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Integrated circuit packaging
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<p>Integrated circuit packaging is the final stage of <a href="/facts/Fabrication_(semiconductor)/Jd23Mu1z">semiconductor device fabrication</a>, in which the <a href="/facts/Die_(integrated_circuit)/XWvdlltE">die</a> is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "<a href="/facts/Semiconductor_package/UDqYFqCh">package</a>", supports the electrical contacts which connect the device to a circuit board. </p><p>The packaging stage is followed by testing of the integrated circuit. </p>