The specification defines a board size of 58 mm × 65 mm, slightly smaller than a credit card and small enough to allow a carrier board in standard PC/104-Plus format.1112
The module can be embedded into a heat spreader, which distributes the component-generated heat onto a larger surface area. In low power applications, this distribution may be enough for complete thermal dissipation.
In higher power applications, the heat spreader presents a thermal interface for mating to additional heat dissipating components such as finned heat sinks. Heat spreaders are simpler and more rugged to connect to than the heat generating components underneath. This simplifies mechanical design for the system builder, but can be less efficient than a complete purpose-built thermal solution.
In a complete system, heat spreaders can be part of the electromagnetic interference containment design.
The specification is hosted by the SFF-SIG and is available on their website. Revision 2.1 was released on 23 February 2010.13
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