Features overview

The following table shows features of AMD's processors with 3D graphics, including APUs.

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Platform			High, standard and low power														Low and ultra-low power
Codename	Server	Basic						Toronto
		Micro																Kyoto
	Desktop	Performance													Raphael	Phoenix
		Mainstream	Llano	Trinity	Richland	Kaveri	Kaveri Refresh (Godavari)	Carrizo	Bristol Ridge	Raven Ridge	Picasso	Renoir	Cezanne
		Entry
		Basic																Kabini				Dalí
	Mobile	Performance										Renoir	Cezanne	Rembrandt	Dragon Range
		Mainstream	Llano	Trinity	Richland	Kaveri		Carrizo	Bristol Ridge	Raven Ridge	Picasso	RenoirLucienne	CezanneBarceló			Phoenix
		Entry																				Dalí			Mendocino
		Basic															Desna, Ontario, Zacate	Kabini, Temash	Beema, Mullins	Carrizo-L	Stoney Ridge		Pollock
	Embedded			Trinity		Bald Eagle		Merlin Falcon,Brown Falcon		Great Horned Owl		Grey Hawk					Ontario, Zacate	Kabini	Steppe Eagle, Crowned Eagle, LX-Family		Prairie Falcon	Banded Kestrel		River Hawk
Released			Aug 2011	Oct 2012	Jun 2013	Jan 2014	2015	Jun 2015	Jun 2016	Oct 2017	Jan 2019	Mar 2020	Jan 2021	Jan 2022	Sep 2022	Jan 2023	Jan 2011	May 2013	Apr 2014	May 2015	Feb 2016	Apr 2019	Jul 2020	Jun 2022	Nov 2022
CPU microarchitecture			K10	Piledriver		Steamroller		Excavator	"Excavator+"1	Zen	Zen+	Zen 2	Zen 3	Zen 3+	Zen 4		Bobcat	Jaguar	Puma	Puma+2	"Excavator+"	Zen		Zen+	"Zen 2+"
ISA			x86-64 v1	x86-64 v2				x86-64 v3							x86-64 v4		x86-64 v1	x86-64 v2			x86-64 v3
Socket	Desktop	Performance	—												AM5	—	—
		Mainstream	—					AM4						—		—
		Entry	FM1	FM2		FM2+		FM2+3, AM4	AM4					—
		Basic	—														—	AM1	—			FP5	—
	Other		FS1	FS1+, FP2		FP3		FP4		FP5		FP6		FP7	FL1	FP7 FP7r2 FP8	FT1	FT3	FT3b		FP4	FP5	FT5	FP5	FT6
PCI Express version			2.0			3.0								4.0	5.0	4.0	2.0				3.0
CXL			—														—
Fab. (nm)			GF 32SHP(HKMG SOI)			GF 28SHP(HKMG bulk)				GF 14LPP(FinFET bulk)	GF 12LP(FinFET bulk)	TSMC N7(FinFET bulk)		TSMC N6 (FinFET bulk)	CCD: TSMC N5 (FinFET bulk)cIOD: TSMC N6(FinFET bulk)	TSMC 4nm (FinFET bulk)	TSMC N40(bulk)	TSMC N28(HKMG bulk)	GF 28SHP(HKMG bulk)			GF 14LPP(FinFET bulk)		GF 12LP(FinFET bulk)	TSMC N6 (FinFET bulk)
Die area (mm2)			228	246		245		245	250	2104		156	180	210	CCD: (2x) 70cIOD: 122	178	75 (+ 28 FCH)	107		?	125	149			~100
Min TDP (W)			35	17				12				10		15	65	35	4.5	4	3.95	10	6			12	8
Max APU TDP (W)			100			95		65						45	170	54	18	25					6	54	15
Max stock APU base clock (GHz)			3	3.8	4.1	4.1		3.7	3.8	3.6	3.7	3.8	4.0	3.3	4.7	4.3	1.75	2.2	2	2.2	3.2	2.6	1.2	3.35	2.8
Max APUs per node5			1														1
Max core dies per CPU			1												2	1	1
Max CCX per core die			1									2	1				1
Max cores per CCX			4										8				2	4			2			4
Max CPU6 cores per APU			4									8			16	8	2	4			2			4
Max threads per CPU core			1							2							1					2
Integer pipeline structure			3+3	2+2						4+2		4+2+1	1+3+3+1+2				1+1+1+1				2+2	4+2			4+2+1
i386, i486, i586, CMOV, NOPL, i686, PAE, NX bit, CMPXCHG16B, AMD-V, RVI, ABM, and 64-bit LAHF/SAHF
IOMMU7			—	v2													v1		v2
BMI1, AES-NI, CLMUL, and F16C																	—
MOVBE			—
AVIC, BMI2, RDRAND, and MWAITX/MONITORX																	—
SME8, TSME9, ADX, SHA, RDSEED, SMAP, SMEP, XSAVEC, XSAVES, XRSTORS, CLFLUSHOPT, CLZERO, and PTE Coalescing			—														—
GMET, WBNOINVD, CLWB, QOS, PQE-BW, RDPID, RDPRU, and MCOMMIT			—														—
MPK, VAES			—														—
SGX			—														—
FPUs per core			1	0.5						1							1				0.5	1
Pipes per FPU			2														2
FPU pipe width			128-bit									256-bit					80-bit	128-bit							256-bit
CPU instruction set SIMD level			SSE4a10	AVX				AVX2							AVX-512		SSSE3	AVX			AVX2
3DNow!			3DNow!+	—													—
PREFETCH/PREFETCHW
GFNI			—														—
AMX			—
FMA4, LWP, TBM, and XOP			—							—							—					—
FMA3
AMD XDNA			—														—
L1 data cache per core (KiB)			64	16				32									32
L1 data cache associativity (ways)			2	4				8									8
L1 instruction caches per core			1	0.5						1							1				0.5	1
Max APU total L1 instruction cache (KiB)			256	128		192				256					512	256	64		128		96	128
L1 instruction cache associativity (ways)			2			3				4		8					2				3	4			8
L2 caches per core			1	0.5						1							1				0.5	1
Max APU total L2 cache (MiB)			4					2				4			16		1	2			1			2
L2 cache associativity (ways)			16							8							16					8
Max on-die L3 cache per CCX (MiB)			—							4			16		32		—						4
Max 3D V-Cache per CCD (MiB)										—					64	—							—
Max total in-CCD L3 cache per APU (MiB)										4		8	16		64								4
Max. total 3D V-Cache per APU (MiB)										—					64	—							—
Max. board L3 cache per APU (MiB)										—													—
Max total L3 cache per APU (MiB)										4		8	16		128								4
APU L3 cache associativity (ways)										16													16
L3 cache scheme										Victim													Victim
Max. L4 cache			—														—
Max stock DRAM support			DDR3-1866		DDR3-2133			DDR3-2133, DDR4-2400	DDR4-2400	DDR4-2933		DDR4-3200, LPDDR4-4266		DDR5-4800, LPDDR5-6400	DDR5-5200	DDR5-5600, LPDDR5x-7500	DDR3L-1333	DDR3L-1600	DDR3L-1866		DDR3-1866, DDR4-2400	DDR4-2400	DDR4-1600	DDR4-3200	LPDDR5-5500
Max DRAM channels per APU			2														1					2	1	2
Max stock DRAM bandwidth (GB/s) per APU			29.866		34.132			38.400		46.932		68.256		102.400	83.200	120.000	10.666	12.800	14.933		19.200	38.400	12.800	51.200	88.000
GPU microarchitecture			TeraScale 2 (VLIW5)	TeraScale 3 (VLIW4)		GCN 2nd gen		GCN 3rd gen		GCN 5th gen11				RDNA 2		RDNA 3	TeraScale 2 (VLIW5)	GCN 2nd gen			GCN 3rd gen12	GCN 5th gen			RDNA 2
GPU instruction set			TeraScale instruction set			GCN instruction set								RDNA instruction set			TeraScale instruction set	GCN instruction set							RDNA instruction set
Max stock GPU base clock (MHz)			600	800	844	866		1108		1250	1400	2100		2400	400		538	600	?	847	900	1200	600	1300	1900
Max stock GPU base GFLOPS13			480	614.4	648.1	886.7		1134.5		1760	1971.2	2150.4		3686.4	102.4		86	?	?	?	345.6	460.8	230.4	1331.2	486.4
3D engine14			Up to 400:20:8	Up to 384:24:6		Up to 512:32:8				Up to 704:44:1615		Up to 512:32:8		768:48:8	128:8:4		80:8:4	128:8:4			Up to 192:12:8	Up to 192:12:4	192:12:4	Up to 512:?:?	128:?:?
			IOMMUv1			IOMMUv2											IOMMUv1		?		IOMMUv2
Video decoder			UVD 3.0			UVD 4.2		UVD 6.0		VCN 1.016		VCN 2.117	VCN 2.218	VCN 3.1		?	UVD 3.0	UVD 4.0	UVD 4.2		UVD 6.2	VCN 1.0			VCN 3.1
Video encoder			—	VCE 1.0		VCE 2.0		VCE 3.1									—	VCE 2.0			VCE 3.4
AMD Fluid Motion
GPU power saving			PowerPlay	PowerTune													PowerPlay	PowerTune19
TrueAudio			—			20							?				—
FreeSync						12												12
HDCP21			?			1.4				2.2				2.3			?	1.4				2.2			2.3
PlayReady22			—							3.0 not yet							—					3.0 not yet
Supported displays23			2–3	2–4				3		3 (desktop)4 (mobile, embedded)		4					2				3	4		4
/drm/radeon242526									—												—
/drm/amdgpu2728			—			29											—	30

