Substrate coupling

<h2 id="modelling-analysis-and-verification-of-mixed-signal-coupling">Modelling, analysis, and verification of mixed signal coupling</h2>
<p>There is a sizeable literature on substrate, and mixed signal coupling.  Some of the most common topics are:
</p>
<ul><li>Differentiating between the random noise inherent to electronic devices and the deterministic noise generated by circuits.</li>
<li>Examining the physical phenomena responsible for the creation of undesired signals in a digital circuit and the mechanisms of their transport to other parts of the system.  The substrate is the most common coupling mechanism, but capacitive coupling, mutual inductance, and coupling through power supplies are also analyzed.</li>
<li>Comparing various modeling approaches and simulation techniques.  There are many possible models for digital noise generation, the substrate impedance network, and the sensitivity of the (unintended) receiver.  The chosen techniques significantly influence the speed and accuracy of the analysis.</li>
<li>Substrate and mixed-signal analysis techniques can be applied to <a href="/facts/Placement_(EDA)/lcheSkIL">placement</a> and power distribution synthesis.</li></ul>

<ul><li><i>Electronic Design Automation For Integrated Circuits Handbook</i>, by Lavagno, Martin, and Scheffer, <a href="/facts/ISBN_(identifier)/15AdSPa9">ISBN</a> 0-8493-3096-3 A survey of the field of <a href="/facts/Electronic_design_automation/o4la3fmX">electronic design automation</a>.   This article was derived, with permission, from Chapter 23 of Book 2, <i>Mixed-Signal Noise Coupling in System-on-Chip Design: Modeling, Analysis, and Validation</i>, by Nishath Verghese and Makoto Nagata</li></ul>
<h2 id="further-reading--external-links">Further reading / External links</h2>
<ul><li><a href="http://www.noisecoupling.com">Technical Book: "Noise Coupling in Integrated Circuits: A Practical Approach to Analysis, Modeling, and Suppression", by Cosmin Iorga, Ph.D., 286pages, Hardcover</a></li></ul>

Substrate coupling open-in-new

Substrate coupling