Zen 2 - Reference.org

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Launched 7 July 2019; 2 years ago

Common manufacturer(s)

TSMC (core die)
GlobalFoundries (I/O die)

L1 cache 64 KB per core

L2 cache 512 KB per core

Technology node TSMC 7 nm

Instruction set AMD64 (x86_64)

Cores

Up to 64

Socket(s)

Product code name(s)

Matisse (desktop)
Rome (server)
Castle Peak (HEDT)
Renoir (APU and embedded)

Predecessor Zen+

Successor Zen 3

Additional information

Zen 2

2019 AMD 7-nanometre processor microarchitecture

Zen 2 is a microarchitecture by AMD, succeeding their original Zen and Zen+ designs. Fabricated on the 7 nm MOSFET node from TSMC, Zen 2 powers the third generation of Ryzen processors, including mainstream desktop, mobile, and high-end systems. It also forms the basis of EPYC server CPUs, supporting up to 64 cores via multi-chip chiplet design. Zen 2 offers hardware mitigations against the Spectre vulnerability and improves instructions per clock by about 15%. Notably, it is used in popular gaming devices like the Steam Deck, PlayStation 5, and Xbox Series X and Series S, albeit with proprietary adaptations.

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Feb 24 2020

Design

Zen 2 is a significant departure from the physical design paradigm of AMD's previous Zen architectures, Zen and Zen+. Zen 2 moves to a multi-chip module design where the I/O components of the CPU are laid out on its own die which is separate from the dies containing processor cores, which are also called chiplets in this context. This separation has benefits in scalability and manufacturability. As physical interfaces don't scale very well with shrinks in process technology, their separation into a different die allows these components to be manufactured using a larger, more mature process node than the CPU dies. The CPU dies (referred to by AMD as core complex dies or CCDs), now more compact due to the move of I/O components onto another die, can be manufactured using a smaller process with fewer manufacturing defects than a larger die would exhibit (since the chances of a die having a defect increases with device (die) size) while also allowing for more dies per wafer. In addition, the central I/O die can service multiple chiplets, making it easier to construct processors with a large number of cores.¹⁹ ²⁰ ²¹

With Zen 2, each CPU chiplet houses 8 CPU cores, arranged in 2 core complexes (CCXs), each of 4 CPU cores. These chiplets are manufactured using TSMC's 7 nanometer MOSFET node and are about 74 to 80 mm2 in size.²² The chiplet has about 3.8 billion transistors, while the 12 nm I/O die (IOD) is ~125 mm2 and has 2.09 billion transistors.²³ The amount of L3 cache has been doubled to 32 MB, with each CCX in the chiplet now having access to 16 MB of L3 compared to the 8 MB of Zen and Zen+.²⁴ AVX2 performance is greatly improved by an increase in execution unit width from 128-bit to 256-bit.²⁵ There are multiple variants of the I/O die: one manufactured on GlobalFoundries 14 nanometer process, and another manufactured using the same company's 12 nanometer process. The 14 nanometer dies have more features and are used for the EPYC Rome processors, whereas the 12 nm versions are used for consumer processors.²⁶ Both processes have similar feature sizes, so their transistor density is also similar.²⁷

AMD's Zen 2 architecture can deliver higher performance at a lower power consumption than Intel's Cascade Lake architecture, with an example being the AMD Ryzen Threadripper 3970X running with a TDP of 140 W in ECO mode delivering higher performance than the Intel Core i9-10980XE running with a TDP of 165 W.²⁸

New features

Some new instruction set extensions: WBNOINVD, CLWB, RDPID, RDPRU, MCOMMIT. Each instruction uses its own CPUID bit.²⁹ ³⁰
Hardware mitigations against the Spectre V4 speculative store bypass vulnerability.³¹
Zero-latency memory mirroring optimization (undocumented).³²
Doubled width of the execution units and load store units (from 128-bit to 256-bit) in the floating point coprocessor and significant further throughput enhancements in the multiplication execution unit. This allows the FPU to perform single-cycle AVX2 calculations.³³

Feature tables

CPUs

APUs

APU features table

Products

On 26 May 2019, AMD announced six Zen 2-based desktop Ryzen processors (codenamed "Matisse"). These included 6-core and 8-core variants in the Ryzen 5 and Ryzen 7 product lines, as well as a new Ryzen 9 line that includes the company's first 12-core and 16-core mainstream desktop processors. ³⁴

The Matisse I/O die is also used as the X570 chipset.

AMD's second generation of Epyc processors, codenamed "Rome", feature up to 64 cores, and were launched on 7 August 2019.³⁵

Desktop CPUs

3000 series (Matisse)

Common features of Ryzen 3000 desktop CPUs:

Socket: AM4.
All the CPUs support DDR4-3200 in dual-channel mode.
L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
L2 cache: 512 KB per core.
All the CPUs support 24 PCIe 4.0 lanes. 4 of the lanes are reserved as link to the chipset.
No integrated graphics.
Fabrication process: TSMC 7FF.