Graphics API overview

The following table shows the graphics and compute APIs support across ATI/AMD GPU microarchitectures. Note that a branding series might include older generation chips.

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Chip series	Micro­architecture	Fab	Supported APIs					AMD support	Year introduced	Introduced with
			Rendering			Computing / ROCm
			Vulkan31	OpenGL32	Direct3D	HSA	OpenCL
Wonder	Fixed-pipeline33	1000 nm800 nm	—	—	—	—	—	Ended	1986	Graphics Solutions
Mach		800 nm600 nm							1991	Mach8
3D Rage		500 nm			5.0				1996	3D Rage
Rage Pro		350 nm		1.1	6.0				1997	Rage Pro
Rage 128		250 nm		1.2					1998	Rage 128 GL/VR
R100		180 nm150 nm		1.3	7.0				2000	Radeon
R200	Programmablepixel & vertexpipelines	150 nm			8.1				2001	Radeon 8500
R300		150 nm130 nm110 nm		2.034	9.011 (FL 9_2)				2002	Radeon 9700
R420		130 nm110 nm			9.0b11 (FL 9_2)				2004	Radeon X800
R520		90 nm80 nm			9.0c11 (FL 9_3)				2005	Radeon X1800
R600	TeraScale 1	80 nm65 nm		3.3	10.011 (FL 10_0)		ATI Stream		2007	Radeon HD 2900 XT
RV670		55 nm			10.111 (FL 10_1)		ATI Stream APP35			Radeon HD 3850/3870
RV770		55 nm40 nm					1.0		2008	Radeon HD 4850/4870
Evergreen	TeraScale 2	40 nm		4.5(Linux 4.2)36373839	11 (FL 11_0)		1.2		2009	Radeon HD 5850/5870
Northern Islands	TeraScale 2TeraScale 3								2010	Radeon HD 6850/6870Radeon HD 6950/6970
Southern Islands	GCN 1st gen	28 nm	1.0	4.6	11 (FL 11_1)12 (FL11_1)		1.22.0 possible		2012	Radeon HD 7950/7970
Sea Islands	GCN 2nd gen		1.2		11 (FL 12_0)12 (FL 12_0)		2.0(1.2 in MacOS, Linux)2.1 Beta in Linux ROCm2.2 possible		2013	Radeon HD 7790
Volcanic Islands	GCN 3rd gen								2014	Radeon R9 285
Arctic Islands	GCN 4th gen	28 nm14 nm	1.2 1.3 (GCN 4)					Supported	2016	Radeon RX 480
Polaris									2017	Radeon 520/530Radeon RX 530/550/570/580
Vega	GCN 5th gen	14 nm7 nm	1.3		11 (FL 12_1)12 (FL 12_1)				2017	Radeon Vega Frontier Edition
Navi	RDNA	7 nm							2019	Radeon RX 5700 (XT)
Navi 2X	RDNA 2	7 nm6 nm			11 (FL 12_1)12 (FL 12_2)				2020	Radeon RX 6800 (XT)
Navi 3X	RDNA 3	6 nm5 nm							2022	Radeon RX 7900 XT(X)

⁴⁰⁴¹⁴²

Desktop processors with 3D graphics

APU or Radeon Graphics branded

Lynx: "Llano" (2011)

• Socket FM1
• CPU: K10 (also Husky or K10.5) cores with an upgraded Stars architecture, no L3 cache
  • L1 cache: 64 KB Data per core and 64 KB Instruction cache per core
  • L2 cache: 512 KB on dual-core, 1 MB on tri- and quad-core models
  • MMX, Enhanced 3DNow!, SSE, SSE2, SSE3, SSE4a, ABM, NX bit, AMD64, Cool'n'Quiet, AMD-V
• GPU: TeraScale 2 (Evergreen); all A and E series models feature Redwood-class integrated graphics on die (BeaverCreek for the dual-core variants and WinterPark for the quad-core variants). Sempron and Athlon models exclude integrated graphics.⁴³
• List of embedded GPU's
• Support for up to four DIMMs of up to DDR3-1866 memory
• Fabrication 32 nm on GlobalFoundries SOI process; Die size: 228 mm2, with 1.178 billion transistors⁴⁴⁴⁵
• 5 GT/s UMI
• Integrated PCIe 2.0 controller
• Select models support Turbo Core technology for faster CPU operation when the thermal specification permits
• Select models support Hybrid Graphics technology to assist a discrete Radeon HD 6450, 6570, or 6670 discrete graphics card. This is similar to the Hybrid CrossFireX technology available in the AMD 700 and 800 chipset series

Model46	Released	Fab	Step.	CPU					GPU				DDR3memorysupport	TDP(W)	Box number	Part number
				Cores(threads)	Clock rate (GHz)		Cache47		Model	Config	Clock(MHz)	Processingpower(GFLOPS)48
					Base	Boost	L1	L2
Sempron X2 198	2012	32 nm SOI	LN-B0	2 (2)	2.5	—	64 KB inst.64 KB dataper core	2×512 KB	—				1600	65	SD198XOJGXBOX	SD198XOJZ22GX
Athlon II X2 221	2012				2.8										AD221XOJGXBOX	AD221XOJZ22GX
Athlon II X4 631	2012			4 (4)	2.6			4×1 MB					1866		AD631XOJGXBOX	AD631XOJZ43GX
	Aug 15, 2011													100	AD631XOJGXBOX	AD631XWNZ43GX
Athlon II X4 638	Feb 8, 2012				2.7									65	AD638XOJGXBOX	AD638XOJZ43GX
Athlon II X4 641	Feb 8, 2012				2.8									100	AD641XWNGXBOX	AD641XWNZ43GX
Athlon II X4 651	Nov 14, 2011				3.0										AD651XWNGXBOX	AD651XWNZ43GX
Athlon II X4 651K	2012														AD651KWNGXBOX	AD651KWNZ43GX
E2-3200	2011			2 (2)	2.4			2×512 KB	HD 6370D	160:8:4	443	141.7	1600	65	ED3200OJGXBOX	ED3200OJZ22GXED3200OJZ22HX
A4-3300	Sep 7, 2011				2.5				HD 6410D						AD3300OJGXBOXAD3300OJHXBOX	AD3300OJZ22GXAD3300OJZ22HX
A4-3400	Sep 7, 2011				2.7						600	192			AD3400OJGXBOXAD3400OJHXBOX	AD3400OJZ22GXAD3400OJZ22HX
A4-3420	Dec 20, 2011				2.8										—	AD3420OJZ22HX
A6-3500	Aug 17, 2011			3 (3)	2.1	2.4		3×1 MB	HD 6530D	320:16:8	443	283.5	1866		AD3500OJGXBOX	AD3500OJZ33GX
A6-3600	Aug 17, 2011			4 (4)				4×1 MB							AD3600OJGXBOX	AD3600OJZ43GX
A6-3620	Dec 20, 2011				2.2	2.5									AD3620OJGXBOX	AD3620OJZ43GX
A6-3650	Jun 30, 2011				2.6	—								100	AD3650WNGXBOX	AD3650WNZ43GX
A6-3670K	Dec 20, 2011				2.7										AD3670WNGXBOX	AD3670WNZ43GX
A8-3800	Aug 17, 2011				2.4	2.7			HD 6550D	400:20:8	600	480		65	AD3800OJGXBOX	AD3800OJZ43GX
A8-3820	Dec 20, 2011				2.5	2.8									AD3820OJGXBOX	AD3820OJZ43GX
A8-3850	Jun 30, 2011				2.9	—								100	AD3850WNGXBOX	AD3850WNZ43GX
A8-3870K	Dec 20, 2011				3.0										AD3870WNGXBOX	AD3870WNZ43GX

