Multi-chip module

<p>A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or <a href="/facts/Lead_(electronics)/nW8ICkYs">"pins"</a>) where multiple <a href="/facts/Integrated_circuit/fjn6vg7C">integrated circuits</a> (ICs or "chips"), semiconductor <a href="/facts/Die_(integrated_circuit)/XWvdlltE">dies</a> and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "heterogeneous integration" or "<a href="/facts/Hybrid_integrated_circuit/LbHBe5L3">hybrid integrated circuit</a>". The advantage of using MCM packaging is it allows a manufacturer to use multiple components for modularity and/or to improve yields over a conventional monolithic IC approach.
</p><p>A Flip Chip Multi-Chip Module (FCMCM) is a multi-chip module that uses <a href="/facts/Flip_chip/2jleJDJI">flip chip</a> technology. A FCMCM may have one large die and several smaller dies all on the same module.
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Multi-chip module open-in-new

Multi-chip module