Branding and Model		Cores(threads)	Thermal Solution	Clock rate (GHz)		L3 cache(total)	TDP	Chiplets ³⁶	Coreconfig³⁷	Releasedate	MSRP
Branding and Model		Cores(threads)	Thermal Solution	Base	Boost	L3 cache(total)	TDP	Chiplets ³⁶	Coreconfig³⁷	Releasedate	MSRP
Ryzen 9	3950X	16 (32)	N/A	3.5	4.7	64 MB	105 W³⁸	2 × CCD1 × I/OD	4 × 4	Nov 25, 2019	US $749
	3900XT	12 (24)	N/A	3.8	4.7				4 × 3	Jul 7, 2020	US $499
	3900X		Wraith Prism	3.8	4.6					Jul 7, 2019	US $499
	3900 ³⁹		OEM	3.1	4.3		65 W			Oct 8, 2019	OEM
Ryzen 7	3800XT	8 (16)	N/A	3.9	4.7	32 MB	105 W	1 × CCD1 × I/OD	2 × 4	Jul 7, 2020	US $399
	3800X		Wraith Prism	3.9	4.5		105 W			Jul 7, 2019	US $399
	3700X ⁴⁰		Wraith Prism	3.6	4.4		065 W⁴¹			Jul 7, 2019	US $329
Ryzen 5	3600XT	6 (12)	N/A	3.8	4.5		95 W		2 × 3	Jul 7, 2020	US $249
	3600X		Wraith Spire (non-LED)	3.8	4.4		95 W			Jul 7, 2019	US $249
	3600 ⁴²		Wraith Stealth	3.6	4.2		65 W			Jul 7, 2019	US $199
	3500X ⁴³	6 (6)	Wraith Stealth		4.1					Oct 8, 2019	China ¥1099
	3500	6 (6)	OEM		4.1	16 MB				Nov 15, 2019	OEM (West) Japan ¥16000⁴⁴
Ryzen 3	3300X	4 (8)	Wraith Stealth	3.8	4.3				1 × 4	Apr 21, 2020	US $119
Ryzen 3	3100	4 (8)	Wraith Stealth	3.6	3.9				2 × 2	Apr 21, 2020	US $99

Common features of Ryzen 3000 HEDT/workstation CPUs:

Socket: sTRX4 (Threadripper), sWRX8 (Threadripper PRO).
Threadripper CPUs support DDR4-3200 in quad-channel mode while Threadripper PRO CPUs support DDR4-3200 in octa-channel mode.
L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
L2 cache: 512 KB per core.
Threadripper CPUs support 64 PCIe 4.0 lanes while Threadripper PRO CPUs support 128 PCIe 4.0 lanes. 8 of the lanes are reserved as link to the chipset.
No integrated graphics.
Fabrication process: TSMC 7FF.

Branding and Model		Cores(threads)	Clock rate (GHz)		L3 cache(total)	TDP	Chiplets	Coreconfig⁴⁵	Releasedate	MSRP
Branding and Model		Cores(threads)	Base	Boost	L3 cache(total)	TDP	Chiplets	Coreconfig⁴⁵	Releasedate	MSRP
RyzenThreadripperPRO	3995WX	64 (128)	2.7	4.2	256 MB	280 W⁴⁶	8 × CCD1 × I/OD	16 × 4	Jul 14, 2020
	3975WX	32 (64)	3.5	4.2	128 MB		4 × CCD 1 × I/OD	8 × 4
	3955WX	16 (32)	3.9	4.3	64 MB		2 × CCD1 × I/OD	4 × 4
	3945WX	12 (24)	4.0		64 MB		2 × CCD1 × I/OD	4 × 3
RyzenThreadripper	3990X	64 (128)	2.9		256 MB		8 × CCD 1 × I/OD	16 × 4	Feb 7, 2020	US $3990
	3970X	32 (64)	3.7	4.5	128 MB		4 × CCD1 × I/OD	8 × 4	Nov 25, 2019	US $1999
	3960X	24 (48)	3.8	4.5	128 MB		4 × CCD1 × I/OD	8 × 3	Nov 25, 2019	US $1399

4000 series (Renoir)

Based on the Ryzen 4000G series APUs but with the integrated graphics disabled. Common features of Ryzen 4000 desktop CPUs:

Socket: AM4.
All the CPUs support DDR4-3200 in dual-channel mode.
L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
L2 cache: 512 KB per core.
All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
No integrated graphics.
Fabrication process: TSMC 7FF.
Bundled with AMD Wraith Stealth

The AMD 4700S and 4800S desktop processors are part of a "desktop kit" that comes bundled with a motherboard and GDDR6 RAM. The CPU is soldered, and provides 4 PCIe 2.0 lanes. These are reportedly cut-down variants of the APUs found on the PlayStation 5 and Xbox Series X and S repurposed from defective chip stock.⁴⁷ ⁴⁸ ⁴⁹

Branding and model		Cores(threads)	Clock rate (GHz)		L3 cache(total)	TDP	Coreconfig⁵⁰	Releasedate	MSRP
Branding and model		Cores(threads)	Base	Boost	L3 cache(total)	TDP	Coreconfig⁵⁰	Releasedate	MSRP
AMD	4800S⁵¹ ⁵²	8 (16)		4.0	8 MB		2 × 4	2022	bundled with desktop kit
AMD	4700S ⁵³	8 (16)	3.6	4.0		75 W	2 × 4	2021	bundled with desktop kit
Ryzen 5	4500	6 (12)	3.6	4.1		65 W	2 × 3	Apr 4, 2022	US $129
Ryzen 3	4100	4 (8)	3.8	4.0	4 MB	65 W	1 × 4	Apr 4, 2022	US $99

Desktop APUs

Initially only provided to OEM; later, AMD released retail Zen 2 desktop APUs in April 2022.⁵⁴ Common features of Ryzen 4000 desktop APUs:

Socket: AM4.
All the CPUs support DDR4-3200 in dual-channel mode.
L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
L2 cache: 512 KB per core.
All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
Includes integrated GCN 5th generation GPU.
Fabrication process: TSMC 7FF.

