Menu
Home Explore People Places Arts History Plants & Animals Science Life & Culture Technology
On this page
Smart cut

Smart cut is a technological process that enables the transfer of very fine layers of crystalline silicon material onto a mechanical support. It was invented by Michel Bruel of CEA-Leti, and was protected by US patent 5374564. The application of this technological procedure is mainly in the production of silicon-on-insulator (SOI) wafer substrates.

The role of SOI is to electronically insulate a fine layer of monocrystalline silicon from the rest of the silicon wafer; an ultra-thin silicon film is transferred to a mechanical support, thereby introducing an intermediate, insulating layer. Semiconductor manufacturers can then fabricate integrated circuits on the top layer of the SOI wafers using the same processes they would use on plain silicon wafers.

The sequence of illustrations pictorially describes the process involved in fabricating SOI wafers using the smart cut technology.

Related Image Collections Add Image
We don't have any YouTube videos related to Smart cut yet.
We don't have any PDF documents related to Smart cut yet.
We don't have any Books related to Smart cut yet.
We don't have any archived web articles related to Smart cut yet.

See also

References

  1. US 5374564, Bruel, Michel, "Process for the production of thin semiconductor material films", published 20 December 1994 https://worldwide.espacenet.com/textdoc?DB=EPODOC&IDX=US5374564