Virgo: "Trinity" (2012)

• Fabrication 32 nm on GlobalFoundries SOI process
• Socket FM2
• CPU: Piledriver
  • L1 Cache: 16 KB Data per core and 64 KB Instructions per module
• GPU TeraScale 3 (VLIW4)
• Die Size: 246 mm2, 1.303 Billion transistors⁴⁹
• Support for up to four DIMMs of up to DDR3-1866 memory
• 5 GT/s UMI
• GPU (based on VLIW4 architecture) instruction support: DirectX 11, Opengl 4.2, DirectCompute, Pixel Shader 5.0, Blu-ray 3D, OpenCL 1.2, AMD Stream, UVD3
• Integrated PCIe 2.0 controller, and Turbo Core technology for faster CPU/GPU operation when the thermal specification permits
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AMD64, AMD-V, AES, CLMUL, AVX, XOP, FMA3, FMA4, F16C,⁵⁰ ABM, BMI1, TBM
• Sempron and Athlon models exclude integrated graphics
• Select models support Hybrid Graphics technology to assist a Radeon HD 7350, 7450, 7470, 7550, 7570, 7670 discrete graphics card.⁵¹⁵² However, it has been found that this does not always improve 3D accelerated graphics performance.⁵³⁵⁴

Model	Released	Fab	Step.	CPU					GPU				DDR3memorysupport	TDP(W)	Box number	Part number55
				[Modules/FPUs]Cores/threads	Clock rate (GHz)		Cache56		Model	Config	Clock(MHz)	Processingpower(GFLOPS)57
					Base	Boost	L1	L2
Sempron X2 24058		32 nm	TN-A1	[1]2	2.9	3.3	64 KB inst.per module16 KB dataper core	1 MB	—				1600	65		SD240XOKA23HJ
Athlon X2 34059	Oct 2012				3.2	3.6										AD340XOKA23HJ
Athlon X4 730	Oct 1, 2012			[2]4	2.8	3.2		2×2 MB					1866			AD730XOKA44HJ
Athlon X4 740	Oct 2012				3.2	3.7									AD740XOKHJBOX	AD740XOKA44HJ
Athlon X4 750K					3.4	4.0								100	AD750KWOHJBOX	AD750KWOA44HJ
FirePro A300	Aug 7, 2012				3.4	4.0			FirePro	384:24:86 CU	760	583.6		65		AWA300OKA44HJ
FirePro A320					3.8	4.2					800	614.4		100		AWA320WOA44HJ
A4-5300	Oct 1, 2012			[1]2	3.4	3.6		1 MB	HD 7480D	128:8:42 CU	723	185	1600	65	AD5300OKHJBOX	AD5300OKA23HJ
A4-5300B	Oct 2012															AD530BOKA23HJ
A6-5400K	Oct 1, 2012				3.6	3.8			HD 7540D	192:12:43 CU	760	291.8	1866		AD540KOKHJBOX	AD540KOKA23HJ
A6-5400B	Oct 2012															AD540BOKA23HJ
A8-5500	Oct 1, 2012			[2]4	3.2	3.7		2×2 MB	HD 7560D	256:16:84 CU	760	389.1			AD5500OKHJBOX	AD5500OKA44HJ
A8-5500B	Oct 2012															AD550BOKA44HJ
A8-5600K	Oct 1, 2012				3.6	3.9								100	AD560KWOHJBOX	AD560KWOA44HJ
A10-5700					3.4	4.0			HD 7660D	384:24:86 CU	760	583.6		65	AD5700OKHJBOX	AD5700OKA44HJ
A10-5800K					3.8	4.2					800	614.4		100	AD580KWOHJBOX	AD580KWOA44HJ
A10-5800B	Oct 2012															AD580BWOA44HJ

"Richland" (2013)

• Fabrication 32 nm on GlobalFoundries SOI process
• Socket FM2
• Two or four CPU cores based on the Piledriver microarchitecture
  • Die Size: 246 mm2, 1.303 Billion transistors⁶⁰
  • L1 Cache: 16 KB Data per core and 64 KB Instructions per module
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AMD64, AMD-V, AES, AVX, AVX1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM, Turbo Core 3.0, NX bit, PowerNow!
• GPU
  • TeraScale 3 architecture
  • HD Media Accelerator, AMD Hybrid Graphics

Model	Released	Fab	Step.	CPU					GPU				DDR3memorysupport	TDP(W)	Box number	Part number
				[Modules/FPUs]Cores/threads	Clock rate (GHz)		Cache61		Model	Config	Clock(MHz)	Processingpower(GFLOPS)62
					Base	Boost	L1	L2
Sempron X2 25063		32 nm	RL-A1	[1]2	3.2	3.6	64 KB inst.per module16 KB dataper core	1 MB	—					65		SD250XOKA23HL
Athlon X2 35064					3.5	3.9							1866			AD350XOKA23HL
Athlon X2 370K	Jun 2013				4.0	4.2									AD370KOKHLBOX	AD370KOKA23HL
Athlon X4 750	Oct 2013			[2]4	3.4	4.0		2×2 MB								AD750XOKA44HL
Athlon X4 760K	Jun 2013				3.8	4.1								100	AD760KWOHLBOX	AD760KWOA44HL
FX-670K65	Mar 2014 (OEM)				3.7	4.3								65		FD670KOKA44HL
A4-4000	May 2013			[1]2	3.0	3.2		1 MB	HD 7480D	128:8:42 CU	720	184.3	1333		AD4000OKHLBOX	AD4000OKA23HL
A4-4020	Jan 2014				3.2	3.4									AD4020OKHLBOX	AD4020OKA23HL
A4-6300	Jul 2013				3.7	3.9			HD 8370D		760	194.5	1600		AD6300OKHLBOX	AD6300OKA23HL
A4-6300B																AD630BOKA23HL
A4-6320	Dec 2013				3.8	4.0									AD6320OKHLBOX	AD6320OKA23HL
A4-6320B	Mar 2014															AD632BOKA23HL
A4-7300	Aug 2014								HD 8470D	192:12:43 CU	800	307.2				AD7300OKA23HL
A4 Pro-7300B																AD730BOKA23HL
A6-6400B	Jun 4, 2013				3.9	4.1							1866			AD640BOKA23HL
A6-6400K															AD640KOKHLBOX	AD640KOKA23HL
A6-6420B	Jan 2014				4.0	4.2										AD642BOKA23HL
A6-6420K															AD642KOKHLBOX	AD642KOKA23HL
A8-6500T	Sep 18, 2013			[2]4	2.1	3.1		2×2 MB	HD 8550D	256:16:84 CU	720	368.6		45	AD650TYHHLBOX	AD650TYHA44HL
A8-6500	Jun 4, 2013				3.5	4.1			HD 8570D		800	409.6		65	AD6500OKHLBOX	AD6500OKA44HL
A8-6500B																AD650BOKA44HL
A8-6600K					3.9	4.2					844	432.1		100	AD660KWOHLBOX	AD660KWOA44HL
A10-6700T	Sep 18, 2013				2.5	3.5			HD 8650D	384:24:86 CU	720	552.9		45	AD670TYHHLBOX	AD670TYHA44HL
A10-6700	Jun 4, 2013				3.7	4.3			HD 8670D		844	648.1		65	AD6700OKHLBOX	AD6700OKA44HL
A10-6790B	Oct 29, 2013				4.0									100	AD679KWOHLBOX	AD679KWOA44HL
A10-6790K	Oct 28, 2013															AD679BWOA44HL
A10-6800K	Jun 4, 2013				4.1	4.4							2133		AD680KWOHLBOX	AD680KWOA44HL
A10-6800B																AD680BWOA44HL

