template.asp?content=innovationen</a></li> <li>Seung Wook Yoon et al. <a href="https://web.archive.org/web/20110716134202/http://www.statschippac.com/services/documentlibrary/~/media/Files/DocLibrary/whitepapers/STATSChipPAC_ECTC2010_s24p5.ashx"><i>Thermal and Electrical Characterization of eWLB (embedded Wafer Level BGA),</i></a> Electronic Components and Technology Conference (ECTC), 2010</li></ul> <h2 id="references">References</h2> <ol> <li id="fn:1"><p>"Infineon, ST and STATS Develops eWLB | TopNews". <a href="https://topnews.us/content/216577-infineon-st-and-stats-develops-ewlb" target="_blank">https://topnews.us/content/216577-infineon-st-and-stats-develops-ewlb</a> <a href="#fnref:1" class="footnote-back-ref">↩</a></p></li> </ol>