Branding and model		CPU					GPU				TDP	Releasedate	Releaseprice
		Cores(threads)	Clock rate (GHz)		L3 cache(total)	CoreConfig⁵⁵	Model	Clock(GHz)	Config⁵⁶	Processingpower⁵⁷(GFLOPS)
		Cores(threads)	Base	Boost	L3 cache(total)	CoreConfig⁵⁵	Model	Clock(GHz)	Config⁵⁶	Processingpower⁵⁷(GFLOPS)
Ryzen 7	4700G ⁵⁸	8 (16)	3.6	4.4	8 MB	2 × 4	RadeonGraphics⁵⁹	2.1	512:32:168 CU	2150.4	65 W	Jul 21, 2020	OEM
Ryzen 7	4700GE ⁶⁰	8 (16)	3.1	4.3		2 × 4		2.0	512:32:168 CU	2048	35 W	Jul 21, 2020	OEM
Ryzen 5	4600G ⁶¹ ⁶²	6 (12)	3.7	4.2		2 × 3		1.9	448:28:147 CU	1702.4	65 W	Jul 21, 2020(OEM) /Apr 4, 2022(retail)	OEM /US $154
Ryzen 5	4600GE ⁶³	6 (12)	3.3	4.2		2 × 3		1.9	448:28:147 CU	1702.4	35 W	Jul 21, 2020	OEM
Ryzen 3	4300G ⁶⁴	4 (8)	3.8	4.0	4 MB	1 × 4		1.7	384:24:126 CU	1305.6	65 W
Ryzen 3	4300GE ⁶⁵	4 (8)	3.5	4.0	4 MB	1 × 4		1.7	384:24:126 CU	1305.6	35 W

Mobile APUs

Renoir (4000 series)

Common features of Ryzen 4000 notebook APUs:

Socket: FP6.
All the CPUs support DDR4-3200 or LPDDR4-4266 in dual-channel mode.
L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
L2 cache: 512 KB per core.
All the CPUs support 16 PCIe 3.0 lanes.
Includes integrated GCN 5th generation GPU.
Fabrication process: TSMC 7FF.

Branding and Model		CPU					GPU				TDP	Releasedate
		Cores(threads)	Clock rate (GHz)		L3 cache(total)	Coreconfig⁶⁶	Model	Clock(GHz)	Config⁶⁷	Processingpower(GFLOPS)⁶⁸
		Cores(threads)	Base	Boost	L3 cache(total)	Coreconfig⁶⁶	Model	Clock(GHz)	Config⁶⁷	Processingpower(GFLOPS)⁶⁸
Ryzen 9	4900H	8 (16)	3.3	4.4	8 MB	2 × 4	RadeonGraphics⁶⁹	1.75	512:32:88 CU	1792	35–54 W	Mar 16, 2020
Ryzen 9	4900HS		3.0	4.3				1.75	512:32:88 CU	1792	35 W
Ryzen 7	4800H ⁷⁰		2.9	4.2				1.6	448:28:87 CU	1433.6	35–54 W
	4800HS		2.9	4.2				1.6	448:28:87 CU	1433.6	35 W
	4980U ⁷¹		2.0	4.4				1.95	512:32:88 CU	1996.8	10–25 W	Apr 13, 2021
	4800U		1.8	4.2				1.75	512:32:88 CU	1792		Mar 16, 2020
	4700U ⁷²	8 (8)	2.0	4.1				1.6	448:28:87 CU	1433.6
Ryzen 5	4600H ⁷³	6 (12)	3.0	4.0		2 × 3		1.5	384:24:86 CU	1152	35–54 W
	4600HS⁷⁴		3.0						384:24:86 CU	1152	35 W
	4680U ⁷⁵		2.1						448:28:87 CU	1344	10–25 W	Apr 13, 2021
	4600U ⁷⁶		2.1						384:24:86 CU	1152		Mar 16, 2020
	4500U	6 (6)	2.3						384:24:86 CU	1152
Ryzen 3	4300U ⁷⁷	4 (4)	2.7	3.7	4 MB	1 × 4		1.4	320:20:85 CU	896

Lucienne (5000 series)

Common features of Ryzen 5000 notebook APUs:

Socket: FP6.
All the CPUs support DDR4-3200 or LPDDR4-4266 in dual-channel mode.
L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
L2 cache: 512 KB per core.
All the CPUs support 16 PCIe 3.0 lanes.
Includes integrated GCN 5th generation GPU.
Fabrication process: TSMC 7FF.

Branding and Model		CPU					GPU				TDP	Releasedate
		Cores(threads)	Clock rate (GHz)		L3 cache(total)	Coreconfig⁷⁸	Model	Clock(GHz)	Config⁷⁹	Processingpower(GFLOPS)⁸⁰
		Cores(threads)	Base	Boost	L3 cache(total)	Coreconfig⁷⁸	Model	Clock(GHz)	Config⁷⁹	Processingpower(GFLOPS)⁸⁰
Ryzen 7	5700U	8 (16)	1.8	4.3	8 MB	2 × 4	RadeonGraphics⁸¹	1.9	512:32:88 CU	1945.6	10–25 W	Jan 12, 2021
Ryzen 5	5500U ⁸²	6 (12)	2.1	4.0	8 MB	2 × 3		1.8	448:28:87 CU	1612.8
Ryzen 3	5300U	4 (8)	2.6	3.8	4 MB	1 × 4		1.5	384:24:86 CU	1152

Ultra-mobile APUs

In 2022, AMD announced the Mendocino ultra-mobile APUs.⁸³

Common features of Ryzen 7020 notebook APUs:

Socket: FT6
All the CPUs support LPDDR5-5500 in dual-channel mode.
L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
L2 cache: 512 KB per core.
All the CPUs support 4 PCIe 3.0 lanes.
Native USB 4 (40Gbps) Ports: 0
Native USB 3.2 Gen 2 (10Gbps) Ports: 1
Includes integrated RDNA 2 GPU.
Fabrication process: TSMC N6 FinFET.