"Kabini" (2013, SoC)

• Fabrication 28 nm by GlobalFoundries
• Socket AM1, aka Socket FS1b (AM1 platform)
• 2 to 4 CPU Cores (Jaguar (microarchitecture))
• L1 Cache: 32 KB Data per core and 32 KB Instructions per core
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AMD64, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
• SoC with integrated memory, PCIe, 2× USB 3.0, 6× USB 2.0, Gigabit Ethernet, and 2× SATA III (6 Gb/s) controllers
• GPU based on Graphics Core Next (GCN)

Model	Released	Fab	Step.	CPU					GPU				DDR3memorysupport	TDP(W)	Box number	Part number
				Cores(threads)	Clock rate (GHz)		Cache66		Model	Config	Clock(MHz)	Processingpower(GFLOPS)67
					Base	Boost	L1	L2
Athlon X4 530		28 nm	KB-A1	4 (4)	2.00	—	32 KB inst.32 KB dataper core	2 MB	—				1600single-channel	25		AD530XJAH44HM
Athlon X4 550					2.20											AD550XJAH44HM
Sempron 2650	Apr 9, 2014			2 (2)	1.45			1 MB	R3 (HD 8240)	128:8:42 CU	400	102.4	1333single-channel		SD2650JAHMBOX	SD2650JAH23HM
Sempron 3850				4 (4)	1.30			2 MB	R3 (HD 8280)		450	115.2	1600single-channel		SD3850JAHMBOX	SD3850JAH44HM
Athlon 5150					1.60				R3 (HD 8400)		600	153.6			AD5150JAHMBOX	AD5150JAH44HM
Athlon 5350					2.05										AD5350JAHMBOX	AD5350JAH44HM
Athlon 5370	Feb 2016				2.20											AD5370JAH44HM

"Kaveri" (2014) & "Godavari" (2015)

• Fabrication 28 nm by GlobalFoundries.
• Socket FM2+,⁶⁸ support for PCIe 3.0.
• Two or four CPU cores based on the Steamroller microarchitecture.
  • Kaveri refresh models have codename Godavari.⁶⁹
• Die Size: 245 mm2, 2.41 Billion transistors.⁷⁰
• L1 Cache: 16 KB Data per core and 96 KB Instructions per module.
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM, Turbo Core
• Three to eight Compute Units (CUs) based on GCN 2nd gen microarchitecture;⁷¹ 1 Compute Unit (CU) consists of 64 Unified Shader Processors : 4 Texture Mapping Units (TMUs) : 1 Render Output Unit (ROPs).
• Heterogeneous System Architecture-enabled zero-copy through pointer passing.
• SIP blocks: Unified Video Decoder, Video Coding Engine, TrueAudio.⁷²
• Dual-channel (2× 64 Bit) DDR3 memory controller.
• Integrated custom ARM Cortex-A5 co-processor⁷³ with TrustZone Security Extensions⁷⁴ in select APU models, except the Performance APU models.⁷⁵
• Select models support Hybrid Graphics technology by using a Radeon R7 240 or R7 250 discrete graphics card.⁷⁶
• Display controller: AMD Eyefinity 2, 4K Ultra HD support, DisplayPort 1.2 Support.⁷⁷

Model	Released	Fab	Step.	CPU					GPU				DDR3memorysupport	TDP(W)	Box number	Part number
				[Modules/FPUs]Cores/threads	Clock rate (GHz)		Cache78		Model	Config	Clock(MHz)	Processingpower(GFLOPS)79
					Base	Boost	L1	L2
Athlon X2 45080	Jul 31, 2014	28 nm	KV-A1	[1]2	3.5	3.9	96 KB inst.per module16 KB dataper core	1 MB	—				1866	65		AD450XYBI23JA
Athlon X4 830	2018			[2]4	3.0	3.4		2×2 MB					2133			AD830XYBI44JA
Athlon X4 84081	Aug 2014				3.1	3.8									AD840XYBJABOX	AD840XYBI44JA
Athlon X4 850	2015		GV-A1		3.2											AD835XACI43KA
Athlon X4 860K	Aug 2014		KV-A1		3.7	4.0								95	AD860KXBJABOXAD860KWOHLBOXAD860KXBJASBX	AD860KXBI44JA
Athlon X4 870K	Dec 2015		GV-A1		3.9	4.1									AD870KXBJCSBX	AD870KXBI44JC
Athlon X4 880K	Mar 1, 2016				4.0	4.2									AD880KXBJCSBX
FX-770K82	Dec 2014		KV-A1		3.5	3.9								65		FD770KYBI44JA
A4 Pro-7350B	Jul 31, 2014			[1]2	3.4	3.8		1 MB	R5	192:12:83 CU	514	197.3	1866			AD735BYBI23JA
Pro A4-8350B	Sep 29, 2015				3.5	3.9				256:16:84 CU	757	387.5				AD835BYBI23JC
A6-7400K	Jul 31, 2014				3.5	3.9					756	387			AD740KYBJABOX	AD740KYBI23JA
A6 Pro-7400B																AD740BYBI23JA
A6-7470K	Feb 2, 2016		GV-A1		3.7	4.0					800	409.6	2133		AD747KYBJCBOX	AD747KYBI23JC
Pro A6-8550B	Sep 29, 2015															AD855BYBI23JC
A8-75008384	2014		KV-A1	[2]4	3.0	3.7		2×2 MB	R7	384:24:8 6 CU	720	552.9				AD7500YBI44JA
A8-7600	Jul 31, 2014				3.1	3.8									AD7600YBJABOX	AD7600YBI44JA
A8 Pro-7600B																AD760BYBI44JA
A8-7650K	Jan 7, 2015				3.3									95	AD765KXBJABOXAD765KXBJASBX	AD765KXBI44JA
A8-7670K	Jul 20, 2015		GV-A1		3.6	3.9					757	581.3			AD767KXBJCSBXAD767KXBJCBOX	AD767KXBI44JC
Pro A8-8650B	Sep 29, 2015				3.2									65		AD865BYBI44JC
A10-7700K	Jan 14, 2014		KV-A1		3.4	3.8					720	552.9		95	AD770KXBJABOX	AD770KXBI44JA
A10-7800	Jul 31, 2014				3.5	3.9				512:32:88 CU		737.2		65	AD7800YBJABOX	AD7800YBI44JA
A10 Pro-7800B																AD780BYBI44JA
A10-7850K	Jan 14, 2014				3.7	4.0								95	AD785KXBJABOX	AD785KXBI44JA
A10 Pro-7850B	Jul 31, 2014															AD785BXBI44JA
A10-7860K	Feb 2, 2016		GV-A1		3.6						757	775.1		65	AD786KYBJABOXAD786KYBJCSBX	AD786KYBI44JC
A10-7870K	May 28, 2015				3.9	4.1					866	886.7		95	AD787KXDJCBOXAD787KXDJCSBX	AD787KXDI44JC
A10-7890K	Mar 1, 2016				4.1	4.3									AD789KXDJCHBX	AD789KXDI44JC
Pro A10-8750B	Sep 29, 2015				3.6	4.0					757	775.1		65		AD875BYBI44JC
Pro A10-8850B					3.9	4.1					800	819.2		95		AD885BXBI44JC
Model	Released	Fab	Step.	[Modules/FPUs]Cores/threads	Base	Boost	L1	L2	Model	Config	Clock(MHz)	Processingpower(GFLOPS)85	DDR3memorysupport	TDP(W)	Box number	Part number
					Clock rate (GHz)		Cache86
				CPU					GPU

"Carrizo" (2016)

• Fabrication: 28 nm by GlobalFoundries
• Socket FM2+ or AM4, support for PCIe 3.0
• Two or four CPU cores based on the Excavator microarchitecture
• Die size: 250.04 mm2, 3.1 billion transistors⁸⁷
• L1 cache: 32 KB data per core and 96 KB instructions per module
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND, Turbo Core
• Single- or dual-channel DDR3 or DDR4 memory controller
• Third generation GCN-based GPU (Radeon M300)
• Integrated custom ARM Cortex-A5 coprocessor⁸⁸ with TrustZone security extensions⁸⁹⁹⁰

