The details of the mechanisms of NBTI have been debated, but two effects are believed to contribute: trapping of positively charged holes, and generation of interface states.
The existence of two coexisting mechanisms has resulted in scientific controversy over the relative importance of each component, and over the mechanism of generation and recovery of interface states.
In sub-micrometer devices nitrogen is incorporated into the silicon gate oxide to reduce the gate leakage current density and prevent boron penetration. It is known that incorporating nitrogen enhances NBTI. For new technologies (45 nm and shorter nominal channel lengths), high-κ metal gate stacks are used as an alternative to improve the gate current density for a given equivalent oxide thickness (EOT). Even with the introduction of new materials like hafnium oxide in the gate stack, NBTI remains and is often exacerbated by additional charge trapping in the high-κ layer.
With the introduction of high κ metal gates, a new degradation mechanism has become more important, referred to as PBTI (for positive bias temperature instabilities), which affects nMOS transistor when positively biased. In this case, no interface states are generated and 100% of the Vth degradation may be recovered.