Flat no-leads package

<p>Flat no-leads packages such as quad-flat no-leads (QFN)<a href="https://anysilicon.com/ultimate-guide-qfn-package/">[1]</a> and dual-flat no-leads (DFN) physically and electrically connect <a href="/facts/Integrated_circuit/fjn6vg7C">integrated circuits</a> to <a href="/facts/Printed_circuit_board/muSR2p43">printed circuit boards</a>. Flat no-leads, also known as micro leadframe (MLF) and SON (small-outline no leads), is a <a href="/facts/Surface-mount_technology/SjFyQbbm">surface-mount technology</a>, one of several package technologies that connect <a href="/facts/Integrated_circuit/fjn6vg7C">ICs</a> to the <i>surfaces</i> of <a href="/facts/Printed_circuit_board/muSR2p43">PCBs</a> without <a href="/facts/Through-hole_technology/q0d03wve">through-holes</a>. Flat no-lead is a near <a href="/facts/Chip_scale_package/Eahg8W83">chip scale</a> plastic encapsulated package made with a planar <a href="/facts/Copper_conductor/ft1Yvubx">copper</a> lead frame substrate. Perimeter lands on the package bottom provide electrical connections to the <a href="/facts/Printed_circuit_board/muSR2p43">PCB</a>. Flat no-lead packages usually, but not always, include an exposed <a href="/facts/Thermally_conductive_pad/j8ezDXP8">thermally conductive pad</a> to improve heat transfer out of the <a href="/facts/Integrated_circuit/fjn6vg7C">IC</a> (into the PCB). Heat transfer can be further facilitated by metal <a href="/facts/Via_(electronics)/WzYthtKS">vias</a> in the thermal pad. The QFN package is similar to the <a href="/facts/Quad-flat_package/B5FLpfqx">quad-flat package</a> (QFP), and a <a href="/facts/Ball_grid_array/0sjfGthJ">ball grid array</a> (BGA).
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Flat no-leads package open-in-new

Flat no-leads package