Model	Released	Fab	Step.	Socket	CPU					GPU				Memorysupport	TDP(W)	Box number91	Part number
					[Modules/FPUs]Cores/threads	Clock rate (GHz)		Cache92		Model	Config	Clock(MHz)	Processingpower(GFLOPS)93
						Base	Boost	L1	L2
Athlon X4 835		28 nm	CZ-A1	FM2+	[2]4	3.1		96 KB inst.per module32 KB dataper core	2×1 MB	—				DDR3-2133	65		AD835XACI43KA
Athlon X4 845	Feb 2, 2016					3.5	3.8									AD845XYBJCSBXAD845XACKASBX	AD845XACI43KA
A6-748094	Oct 2018				[1]2				1 MB	R5	384:24:86 CU	900	691.2			AD7480ACABBOX	AD7480ACI23AB
A8-768095					[2]4				2×1 MB	R7						AD7680ACABBOX	AD7680ACI43AB
Pro A6-8570E	Oct 2016			AM4	[1]2	3.0	3.4		1 MB	R5	256:16:44 CU	800	409.6	DDR4-2400	35		AD857BAHM23AB
Pro A6-8570						3.5	3.8				384:24:66 CU	1029	790.2		65		AD857BAGM23AB
Pro A10-8770E					[2]4	2.8	3.5		2×1 MB	R7		847	650.4		35		AD877BAHM44AB
Pro A10-8770						3.5	3.8					1029	790.2		65		AD877BAGM44AB
Pro A12-8870E						2.9					512:32:88 CU	900	921.6		35		AD887BAHM44AB
Pro A12-8870						3.7	4.2					1108	1134.5		65		AD887BAUM44AB

"Bristol Ridge" (2016)

• Fabrication 28 nm by GlobalFoundries
• Socket AM4, support for PCIe 3.0
• Two or four "Excavator+" CPU cores
• L1 Cache: 32 KB Data per core and 96 KB Instructions per module
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND, Turbo Core
• Dual-channel DDR4 memory controller
• PCI Express 3.0 x8 (No Bifurcation support, requires a PCI-e switch for any configuration other than x8)
• PCI Express 3.0 x4 as link to optional external chipset
• 4x USB 3.1 Gen 1
• Storage: 2x SATA and 2x NVMe or 2x PCI Express
• Third Generation GCN based GPU⁹⁶ with hybrid VP9 decoding

Model	Released	Fab	Step.	CPU					GPU				DDR4memorysupport	TDP(W)	Box number97	Part number
				[Modules/FPUs]Cores/threads	Clock rate (GHz)		Cache98		Model	Config	Clock(MHz)	Processingpower(GFLOPS)99
					Base	Boost	L1	L2
Athlon X4 940100	Jul 27, 2017	28 nm	BR-A1	[2]4	3.2	3.6	96 KB inst.per module32 KB dataper core	2×1 MB	—				2400	65	AD940XAGABBOX	AD940XAGM44AB
Athlon X4 950101					3.5	3.8									AD950XAGABBOX	AD950XAGM44AB
Athlon X4 970102					3.8	4.0									AD970XAUABBOX	AD970XAUM44AB
A6-9400103	Mar 16, 2019			[1]2	3.4	3.7		1 MB	R5	192:12:43 CU	720	276.4			AD9400AGABBOX	AD9400AGM23AB
A6-9500E104	Sep 5, 2016				3.0	3.4				256:16:44 CU	800	409.6		35	AD9500AHABBOX	AD9500AHM23AB
Pro A6-9500E105	Oct 3, 2016															AD950BAHM23AB
A6-9500106	Sep 5, 2016				3.5	3.8				384:24:66 CU	1029	790.2		65	AD9500AGABBOX	AD9500AGM23AB
Pro A6-9500107	Oct 3, 2016															AD950BAGM23AB
A6-9550108	Jul 27, 2017				3.8	4.0				256:16:44 CU	800	409.6			AD9550AGABBOX	AD9550AGM23AB
A8-9600109	Sep 5, 2016			[2]4	3.1	3.4		2×1 MB	R7	384:24:66 CU	900	691.2			AD9600AGABBOX	AD9600AGM44AB
Pro A8-9600110	Oct 3, 2016															AD960BAGM44AB
A10-9700E111	Sep 5, 2016				3.0	3.5					847	650.4		35	AD9700AHABBOX	AD9700AHM44AB
Pro A10-9700E112	Oct 3, 2016															AD970BAHM44AB
A10-9700113	Sep 5, 2016				3.5	3.8					1029	790.2		65	AD9700AGABBOX	AD9700AGM44AB
Pro A10-9700114	Oct 3, 2016															AD970BAGM44AB
A12-9800E115	Sep 5, 2016				3.1	3.8				512:32:81168 CU	900	921.6		35	AD9800AHABBOX	AD9800AUM44AB
Pro A12-9800E117	Oct 3, 2016															AD980BAHM44AB
A12-9800118	Sep 5, 2016				3.8	4.2					1108	1134.5		65	AD9800AUABBOX	AD9800AUM44AB
Pro A12-9800119	Oct 3, 2016															AD980BAUM44AB

"Raven Ridge" (2018)

Main article: Ryzen

• Fabrication 14 nm by GlobalFoundries
• Transistors: 4.94 billion
• Die size: 210 mm²
• Socket AM4
• Zen CPU cores
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
• Dual-channel DDR4 memory controller
• Fifth generation GCN based GPU
• Video Core Next (VCN) 1.0

Common features of Zen based Raven Ridge desktop APUs:

• Socket: AM4.
• All the CPUs support DDR4-2666 (DDR4-2933 Ryzen) in dual-channel mode.
• L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
• L2 cache: 512 KB per core.
• All the CPUs support 16 PCIe 3.0 lanes.
• Includes integrated GCN 5th generation GPU.
• Fabrication process: GlobalFoundries 14LP.

Model	CPU				GPU				TDP	Releasedate	Releaseprice
	Cores(threads)	Clock rate (GHz)		L3 cache(total)	Model	Config120	Clock(MHz)	Processingpower(GFLOPS)121
		Base	Boost
Athlon 200GE	2 (4)	3.2	—	4 MB	Vega 3	192:12:43 CU	1000	384	35 W	Sep 6, 2018	US $55122
Athlon Pro 200GE											OEM
Athlon 220GE		3.4								Dec 21, 2018	US $65123
Athlon 240GE		3.5									US $75124
Athlon 300GE		3.4					1100	424.4		Jul 7, 2019	OEM
Athlon Pro 300GE										Sep 30, 2019
Athlon 320GE		3.5								Jul 7, 2019
Athlon 3000G										Nov 19, 2019	US $49125
Athlon Silver 3050GE		3.4								Jul 21, 2020	OEM
Ryzen 3 Pro 2100GE126		3.2					1000	384		2019
Ryzen 3 2200GE	4 (4)		3.6		Vega 8	512:32:168 CU	1100	1126		Apr 19, 2018
Ryzen 3 Pro 2200GE										May 10, 2018
Ryzen 3 2200G		3.5	3.7						65 W	Feb 12, 2018	US $99127
Ryzen 3 Pro 2200G										May 10, 2018	OEM
Ryzen 5 2400GE	4 (8)	3.2	3.8		RX Vega 11	704:44:1611 CU	1250	1760	35 W	Apr 19, 2018
Ryzen 5 Pro 2400GE					Vega 11					May 10, 2018
Ryzen 5 2400G		3.6	3.9		RX Vega 11				65 W	Feb 12, 2018	US $169128
Ryzen 5 Pro 2400G					Vega 11					May 10, 2018	OEM

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"Picasso" (2019)

Main article: Ryzen

• Fabrication 12 nm by GlobalFoundries
• Transistors: 4.94 billion
• Die size: 210 mm²
• Socket AM4
• Zen+ CPU cores
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
• Dual-channel DDR4 memory controller
• Fifth generation GCN based GPU
• Video Core Next (VCN) 1.0

Common features of Zen+ based desktop APUs:

• Socket: AM4.
• All the CPUs support DDR4-2933 in dual-channel mode, while Athlon Pro 300GE and Athlon Silver Pro 3125GE support only DDR4-2666.
• L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
• L2 cache: 512 KB per core.
• All the CPUs support 16 PCIe 3.0 lanes.
• Includes integrated GCN 5th generation GPU.
• Fabrication process: GlobalFoundries 12LP.

