List of electronic component packaging types

<p><a href="/facts/Integrated_circuit/fjn6vg7C">Integrated circuits</a> and certain other <a href="/facts/Electronic_component/F3NBVv4Q">electronic components</a> are put into protective <a href="/facts/Semiconductor_package/UDqYFqCh">packages</a> to allow easy handling and assembly onto <a href="/facts/Printed_circuit_boards/muSR2p43">printed circuit boards</a> and to protect the devices from damage. A very large number of package types exist.  Some package types have standardized dimensions and tolerances, and are registered with trade industry associations such as <a href="/facts/JEDEC/EM7UoQlJ">JEDEC</a> and <a href="/facts/Pro_Electron/8Jmf0c3A">Pro Electron</a>. Other types are proprietary designations that may be made by only one or two manufacturers. <a href="/facts/Integrated_circuit_packaging/Y52WABfR">Integrated circuit packaging</a> is the last assembly process before testing and shipping devices to customers.
</p><p>Occasionally specially-processed integrated circuit dies are prepared for direct connections to a substrate without an intermediate header or carrier. In <a href="/facts/Flip_chip/2jleJDJI">flip chip</a> systems the IC is connected by solder bumps to a substrate. In beam-lead technology, the metallized pads that would be used for <a href="/facts/Wire_bonding/e0qvKlGv">wire bonding</a> connections in a conventional chip are thickened and extended to allow external connections to the circuit. Assemblies using "bare" chips have additional packaging or filling with epoxy to protect the devices from moisture.
</p>

List of electronic component packaging types open-in-new

List of electronic component packaging types