Branding and Model		CPU					GPU			TDP	Releasedate
		Cores(threads)	Clock rate (GHz)		L3 cache(total)	Coreconfig⁸⁴	Model	Clock(GHz)	Processingpower⁸⁵(GFLOPS)
		Cores(threads)	Base	Boost	L3 cache(total)	Coreconfig⁸⁴	Model	Clock(GHz)	Processingpower⁸⁵(GFLOPS)
Ryzen 5	7520U ⁸⁶	4 (8)	2.8	4.3	4 MB	1 × 4	610M2 CU	1.9	486.4	15 W	September 20, 2022⁸⁷
Ryzen 3	7320U ⁸⁸	4 (8)	2.4	4.1	4 MB	1 × 4	610M2 CU	1.9	486.4	15 W	September 20, 2022⁸⁷

Embedded APUs

Model	Releasedate	Fab	CPU						GPU				Socket	PCIesupport	Memorysupport	TDP
			Cores(threads)	Clock rate (GHz)		Cache			Archi-tecture	Config⁸⁹	Clock(GHz)	Processingpower⁹⁰(GFLOPS)
			Cores(threads)	Base	Boost	L1	L2	L3	Archi-tecture	Config⁸⁹	Clock(GHz)	Processingpower⁹⁰(GFLOPS)
V2516 ⁹¹	November 10, 2020⁹²	TSMC7FF	6 (12)	2.1	3.95	32 KB inst.32 KB dataper core	512 KBper core	8 MB	GCN 5	384:24:86 CU	1.5	1152	FP6	20(8+4+4+4)PCIe 3.0	DDR4-3200dual-channelLPDDR4X-4266quad-channel	10–25 W
V2546 ⁹³			6 (12)	3.0	3.95					384:24:86 CU	1.5	1152				35–54 W
V2718 ⁹⁴			8 (16)	1.7	4.15					448:28:87 CU	1.6	1433.6				10–25 W
V2748 ⁹⁵			8 (16)	2.9	4.25					448:28:87 CU	1.6	1433.6				35–54 W

Server CPUs

Common features:

SP3 socket
Zen 2 microarchitecture
TSMC 7 nm process for the compute dies, GloFo 14 nm process for the I/O die
MCM with one I/O Die (IOD) and multiple Core Complex Dies (CCD) for compute, two core complexes (CCX) per CCD chiplet
Eight-channel DDR4-3200
128 PCIe 4.0 lanes per socket, 64 of which are used for Infinity Fabric inter-processor links in 2P platforms
7002P series models are limited to uniprocessor operation (1P)

Model	Cores(threads)	Chiplets	Coreconfig⁹⁶	Clock rate		Cache			Socket	Scaling	TDP	Releasedate	Releaseprice
Model	Cores(threads)	Chiplets	Coreconfig⁹⁶	Base(GHz)	Boost(GHz)	L2per core	L3per CCX	Total	Socket	Scaling	TDP	Releasedate	Releaseprice
7232P	8 (16)	2 + IOD	4 × 2	3.1	3.2	512 KB	8 MB	36 MB	SP3	1P	120 W	Aug 7, 2019	$450
7252		2 + IOD	4 × 2	3.1	3.2		16 MB	68 MB		2P	120 W		$475
7262		4 + IOD	8 × 1	3.2	3.4			132 MB			155 W		$575
7F32		4 + IOD	8 × 1	3.7	3.9			132 MB			180 W	Apr 14, 2020⁹⁷	$2100
7272	12 (24)	2 + IOD	4 × 3	2.9	3.2		16 MB	70 MB		2P	120 W	Aug 7, 2019	$625
7282	16 (32)	2 + IOD	4 × 4	2.8	3.2		16 MB	72 MB		2P	120 W	Aug 7, 2019	$650
7302(P)		4 + IOD	8 × 2	3.0	3.3			136 MB		2P (1P)	155 W	Aug 7, 2019	$978 ($825)
7F52		8 + IOD	16 × 1	3.5	3.9			264 MB		2P	240 W	Apr 14, 2020⁹⁸	$3100
7352	24 (48)	4 + IOD	8 × 3	2.3	3.2		16 MB	140 MB		2P	155 W	Aug 7, 2019	$1350
7402(P)		4 + IOD	8 × 3	2.8	3.35			140 MB		2P (1P)	180 W	Aug 7, 2019	$1783 ($1250)
7F72		6 + IOD	12 × 2	3.2	3.7			204 MB		2P	240 W	Apr 14, 2020⁹⁹	$2450
7452	32 (64)	4 + IOD	8 × 4	2.35	3.35		16 MB	144 MB		2P	155 W	Aug 7, 2019	$2025
7502(P)				2.5	3.35					2P (1P)	180 W		$2600 ($2300)
7542				2.9	3.4					2P	225 W		$3400
7532		8 + IOD	16 × 2	2.4	3.3			272 MB		2P	200 W		$3350
7552	48 (96)	6 + IOD	12 × 4	2.2	3.3		16 MB	216 MB		2P	200 W	Aug 7, 2019	$4025
7642	48 (96)	8 + IOD	16 × 3	2.3	3.3		16 MB	280 MB		2P	225 W	Aug 7, 2019	$4775
7662	64 (128)	8 + IOD	16 × 4	2.0	3.3		16 MB	288 MB		2P	225 W	Aug 7, 2019	$6150
7702(P)				2.0	3.35					2P (1P)	200 W		$6450 ($4425)
7742				2.25	3.4					2P	225 W		$6950
7H12				2.6	3.3					2P	280 W	Sep 18, 2019	---