Model	CPU				GPU				TDP	Releasedate	Releaseprice
	Cores(threads)	Clock rate (GHz)		L3 cache(total)	Model129	Config130	Clock(MHz)	Processingpower(GFLOPS)131
		Base	Boost
Athlon Pro 300GE	2 (4)	3.4	—	4 MB	Vega 3	192:12:43 CU	1100	424.4	35 W	Sep 30, 2019	OEM
Athlon Silver Pro 3125GE					RadeonGraphics					Jul 21, 2020
Athlon Gold 3150GE	4 (4)	3.3	3.8
Athlon Gold Pro 3150GE
Athlon Gold 3150G		3.5	3.9						65 W
Athlon Gold Pro 3150G
Ryzen 3 3200GE		3.3	3.8		Vega 8	512:32:168 CU	1200	1228.8	35 W	Jul 7, 2019
Ryzen 3 Pro 3200GE										Sep 30, 2019
Ryzen 3 3200G		3.6	4.0				1250	1280	65 W	Jul 7, 2019	US $99132
Ryzen 3 Pro 3200G										Sep 30, 2019	OEM
Ryzen 5 Pro 3350GE		3.3	3.9		RadeonGraphics	640:40:1610 CU	1200	1536	35 W	Jul 21, 2020
Ryzen 5 Pro 3350G	4 (8)	3.6	4.0				1300	1830.4	65 W
Ryzen 5 3400GE		3.3			Vega 11	704:44:1611 CU			35 W	Jul 7, 2019
Ryzen 5 Pro 3400GE										Sep 30, 2019
Ryzen 5 3400G		3.7	4.2		RX Vega 11		1400	1971.2	65 W	Jul 7, 2019	US $149133
Ryzen 5 Pro 3400G					Vega 11					Sep 30, 2019	OEM

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"Renoir" (2020)

Main article: Ryzen

• Fabrication 7 nm by TSMC
• Socket AM4
• Up to eight Zen 2 CPU cores
• Dual-channel DDR4 memory controller

Common features of Ryzen 4000 desktop APUs:

• Socket: AM4.
• All the CPUs support DDR4-3200 in dual-channel mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 512 KB per core.
• All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
• Includes integrated GCN 5th generation GPU.
• Fabrication process: TSMC 7FF.

Branding and model		CPU					GPU				TDP	Releasedate	Releaseprice
		Cores(threads)	Clock rate (GHz)		L3 cache(total)	CoreConfig134	Model	Clock(GHz)	Config135	Processingpower136(GFLOPS)
			Base	Boost
Ryzen 7	4700G137	8 (16)	3.6	4.4	8 MB	2 × 4	RadeonGraphics138	2.1	512:32:168 CU	2150.4	65 W	Jul 21, 2020	OEM
	4700GE139		3.1	4.3				2.0		2048	35 W
Ryzen 5	4600G140141	6 (12)	3.7	4.2		2 × 3		1.9	448:28:147 CU	1702.4	65 W	Jul 21, 2020(OEM) /Apr 4, 2022(retail)	OEM /US $154
	4600GE142		3.3								35 W	Jul 21, 2020	OEM
Ryzen 3	4300G143	4 (8)	3.8	4.0	4 MB	1 × 4		1.7	384:24:126 CU	1305.6	65 W
	4300GE144		3.5								35 W

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"Cezanne" (2021)

Main article: Ryzen

• Fabrication 7 nm by TSMC
• Socket AM4
• Up to eight Zen 3 CPU cores
• Dual-channel DDR4 memory controller

Common features of Ryzen 5000 desktop APUs:

• Socket: AM4.
• All the CPUs support DDR4-3200 in dual-channel mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 512 KB per core.
• All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
• Includes integrated GCN 5th generation GPU.
• Fabrication process: TSMC 7FF.

Branding and model		CPU					GPU145			Thermalsolution	TDP	Releasedate	MSRP
		Cores(threads)	Clock rate (GHz)		L3 cache(total)	Coreconfig146	Clock(MHz)	Config147	Processingpower148(GFLOPS)
			Base	Boost
Ryzen 7	5705G	8 (16)	3.8	4.6	16 MB	1 × 8	2000	512:32:88 CU	2048	—	65 W
	5700G149									Wraith Stealth		Apr 13, 2021 (OEM),Aug 5, 2021 (retail)	US $359
	5705GE		3.2							—	35 W
	5700GE150									Wraith Stealth		Apr 13, 2021	OEM
Ryzen 5	5600GT	6 (12)	3.6			1 × 6	1900	448:28:87 CU	1702.4		65 W	Jan 31, 2024151	US $140
	5605G		3.9	4.4						—
	5600G152									Wraith Stealth		Apr 13, 2021 (OEM),Aug 5, 2021 (retail)	US $259
	5605GE		3.4							—	35 W
	5600GE153									Wraith Stealth		Apr 13, 2021	OEM
	5500GT		3.6								65 W	Jan 31, 2024154	US $125
Ryzen 3	5305G	4 (8)	4.0	4.2	8 MB	1 × 4	1700	384:24:86 CU	1305.6	—
	5300G155									OEM		Apr 13, 2021	OEM
	5305GE		3.6							—	35 W
	5300GE156									OEM		Apr 13, 2021	OEM

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Non APU or Radeon Graphics branded

"Raphael" (2022)

Main article: Ryzen

• Fabrication 5 nm (CCD) and 6 nm (cIOD) by TSMC
• Socket AM5
• Up to sixteen Zen 4 CPU cores
• Dual-channel DDR5 memory controller

• Basic iGPU

Common features of Ryzen 7000 desktop CPUs:

• Socket: AM5.
• All the CPUs support DDR5-5200 in dual-channel mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 1 MB per core.
• All the CPUs support 28 PCIe 5.0 lanes. 4 of the lanes are reserved as link to the chipset.
• Includes integrated RDNA 2 GPU on the I/O die with 2 CUs and clock speeds of 400 MHz (base), 2.2 GHz (boost).¹⁵⁷ Models with "F" suffixes are without iGPUs.
• Fabrication process: TSMC N5 FinFET (N6 FinFET for the I/O die).

Branding and model		Cores(threads)	Clock rate (GHz)		L3 cache(total)	Thermalsolution	Chiplets	Coreconfig158	TDP	Releasedate	MSRP
			Base	Boost
Ryzen 9	7950X3D	16 (32)	4.2	5.7	128 MB159	—	2 × CCD1 × I/OD	2 × 8	120 W	Feb 28, 2023	US $699
	7950X		4.5		64 MB				170 W	Sep 27, 2022
	7900X3D	12 (24)	4.4	5.6	128 MB160			2 × 6	120 W	Feb 28, 2023	US $599
	7900X		4.7		64 MB				170 W	Sep 27, 2022	US $549
	7900		3.7	5.4		Wraith Prism			65 W	Jan 10, 2023	US $429161
	PRO 7945					Wraith Spire				Jun 13, 2023	OEM
Ryzen 7	7800X3D	8 (16)	4.2	5.0	96 MB	—	1 × CCD1 × I/OD	1 × 8	120 W	Apr 6, 2023	US $449
	7700X		4.5	5.4	32 MB				105 W	Sep 27, 2022	US $399
	7700		3.8	5.3		Wraith Prism			65 W	Jan 10, 2023	US $329162
	PRO 7745					Wraith Spire				Jun 13, 2023	OEM
Ryzen 5	7600X3D163164	6 (12)	4.1	4.7	96 MB	—		1 × 6		Aug 31, 2024165	US $299
	7600X		4.7	5.3	32 MB				105 W	Sep 27, 2022
	7600		3.8	5.1		Wraith Stealth			65 W	Jan 10, 2023	US $229166
	PRO 7645					Wraith Spire				Jun 13, 2023	OEM
	7500F		3.7	5.0		Wraith Stealth				Jul 22, 2023	US $179167
	7400F			4.7						Jan 9, 2025

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"Phoenix" (2024)

Common features of Ryzen 8000G desktop APUs:

• Socket: AM5.
• All the CPUs support DDR5-5200 RAM in dual-channel mode in 2x1R and 2x2R configuration, but only DDR5-3600 for 4x1R and 4x2R.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 1 MB per core.
• Models with Zen 4c cores (codenamed Phoenix 2) support 14 PCIe 4.0 lanes, while models without them support 20 lanes. 4 of the lanes are reserved as link to the chipset.
• Includes integrated RDNA 3 GPU.
• Includes XDNA AI Engine (Ryzen AI) on models without Zen 4c cores.
• Fabrication process: TSMC 4 nm FinFET.

