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Wire bonding
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<p>Wire bonding is a method of making interconnections between an <a href="/facts/Integrated_circuit/fjn6vg7C">integrated circuit</a> (IC) or other <a href="/facts/Semiconductor_device/6W3ryr50">semiconductor device</a> and its <a href="/facts/Integrated_circuit_packaging/Y52WABfR">packaging</a> during <a href="/facts/Fabrication_(semiconductor)/Jd23Mu1z">semiconductor device fabrication</a>. Wire bonding can also be used to connect an IC to other electronics or to connect from one <a href="/facts/Printed_circuit_board/muSR2p43">printed circuit board</a> (PCB) to another, although these are less common. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages. Wire bonding can be used at frequencies above 100 GHz. </p>