Video game consoles and other embedded

Gallery

References

Cutress, Ian (9 January 2019). "AMD Ryzen third Gen 'Matisse' Coming Mid 2019: Eight Core Zen 2 with PCIe 4.0 on Desktop". AnandTech. Retrieved 15 January 2019. https://www.anandtech.com/show/13829/amd-ryzen-3rd-generation-zen-2-pcie-4-eight-core ↩
online, heise (27 May 2019). "AMD Ryzen 3000: 12-Kernprozessoren für den Mainstream". c't Magazin. https://www.heise.de/newsticker/meldung/AMD-Ryzen-3000-12-Kernprozessoren-fuer-den-Mainstream-4432392.html ↩
Leather, Antony (7 July 2019). "AMD Ryzen 9 3900X and Ryzen 7 3700X Review: Old Ryzen Owners Look Away Now". Forbes. Retrieved 13 April 2023. https://www.forbes.com/sites/antonyleather/2019/07/07/amd-ryzen-9-3900x-and-ryzen-7-3700x-review-old-ryzen-owners-look-away-now/ ↩
Ridley, Jacob (27 May 2019). "AMD Ryzen 3000 CPUs launching July 7 with up to 12 cores". PCGamesN. Retrieved 28 May 2019. https://www.pcgamesn.com/amd/amd-ryzen-3000-announcement ↩
"2nd Gen AMD EPYC Processors Set New Standard for the Modern Datacenter with Record-Breaking Performance and Significant TCO Savings". AMD. 7 August 2019. Retrieved 8 August 2019. https://www.amd.com/en/press-releases/2019-08-07-2nd-gen-amd-epyc-processors-set-new-standard-for-the-modern-datacenter ↩
Leather, Antony (7 July 2019). "AMD Ryzen 9 3900X and Ryzen 7 3700X Review: Old Ryzen Owners Look Away Now". Forbes. Retrieved 13 April 2023. https://www.forbes.com/sites/antonyleather/2019/07/07/amd-ryzen-9-3900x-and-ryzen-7-3700x-review-old-ryzen-owners-look-away-now/ ↩
Cutress, Ian (9 January 2019). "AMD Ryzen third Gen 'Matisse' Coming Mid 2019: Eight Core Zen 2 with PCIe 4.0 on Desktop". AnandTech. Retrieved 15 January 2019. https://www.anandtech.com/show/13829/amd-ryzen-3rd-generation-zen-2-pcie-4-eight-core ↩
Hachman, Mark (9 January 2019). "AMD's CEO Lisa Su confirms ray tracing GPU development, hints at more 3rd-gen Ryzen cores". PCWorld. Retrieved 15 January 2019. https://www.pcworld.com/article/3332205/amd/amd-ceo-lisa-su-interview-ryzen-raytracing-radeon.html ↩
Curtress, Ian (26 May 2019). "AMD Ryzen 3000 Announced: Five CPUs, 12 Cores for $499, Up to 4.6 GHz, PCIe 4.0, Coming 7/7". AnandTech. Retrieved 3 July 2019. https://www.anandtech.com/show/14407/amd-ryzen-3000-announced-five-cpus-12-cores-for-499-up-to-46-ghz-pcie-40-coming-77.html ↩
Thomas, Bill (10 June 2019). "AMD announces the Ryzen 9 3950X, a 16-core mainstream processor". TechRadar. Retrieved 3 July 2019. https://www.techradar.com/uk/news/amd-announced-the-ryzen-9-3950x-a-16-core-mainstream-processor ↩
Alcorn, Paul (31 January 2018). "AMD Predicts Double-Digit Revenue Growth In 2018, Ramps Up GPU Production". Tom's Hardware. Retrieved 31 January 2018. http://www.tomshardware.com/news/amd-stock-financials-earnings-cpu,36430.html ↩
Shilov, Anton (6 November 2018). "AMD Unveils 'Chiplet' Design Approach: 7nm Zen 2 Cores Meet 14 nm I/O Die". AnandTech. Retrieved 13 April 2023. https://www.anandtech.com/show/13560/amd-unveils-chiplet-design-approach-7nm-zen-2-cores-meets-14-nm-io-die ↩
Cutress, Ian (10 June 2019). "AMD Zen 2 Microarchitecture Analysis: Ryzen 3000 and EPYC Rome". AnandTech. Retrieved 13 April 2023. https://www.anandtech.com/show/14525/amd-zen-2-microarchitecture-analysis-ryzen-3000-and-epyc-rome ↩
Walton, Steven (16 November 2020). "AMD Ryzen 5000 IPC Performance Tested". TechSpot. Retrieved 18 April 2021. https://www.techspot.com/article/2143-ryzen-5000-ipc-performance/ ↩
Hollister, Sean (13 November 2021). "Steam Deck: Five big things we learned from Valve's developer summit". The Verge. Retrieved 13 April 2023. https://www.theverge.com/22779252/steam-deck-things-we-learned-from-valve-developer-summit ↩
"Steam Deck :: Tech Specs". https://www.steamdeck.com/tech ↩
Warren, Tom (24 February 2020). "Microsoft reveals more Xbox Series X specs, confirms 12 teraflops GPU". The Verge. Retrieved 24 February 2020. https://www.theverge.com/2020/2/24/21150578/microsoft-xbox-series-x-specs-performance-12-teraflops-gpu-details-features ↩
Leadbetter, Richard (18 March 2020). "Inside PlayStation 5: the specs and the tech that deliver Sony's next-gen vision". Eurogamer. Retrieved 18 March 2020. https://www.eurogamer.net/articles/digitalfoundry-2020-playstation-5-specs-and-tech-that-deliver-sonys-next-gen-vision ↩