Brandingand model		CPU							GPU			NPU	Thermalsolution	TDP	Releasedate	MSRP
		Cores (threads)			Clock rate (GHz)		L3 cache(total)	Coreconfig168	Model	Coreconfig169170	Clock(GHz)
		Total	Zen 4	Zen 4c	Base	Boost
Ryzen 7	8700G171	8 (16)	8 (16)	—	4.2	5.1	16 MB	1 × 8	780M	12 CUs768:48:24:12	2.9	Ryzen AIUp to 16 TOPS	Wraith Spire	65 W	Jan 31, 2024172	US $329
	PRO 8700GE				3.6						2.7		—	35 W	Apr 16, 2024	US $299
Ryzen 5	8600G173	6 (12)	6 (12)		4.3	5.0		1 × 6	760M	8 CUs512:32:16:8	2.8		Wraith Stealth	65 W	Jan 31, 2024174	US $229
	PRO 8600GE				3.9						2.6		—	35 W	Apr 16, 2024	??
	8500G175		2 (4)	4 (8)	4.1 / 3.2176	5.0 / 3.7177		2 + 4	740M	4 CUs256:16:8:4	2.8	No	Wraith Stealth	65 W	Jan 31, 2024	US $179
	8500GE178				3.9 / 3.1179								—	35 W	Apr 16, 2024	??
Ryzen 3	8300G180	4 (8)	1 (2)	3 (6)	4.0 / 3.2181	4.9 / 3.6182	8 MB	1 + 3			2.6		Wraith Stealth	65 W	Jan 2024 (OEM) /Q1 2024 (retail)	OEM /TBA
	8300GE183												—	35 W	Apr 16, 2024	??

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Server APUs

Opteron X2100-series "Kyoto" (2013) & "Steppe Eagle" (2016)

• Fabrication 28 nm
• Socket FT3 (BGA)
• 4 CPU Cores (Jaguar & Puma microarchitecture)
• L1 Cache: 32 KB Data per core and 32 KB Instructions per core
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
• Single-channel DDR3 memory controller
• Turbo Dock Technology, C6 and CC6 low power states
• GPU based on 2nd generation Graphics Core Next (GCN) architecture

Model	Released	Fab	Step.	CPU				GPU				DDR3memorysupport	TDP(W)	Part number	Releaseprice(USD)
				Cores(threads)	Clock(GHz)	Cache184		Model	Config	Clock(MHz)	Processingpower(GFLOPS)185
						L1	L2
X1150186	May 29, 2013187	28 nm		4 (4)	2.0	32 KB inst.32 KB dataper core	2 MB	—				1600	9–17	OX1150IPJ44HM	$64
X2150					1.9			R3 (HD 8400)	128:8:42 CU	266–600	28.9		11–22	OX2150IAJ44HM	$99
X2170	Sep 1, 2016				2.4			R5		655–800	153.6	1866	11–25	OX2170IXJ44JB

Opteron X3000-series "Toronto" (2017)

• Fabrication 28 nm
• Socket FP4 (BGA)
• Two or Four CPU cores based on the Excavator microarchitecture¹⁸⁸¹⁸⁹
• L1 Cache: 32 KB Data per core and 96 KB Instructions per module
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND
• Dual-channel DDR4 memory controller
• GPU based on 3rd generation Graphics Core Next (GCN) architecture

Model	Released	Fab	Step.	CPU					GPU				DDR4memorysupport	TDP(W)	Part number	Releaseprice(USD)
				[Modules/FPUs]Cores/threads	Clock rate (GHz)		Cache190		Model	Config	Clock(MHz)	Processingpower(GFLOPS)191
					Base	Boost	L1	L2
X3216192193	June 2017	28 nm	01h	[1]2	1.6	3.0	96 KB inst.per module32 KB dataper core	1 MB	R5	256:16:44 CU	800	409.6	1600	12–15	OX3216AAY23KA	OEM for HP
X3418194195				[2]4	1.8	3.2		2 MB	R6	384:24:66 CU		614.4	2400	12–35	OX3418AAY43KA
X3421196197	June 2017				2.1	3.4			R7	512:32:88 CU		819.2			OX3421AAY43KA

Mobile processors with 3D graphics

APU or Radeon Graphics branded

Sabine: "Llano" (2011)

• Fabrication 32 nm on GlobalFoundries SOI process
• Socket FS1
• Upgraded Stars (AMD 10h architecture) codenamed Husky CPU cores (K10.5) with no L3 cache, and with Redwood-class integrated graphics on die
• L1 Cache: 64 KB Data per core and 64 KB Instructions per core(BeaverCreek for the dual-core variants and WinterPark for the quad-core variants)
• Integrated PCIe 2.0 controller
• GPU: TeraScale 2
• Select models support Turbo Core technology for faster CPU operation when the thermal specification permits
• Support for 1.35 V DDR3L-1333 memory, in addition to regular 1.5 V DDR3 memory specified
• 2.5 GT/s UMI
• MMX, Enhanced 3DNow!, SSE, SSE2, SSE3, SSE4a, ABM, NX bit, AMD64, AMD-V
• PowerNow!

Model	Released	Fab	Step.	CPU						GPU				DDR3 Memorysupport	TDP (W)	Part number
				Cores(threads)	Clock (GHz)	Turbo (GHz)	Cache198			Model	Config	Clock (MHz)	GFLOPS199
							L1	L2	L3
E2-3000M	2011 6/14	32 nm	B0	2 (2)	1.8	2.4	64 KB inst.64 KB dataper core	2× 512KB	—	HD 6380G	160:8:4	400	128	1333	35	EM3000DDX22GX
A4-3300M	2011 6/14				1.9	2.5		2× 1MB		HD 6480G	240:12:4	444	213.1		35	AM3300DDX23GX
A4-3305M	December 7, 2011							2× 512KB			160:8:4	593	189.7			AM3305DDX22GX
A4-3310MX	2011 6/14				2.1			2× 1MB			240:12:4	444	213.1		45	AM3310HLX23GX
A4-3320M	December 7, 2011				2.0	2.6									35	AM3320DDX23GX
A4-3330MX					2.2										45	AM3330HLX23GX
A4-3330MX					2.3			2× 512KB			160:8:4	593	189.7			AM3330HLX23HX
A6-3400M	2011 6/14			4 (4)	1.4	2.3		4× 1MB		HD 6520G	320:16:8	400	256		35	AM3400DDX43GX
A6-3410MX					1.6									1600	45	AM3410HLX43GX
A6-3420M	December 7, 2011				1.5	2.4								1333	35	AM3420DDX43GX
A6-3430MX					1.7									1600	45	AM3430HLX43GX
A8-3500M	2011 6/14				1.5	2.4				HD 6620G	400:20:8	444	355.2	1333	35	AM3500DDX43GX
A8-3510MX					1.8	2.5								1600	45	AM3510HLX43GX
A8-3520M	December 7, 2011				1.6									1333	35	AM3520DDX43GX
A8-3530MX	2011 6/14				1.9	2.6								1600	45	AM3530HLX43GX
A8-3550MX	December 7, 2011				2.0	2.7										AM3550HLX43GX

Comal: "Trinity" (2012)

• Fabrication 32 nm on GlobalFoundries SOI process
• Socket FS1r2, FP2
• Based on the Piledriver architecture
• L1 Cache: 16 KB Data per core and 64 KB Instructions per module
• GPU: TeraScale 3 (VLIW4)
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM, Turbo Core
• Memory support: 1.35 V DDR3L-1600 memory, in addition to regular 1.5 V DDR3 memory specified (Dual-channel)
• 2.5 GT/s UMI
• Transistors: 1.303 billion
• Die size: 246 mm²

