Menu
Home
People
Places
Arts
History
Plants & Animals
Science
Life & Culture
Technology
Reference.org
Redistribution layer
open-in-new
<h2 id="see-also">See also</h2> <ul><li><a href="/facts/Semiconductor_device_fabrication/Jd23Mu1z">Semiconductor device fabrication</a></li></ul> <h2 id="external-links">External links</h2> <ul><li><a href="https://web.archive.org/web/20160427064204/http://flipchips.com/tutorial/assembly/redistribution-layers/">Redistribution tutorial</a></li></ul> <h2 id="references">References</h2> <ol> <li id="fn:1"><p>"RDL: an integral part of today's advanced packaging technologies". Solid State Technology. May 2005. <a href="https://sst.semiconductor-digest.com/2011/05/rdl-an-integral-part-of-today-s-advanced/" target="_blank">https://sst.semiconductor-digest.com/2011/05/rdl-an-integral-part-of-today-s-advanced/</a> <a href="#fnref:1" class="footnote-back-ref">↩</a></p></li> <li id="fn:2"><p>Peters, Laura (September 15, 2022). "Improving Redistribution Layers for Fan-out Packages And SiPs". Semiconductor Engineering. <a href="https://semiengineering.com/improving-redistribution-layers-for-fan-out-packages-and-sips/" target="_blank">https://semiengineering.com/improving-redistribution-layers-for-fan-out-packages-and-sips/</a> <a href="#fnref:2" class="footnote-back-ref">↩</a></p></li> <li id="fn:3"><p>J. H. Lau (2019). Redistribution-Layers for Fan-Out Wafer-Level Packaging and Heterogeneous Integrations. 2019 China Semiconductor Technology International Conference (CSTIC). Shanghai, China. pp. 1–10. doi:10.1109/CSTIC.2019.8755777. <a href="https://ieeexplore.ieee.org/document/8755777" target="_blank">https://ieeexplore.ieee.org/document/8755777</a> <a href="#fnref:3" class="footnote-back-ref">↩</a></p></li> </ol>