Shilov, Anton (6 November 2018). "AMD Unveils 'Chiplet' Design Approach: 7nm Zen 2 Cores Meet 14 nm I/O Die". AnandTech. Retrieved 13 April 2023. https://www.anandtech.com/show/13560/amd-unveils-chiplet-design-approach-7nm-zen-2-cores-meets-14-nm-io-die ↩
Cutress, Ian (10 June 2019). "AMD Zen 2 Microarchitecture Analysis: Ryzen 3000 and EPYC Rome". AnandTech. p. 1. Retrieved 17 June 2019. https://www.anandtech.com/show/14525/amd-zen-2-microarchitecture-analysis-ryzen-3000-and-epyc-rome ↩
De Gelas, Johan (7 August 2019). "AMD Rome Second Generation EPYC Review: 2x 64-core Benchmarked". AnandTech. Retrieved 29 September 2019. https://www.anandtech.com/show/14694/amd-rome-epyc-2nd-gen/2 ↩
Cutress, Ian (10 June 2019). "AMD Zen 2 Microarchitecture Analysis: Ryzen 3000 and EPYC Rome". AnandTech. p. 1. Retrieved 17 June 2019. https://www.anandtech.com/show/14525/amd-zen-2-microarchitecture-analysis-ryzen-3000-and-epyc-rome ↩
November 2019, Paul Alcorn 21 (21 November 2019). "AMD Ryzen 9 3900X and Ryzen 7 3700X Review: Zen 2 and 7nm Unleashed". Tom's Hardware.{{cite web}}: CS1 maint: numeric names: authors list (link) https://www.tomshardware.com/reviews/ryzen-9-3900x-7-3700x-review,6214.html ↩
Cutress, Ian (10 June 2019). "AMD Zen 2 Microarchitecture Analysis: Ryzen 3000 and EPYC Rome". AnandTech. Retrieved 17 June 2019. https://www.anandtech.com/show/14525/amd-zen-2-microarchitecture-analysis-ryzen-3000-and-epyc-rome/2 ↩
Cutress, Ian (10 June 2019). "AMD Zen 2 Microarchitecture Analysis: Ryzen 3000 and EPYC Rome". AnandTech. Retrieved 17 June 2019. https://www.anandtech.com/show/14525/amd-zen-2-microarchitecture-analysis-ryzen-3000-and-epyc-rome/9 ↩
Cutress, Ian (10 June 2019). "AMD Zen 2 Microarchitecture Analysis: Ryzen 3000 and EPYC Rome". AnandTech. p. 1. Retrieved 17 June 2019. https://www.anandtech.com/show/14525/amd-zen-2-microarchitecture-analysis-ryzen-3000-and-epyc-rome ↩
Schor, David (22 July 2018). "VLSI 2018: GlobalFoundries 12nm Leading-Performance, 12LP". https://fuse.wikichip.org/news/1497/vlsi-2018-globalfoundries-12nm-leading-performance-12lp/ ↩
Mujtaba, Hassan (24 December 2019). "AMD Ryzen Threadripper 3970X Is An Absolutely Efficient Monster CPU". https://wccftech.com/amd-ryzen-threadripper-3970x-32-core-efficient-monster-cpu-eco-mode-tests/ ↩
"AMD Zen 2 CPUs Come With A Few New Instructions - At Least WBNOINVD, CLWB, RDPID - Phoronix". www.phoronix.com. https://www.phoronix.com/scan.php?page=news_item&px=AMD-Zen-2-New-Instructions ↩
"GNU Binutils Adds Bits For AMD Zen 2's RDPRU + MCOMMIT Instructions - Phoronix". www.phoronix.com. https://www.phoronix.com/scan.php?page=news_item&px=GNU-Binutils-Zen-2-Bits ↩
btarunr (12 June 2019). "AMD Zen 2 has Hardware Mitigation for Spectre V4". TechPowerUp. Retrieved 18 October 2019. https://www.techpowerup.com/256478/amd-zen-2-has-hardware-mitigation-for-spectre-v4 ↩
Agner, Fog. "Surprising new feature in AMD Ryzen 3000". Agner's CPU blog. /wiki/Agner_Fog ↩
Cutress, Ian (10 June 2019). "AMD Zen 2 Microarchitecture Analysis: Ryzen 3000 and EPYC Rome". AnandTech. Retrieved 12 January 2023. https://www.anandtech.com/show/14525/amd-zen-2-microarchitecture-analysis-ryzen-3000-and-epyc-rome/9 ↩
Cutress, Ian (26 May 2019). "AMD Ryzen 3000 Announced: Five CPUs, 12 Cores for $499, Up to 4.6 GHz, PCIe 4.0, Coming 7/7". AnandTech. Retrieved 17 June 2019. https://www.anandtech.com/show/14407/amd-ryzen-3000-announced-five-cpus-12-cores-for-499-up-to-46-ghz-pcie-40-coming-77 ↩
"2nd Gen AMD EPYC Processors Set New Standard for the Modern Datacenter with Record-Breaking Performance and Significant TCO Savings". AMD. 7 August 2019. Retrieved 8 August 2019. https://www.amd.com/en/press-releases/2019-08-07-2nd-gen-amd-epyc-processors-set-new-standard-for-the-modern-datacenter ↩
A Core Complex Die contain 1-2 Core Complexes (CCXs). ↩
Core Complexes (CCXs) × cores per CCX ↩
Ryzen 9 3900X and Ryzen 9 3950X may consume over 145 W under load.[35] ↩
Model also available as PRO 3600, PRO 3700, PRO 3900, released on September 30, 2019 for OEMs. https://www.amd.com/en/product/8866 ↩
