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Package on a package
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<p>Package on a package (PoP) is an <a href="/facts/Integrated_circuit_packaging/Y52WABfR">integrated circuit packaging</a> method to vertically combine <a href="/facts/Ball_grid_array/0sjfGthJ">ball grid array</a> (BGA) packages for discrete logic and <a href="/facts/Semiconductor_memory/XXP0CacJ">memory</a>. Two or more packages are installed atop each other, i.e. stacked, with a standard interface to route signals between them. PoP allows higher component density in devices, such as <a href="/facts/Mobile_phone/H3EcqD9h">mobile phones</a>, <a href="/facts/Personal_digital_assistant/fLTT1Uqy">personal digital assistants</a> (PDA), and <a href="/facts/Digital_camera/LSGTserm">digital cameras</a>, at the cost of being slightly taller. Stacks with more than 2 packages are uncommon, due to heat dissipation considerations. </p>