Flatpack (electronics)

<h2 id="history">History</h2>

<p>The original flatpack was invented by Y. Tao in 1962 while he was working for <a href="/facts/Texas_Instruments/88NUhuHF">Texas Instruments</a> to improve heat dissipation. The <a href="/facts/Dual_in-line_package/Qgu6Jave">dual in-line package</a> was invented two years later. The first devices measured 1/4 inch by 1/8 inch (3.2 mm by 6.4 mm) and had 10 leads.<a class="footnote-ref" id="fnref:1" href="#fn:1"><sup>1</sup></a>
</p><p>The flat package was smaller and lighter than the round <a href="/facts/TO-5/wfRktVW8">TO-5</a> style transistor packages previously used for integrated circuits. Round packages were limited to 10 leads. Integrated circuits needed more leads to take full advantage of increasing device density. Since flat packages were made of glass, ceramic and metal, they could provide hermetic seals for circuits, protecting them from moisture and corrosion. Flat packs remained popular for military and aerospace applications long after plastic packages became standard for other application areas.
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<h2 id="see-also">See also</h2>
<ul><li><a href="/facts/Quad_Flat_Package/B5FLpfqx">Quad Flat Package</a></li>
<li><a href="/facts/Integrated_circuit_packaging/Y52WABfR">Integrated circuit packaging</a></li></ul>

<h2 id="references">References</h2>

<ol>
<li id="fn:1"><p>Dummer, G.W.A. Electronic Inventions and Discoveries 2nd ed. Pergamon Press ISBN 0-08-022730-9 <a href="/wiki/ISBN_(identifier)" target="_blank">/wiki/ISBN_(identifier)</a> <a href="#fnref:1" class="footnote-back-ref">↩</a></p></li>
</ol>

Flatpack (electronics) open-in-new

Flatpack (electronics)