Model also available as PRO 3600, PRO 3700, PRO 3900, released on September 30, 2019 for OEMs. https://www.amd.com/en/product/8866 ↩
Ryzen 7 3700X may consume 90 W under load.[36] ↩
Model also available as PRO 3600, PRO 3700, PRO 3900, released on September 30, 2019 for OEMs. https://www.amd.com/en/product/8866 ↩
Cutress, Ian (8 October 2019). "AMD Brings Ryzen 9 3900 and Ryzen 5 3500X To Life". AnandTech. https://www.anandtech.com/show/14961/amd-brings-ryzen-9-3900-and-ryzen-5-3500x-to-life ↩
Syed, Areej (17 February 2020). "AMD Launches Ryzen 5 3500 in Japan with 6 Cores/6 Threads for 16K Yen". Hardware Times. https://www.hardwaretimes.com/amd-launches-ryzen-5-3500-in-japan-with-6-cores-6-threads-for-16k-yen/ ↩
Core Complexes (CCXs) × cores per CCX ↩
Ryzen Threadripper 3990X may consume over 490 W under load.[39] ↩
Leadbetter, Richard; Judd, Will (30 July 2023). "AMD 4800S Desktop Kit review: playing PC games on the Xbox Series X CPU". Eurogamer. Retrieved 20 September 2023. https://www.eurogamer.net/digitalfoundry-2023-amd-4800s-desktop-kit-review-play-pc-games-on-the-xbox-series-x-cpu ↩
WhyCry (31 July 2023). "AMD 4800S Desktop Kit, a PC repurposed APU from Xbox Series X has been tested". VideoCardz. Retrieved 20 September 2023. https://videocardz.com/newz/amd-4800s-desktop-kit-a-pc-repurposed-apu-from-xbox-series-x-has-been-tested ↩
Alcorn, Paul (10 October 2021). "AMD 4700S Review: Defective PlayStation 5 Chips Resurrected". Tom's Hardware. Retrieved 7 July 2023. https://www.tomshardware.com/reviews/amd-4700s-desktop-kit-review-ps5-cpu ↩
Core Complexes (CCX) × cores per CCX ↩
Leadbetter, Richard; Judd, Will (30 July 2023). "AMD 4800S Desktop Kit review: playing PC games on the Xbox Series X CPU". Eurogamer. Retrieved 20 September 2023. https://www.eurogamer.net/digitalfoundry-2023-amd-4800s-desktop-kit-review-play-pc-games-on-the-xbox-series-x-cpu ↩
WhyCry (31 July 2023). "AMD 4800S Desktop Kit, a PC repurposed APU from Xbox Series X has been tested". VideoCardz. Retrieved 20 September 2023. https://videocardz.com/newz/amd-4800s-desktop-kit-a-pc-repurposed-apu-from-xbox-series-x-has-been-tested ↩
Alcorn, Paul (10 October 2021). "AMD 4700S Review: Defective PlayStation 5 Chips Resurrected". Tom's Hardware. Retrieved 7 July 2023. https://www.tomshardware.com/reviews/amd-4700s-desktop-kit-review-ps5-cpu ↩
https://www.techpowerup.com/cpu-specs/ryzen-5-4600g.c2319 https://www.techpowerup.com/cpu-specs/ryzen-5-4600g.c2319 ↩
Core complexes (CCXs) × cores per CCX ↩
Unified shaders : Texture mapping units : Render output units and Compute units (CU) /wiki/Unified_shader_model ↩
Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single-precision_floating-point_format ↩
Model also available as PRO version as 4350GE,[45] 4350G,[46] 4650GE,[47] 4650G,[48] 4750GE,[49] 4750G,[50] released on July 21, 2020 for OEM only.[51] ↩
All of the iGPUs are branded as AMD Radeon Graphics. ↩
Model also available as PRO version as 4350GE,[45] 4350G,[46] 4650GE,[47] 4650G,[48] 4750GE,[49] 4750G,[50] released on July 21, 2020 for OEM only.[51] ↩
Model also available as PRO version as 4350GE,[45] 4350G,[46] 4650GE,[47] 4650G,[48] 4750GE,[49] 4750G,[50] released on July 21, 2020 for OEM only.[51] ↩
"AMD Spring 2022 Ryzen Desktop Processor Update Includes Six New Models Besides 5800X3D". TechPowerUp. 16 March 2022. Retrieved 8 March 2024. https://www.techpowerup.com/292954/amd-spring-2022-ryzen-desktop-processor-update-includes-six-new-models-besides-5800x3d ↩
Model also available as PRO version as 4350GE,[45] 4350G,[46] 4650GE,[47] 4650G,[48] 4750GE,[49] 4750G,[50] released on July 21, 2020 for OEM only.[51] ↩
Model also available as PRO version as 4350GE,[45] 4350G,[46] 4650GE,[47] 4650G,[48] 4750GE,[49] 4750G,[50] released on July 21, 2020 for OEM only.[51] ↩
Model also available as PRO version as 4350GE,[45] 4350G,[46] 4650GE,[47] 4650G,[48] 4750GE,[49] 4750G,[50] released on July 21, 2020 for OEM only.[51] ↩
Core Complexes (CCX) × cores per CCX ↩
Unified shaders : texture mapping units : render output units and compute units (CU) /wiki/Unified_shader_model ↩
Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single_precision_floating-point_format ↩
All of the iGPUs are branded as AMD Radeon Graphics. ↩
