System in a package

<p>A system in a package (SiP) or system-in-package is a number of <a href="/facts/Integrated_circuit/fjn6vg7C">integrated circuits</a> (ICs) enclosed in one  <a href="/facts/Chip_carrier/8Uwkvmws">chip carrier</a> package or encompassing an IC package substrate that may include passive components and perform the functions of an entire system. The ICs may be stacked using <a href="/facts/Package_on_package/HGIeIDVl">package on package</a>, placed side by side, and/or embedded in the substrate. The SiP performs all or most of the functions of an <a href="/facts/Electronic_system/E4JhgISq">electronic system</a>, and is typically used when <a href="/facts/Integrated_circuit_design/sE0qVzyo">designing</a> components for <a href="/facts/Mobile_phone/H3EcqD9h">mobile phones</a>, <a href="/facts/Portable_media_player/2yHdHHKv">digital music players</a>, etc. <a href="/facts/Die_(integrated_circuit)/XWvdlltE">Dies</a> containing integrated circuits may be stacked vertically on the package substrate. They are internally connected by fine <a href="/facts/Wire/yyy05H1S">wires</a> that are bonded to the package substrate. Alternatively, with a <a href="/facts/Flip_chip/2jleJDJI">flip chip</a> technology, solder bumps are used to join stacked chips together and to the package substrate, or even both techniques can be used in a single package. SiPs are like <a href="/facts/System_on_a_chip/1RVvVe6N">systems on a chip</a> (SoCs) but less tightly integrated and not on a single <a href="/facts/Die_(integrated_circuit)/XWvdlltE">semiconductor die</a>. 
</p><p>SIPs can be used either to reduce the size of a system, improve performance or to reduce costs. The technology evolved from multi chip module (MCM) technology, the difference being that SiPs also use <a href="/facts/Three-dimensional_integrated_circuit/dPFn86Vz">die stacking</a>, which stacks several chips or dies on top of each other.
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System in a package open-in-new

System in a package