Tape-automated bonding

<p>Tape-automated bonding (TAB) is a process that places bare semiconductor chips (dies) like <a href="/facts/Integrated_circuit/fjn6vg7C">integrated circuits</a> onto a <a href="/facts/Flexible_circuit/M4f01bNq">flexible circuit</a> board (FPC) by attaching them to fine conductors in a <a href="/facts/Polyamide/8AmQgTFa">polyamide</a> or <a href="/facts/Polyimide/4nW9HVKF">polyimide</a> (like trade names <a href="/facts/Kapton/NwTwLMeE">Kapton</a> or <a href="/facts/UPILEX/a9k8f6Wq">UPILEX</a>) film carrier. This FPC with the die(s) (TAB inner lead bonding, ILB) can be mounted on the system or module board or assembled inside a package (TAB outer lead bonding, OLB). Typically the FPC includes from one to three conductive layers and all inputs and outputs of the semiconductor die are connected simultaneously during the TAB bonding. Tape automated bonding is one of the methods needed for achieving chip-on-flex (COF) assembly and it is one of the first <a href="/facts/Roll-to-roll_processing/VKsVbdMK">roll-to-roll processing</a> (also called R2R, reel-to-reel) type methods in the electronics manufacturing.
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Tape-automated bonding open-in-new

Tape-automated bonding