"AMD Ryzen 7 4800H Specs". TechPowerUp. Retrieved 17 September 2021. https://www.techpowerup.com/cpu-specs/ryzen-7-4800h.c2280 ↩
Only found on the Microsoft Surface Laptop 4. /wiki/Surface_Laptop_4 ↩
Model also available as PRO version as 4450U,[55] 4650U,[56] 4750U,[57] released May 7, 2020. ↩
"AMD Ryzen 5 4600H Specs". TechPowerUp. Retrieved 17 September 2021. https://www.techpowerup.com/cpu-specs/ryzen-5-4600h.c2283 ↩
"AMD Ryzen 5 4600HS". AMD.[dead link] https://www.amd.com/en/products/apu/amd-ryzen-5-4600HS ↩
Only found on the Microsoft Surface Laptop 4. /wiki/Surface_Laptop_4 ↩
Model also available as PRO version as 4450U,[55] 4650U,[56] 4750U,[57] released May 7, 2020. ↩
Model also available as PRO version as 4450U,[55] 4650U,[56] 4750U,[57] released May 7, 2020. ↩
Core Complexes (CCX) × cores per CCX ↩
Unified shaders : texture mapping units : render output units and compute units (CU) /wiki/Unified_shader_model ↩
Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single_precision_floating-point_format ↩
All of the iGPUs are branded as AMD Radeon Graphics. ↩
"AMD Ryzen 5 5500U Specs". TechPowerUp. Retrieved 17 September 2021. https://www.techpowerup.com/cpu-specs/ryzen-5-5500u.c2372 ↩
"AMD Details 7020 Series Ryzen and Athlon 'Mendocino' Mobile APUs". Tom's Hardware. 20 September 2022. https://www.tomshardware.com/news/amd-ryzen-athlon-7020-apu-specs-mendocino ↩
Core Complexes (CCX) × cores per CCX ↩
Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single-precision_floating-point_format ↩
Model also available as Chromebook optimized version as 7520C[61] and 7320C[62] released on May 23, 2023 ↩
"AMD Ryzen 7020 Series Processors for Mobile Bring High-End Performance and Long Battery Life to Everyday Users". 20 September 2022. Retrieved 21 September 2022. https://www.amd.com/en/press-releases/2022-09-20-amd-ryzen-7020-series-processors-for-mobile-bring-high-end-performance ↩
Model also available as Chromebook optimized version as 7520C[61] and 7320C[62] released on May 23, 2023 ↩
Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU) /wiki/Unified_shader_model ↩
Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single-precision_floating-point_format ↩
"Product Brief: AMD Ryzen Embedded V2000 Processor Family" (PDF). AMD. https://www.amd.com/system/files/documents/v2000-product-brief.pdf ↩
"AMD Unveils AMD Ryzen Embedded V2000 Processors with Enhanced Performance and Power Efficiency". AMD. https://ir.amd.com/news-events/press-releases/detail/979/amd-unveils-amd-ryzen-embedded-v2000-processors-with ↩
"Product Brief: AMD Ryzen Embedded V2000 Processor Family" (PDF). AMD. https://www.amd.com/system/files/documents/v2000-product-brief.pdf ↩
"Product Brief: AMD Ryzen Embedded V2000 Processor Family" (PDF). AMD. https://www.amd.com/system/files/documents/v2000-product-brief.pdf ↩
"Product Brief: AMD Ryzen Embedded V2000 Processor Family" (PDF). AMD. https://www.amd.com/system/files/documents/v2000-product-brief.pdf ↩
Core Complexes (CCX) × cores per CCX ↩
"New 2nd Gen AMD EPYC™ Processors Redefine Performance for Database, Commercial HPC and Hyperconverged Workloads". AMD. 14 April 2020. https://www.amd.com/en/press-releases/2020-04-14-new-2nd-gen-amd-epyc-processors-redefine-performance-for-database ↩
"New 2nd Gen AMD EPYC™ Processors Redefine Performance for Database, Commercial HPC and Hyperconverged Workloads". AMD. 14 April 2020. https://www.amd.com/en/press-releases/2020-04-14-new-2nd-gen-amd-epyc-processors-redefine-performance-for-database ↩
"New 2nd Gen AMD EPYC™ Processors Redefine Performance for Database, Commercial HPC and Hyperconverged Workloads". AMD. 14 April 2020. https://www.amd.com/en/press-releases/2020-04-14-new-2nd-gen-amd-epyc-processors-redefine-performance-for-database ↩
"AMD 4700S 8-Core Processor Desktop Kit". AMD. Retrieved 26 September 2022. https://www.amd.com/en/desktop-kits/amd-4700s ↩

Design

New features

Feature tables

CPUs

APUs

Products

Desktop CPUs

3000 series (Matisse)

4000 series (Renoir)

Desktop APUs

Mobile APUs

Renoir (4000 series)

Lucienne (5000 series)

Ultra-mobile APUs

Embedded APUs

Server CPUs

Video game consoles and other embedded

Gallery

See also

References