Chip on board

<p>Chip on board (COB) is a method of circuit board <a href="/facts/Manufacturing/3qW7bcdy">manufacturing</a> in which <a href="/facts/Integrated_circuit/fjn6vg7C">integrated circuits</a> (e.g. <a href="/facts/Microprocessor/Fx9CaQht">microprocessors</a>) are attached (wired, bonded directly) to a <a href="/facts/Printed_circuit_board/muSR2p43">printed circuit board</a>, and covered by a blob of <a href="/facts/Epoxy/PvlLBgdQ">epoxy</a>. Chip on board eliminates the packaging of individual <a href="/facts/Semiconductor_device/6W3ryr50">semiconductor devices</a>, which allows a completed product to be less costly, lighter, and more compact. In some cases, COB construction improves the operation of radio frequency systems by reducing the <a href="/facts/Inductance/oIxj7JxX">inductance</a> and <a href="/facts/Capacitance/0pH046TL">capacitance</a> of integrated circuit leads. 
</p><p>COB effectively merges two levels of <a href="/facts/Electronic_packaging/42DmcQFc">electronic packaging</a>: level 1 (components) and level 2 (wiring boards), and may be referred to as "level 1.5".
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Chip on board open-in-new

Chip on board