Model number	Released	Fab	Step.	Socket	CPU					GPU					DDR3 Memorysupport	TDP (W)	Part number
					[Modules/FPUs] Cores/threads	Clock (GHz)	Turbo (GHz)	Cache200		Model	Config201	Clock (MHz)	Turbo (MHz)	GFLOPS202
								L1	L2 (MB)
A4-4355M	September 27, 2012	32 nm	TN-A1	FP2	[1]2	1.9	2.4	64 KB inst.per module16 KB dataper core	1	HD 7400G	192:12:43 CU	327	424	125.5	1333	17	AM4355SHE23HJ
A6-4455M	May 15, 2012					2.1	2.8		2	HD 7500G	256:16:8 4 CU			167.4			AM4455SHE24HJ
A8-4555M	September 27, 2012				[2]4	1.6	2.4		2× 2MB	HD 7600G	384:24:86 CU	320		245.7		19	AM4555SHE44HJ
A8-4557M203	Mar 2013					1.9	2.8			HD 7000	256:16:84 CU	497	655	254.4	(L)1600	35	AM4557DFE44HJ
A10-4655M	May 15, 2012					2.0	2.8			HD 7620G	384:24:86 CU	360	496	276.4	1333	25	AM4655SIE44HJ
A10-4657M204	Mar 2013					2.3	3.2			HD 7000		497	686	381.6	(L)1600	35	AM4657DFE44HJ
A4-4300M	May 15, 2012			FS1r2	[1]2	2.5	3.0		1	HD 7420G	128:8:42 CU	480	655	122.8	1600		AM4300DEC23HJ
A6-4400M						2.7	3.2			HD 7520G	192:12:43 CU	496	685	190.4			AM4400DEC23HJ
A8-4500M					[2]4	1.9	2.8		2× 2MB	HD 7640G	256:16:84 CU			253.9			AM4500DEC44HJ
A10-4600M						2.3	3.2			HD 7660G	384:24:86 CU			380.9			AM4600DEC44HJ

"Richland" (2013)

• Fabrication 32 nm on GlobalFoundries SOI process
• Socket FS1r2, FP2
• Elite Performance APU.²⁰⁵²⁰⁶
• CPU: Piledriver architecture
  • L1 Cache: 16 KB Data per core and 64 KB Instructions per module
• GPU: TeraScale 3 (VLIW4)
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM, Turbo Core

Model number	Released	Fab	Step.	Socket	CPU					GPU					DDR3 Memorysupport	TDP (W)	Part number
					[Modules/FPUs] Cores/threads	Clock (GHz)	Turbo (GHz)	Cache207		Model	Config208	Clock (MHz)	Turbo (MHz)	GFLOPS209
								L1	L2 (MB)
A4-5145M	2013/5	32 nm	RL-A1	FP2	[1]2	2.0	2.6	64 KB inst.per module16 KB dataper core	1	HD 8310G	128:8:42 CU	424	554	108.5	(L)1333	17	AM5145SIE44HL
A6-5345M						2.2	2.8			HD 8410G	192:12:43 CU	450	600	172.8			AM5345SIE44HL
A8-5545M					[2]4	1.7	2.7		4	HD 8510G	384:28:86 CU		554	345.6		19	AM5545SIE44HL
A10-5745M						2.1	2.9			HD 8610G		533	626	409.3		25	AM5745SIE44HL
A4-5150M	2013 Q1			FS1r2	[1]2	2.7	3.3		1	HD 8350G	128:8:42 CU	533	720	136.4	1600	35	AM5150DEC23HL
A6-5350M						2.9	3.5			HD 8450G	192:12:43 CU			204.6			AM5350DEC23HL
A6-5357M	2013/5			FP2											(L)1600		AM5357DFE23HL
A8-5550M	2013 Q1			FS1r2	[2]4	2.1	3.1		4	HD 8550G	256:16:84 CU	515		263.6	1600		AM5550DEC44HL
A8-5557M	2013/5			FP2								554		283.6	(L)1600		AM5557DFE44HL
A10-5750M	2013 Q1			FS1r2		2.5	3.5			HD 8650G	384:24:86 CU	533		409.3	1866		AM5750DEC44HL
A10-5757M	2013/5			FP2								600		460.8	(L)1600		AM5757DFE44HL

"Kaveri" (2014)

• Fabrication 28 nm
• Socket FP3
• Up to 4 Steamroller x86 CPU cores with 4 MB of L2 cache.²¹⁰
• L1 Cache: 16 KB Data per core and 96 KB Instructions per module
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM, Turbo Core
• Three to eight Compute Units (CUs) based on Graphics Core Next (GCN)²¹¹ microarchitecture; 1 Compute Unit (CU) consists of 64 Unified Shader Processors : 4 Texture Mapping Units (TMUs) : 1 Render Output Unit (ROPs)
• AMD Heterogeneous System Architecture (HSA) 2.0
• SIP blocks: Unified Video Decoder, Video Coding Engine, TrueAudio²¹²
• Dual-channel (2x64-bit) DDR3 memory controller
• Integrated custom ARM Cortex-A5 co-processor²¹³ with TrustZone Security Extensions²¹⁴

Model number	Released	Fab	CPU					GPU					DDR3 Memorysupport	TDP (W)	Part number
			[Modules/FPUs] Cores/threads	Clock (GHz)	Turbo (GHz)	Cache215		Model	Config	Clock (MHz)	Turbo (MHz)	GFLOPS216
						L1	L2 (MB)
A6-7000	June 2014	28 nm	[1]2	2.2	3.0	96 KB inst.per module16 KB dataper core	1	R4	192:12:33 CU	494	533	189.6	1333	17	AM7000ECH23JA
A6 PRO - 7050B										533	—	204.6	1600		AM705BECH23JA
A8-7100			[2]4	1.8	3.0		2× 2 MB	R5	256:16:44 CU	450	514	230.4	1600	20	AM7100ECH44JA
A8 PRO - 7150B				1.9	3.2					553	—	283.1			AM715BECH44JA
A10-7300								R6	384:24:86 CU	464	533	356.3			AM7300ECH44JA
A10 PRO - 7350B				2.1	3.3					533	—	424.7			AM735BECH44JA
FX-7500								R7		498	553	382.4			FM7500ECH44JA
A8-7200P				2.4	3.3			R5	256:16:44 CU	553	626	283.1	1866	35	AM740PDGH44JA
A10-7400P				2.5	3.4			R6	384:24:86 CU	576	654	442.3			AM740PDGH44JA
FX-7600P				2.7	3.6			R7	512:32:88 CU	600	686	614.4	2133		FM760PDGH44JA

"Carrizo" (2015)

• Fabrication 28 nm
• Socket FP4
• Up to 4 Excavator x86 CPU cores
• L1 Cache: 32 KB Data per core and 96 KB Instructions per module
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND, Turbo Core
• GPU based on Graphics Core Next 1.2

Model number	Released	Fab	CPU					GPU				DDR Memorysupport	TDP (W)	Part number
			[Modules/FPUs] Cores/threads	Clock (GHz)	Turbo (GHz)	Cache217		Model	Config	Clock (MHz)	GFLOPS218
						L1	L2 (MB)
A6-8500P	June 2015	28 nm	[1]2	1.6	3.0	96 KB inst.per module32 KB dataper core	1	R5	256:16:44 CU	800	409.6	3)1600	12- 35	AM850PAAY23KA
PRO A6-8500B														AM850BAAY23KA
PRO A6-8530B	Q3 2016			2.3	3.2							4)1866		AM853BADY23AB
A8-8600P	June 2015		[2]4	1.6	3.0		2× 1MB	R6	384:24:86 CU	720	552.9	3)2133		AM860PAAY43KA
PRO A8-8600B														AM860BAAY43KA
A10-8700P				1.8	3.2					800	614.4			AM870PAAY43KA
PRO A10-8700B														AM870BAAY43KA
PRO A10-8730B	Q3 2016			2.4	3.3			R5		720	552.9	4)1866		AM873BADY44AB
A10-8780P	December 2015			2.0	3.3			R8	512:32:88 CU			3)?		AM878PAIY43KA
FX-8800P	June 2015			2.1	3.4			R7		800	819.2	4)2133		FM880PAAY43KA
PRO A12-8800B														FM880BAAY43KA
PRO A12-8830B	Q3 2016			2.5	3.4				384:24:86 CU	758	582.1	4)1866		AM883BADY44AB

"Bristol Ridge" (2016)

• Fabrication 28 nm
• Socket FP4²¹⁹
• Two or four "Excavator+" x86 CPU cores
• L1 Cache: 32 KB Data per core and 96 KB Instructions per module
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND, Turbo Core
• GPU based on Graphics Core Next 1.2 with VP9 decoding

Model number	Released	Fab	CPU					GPU				DDR4 Memorysupport	TDP (W)	Part number
			[Modules/FPUs] Cores/threads	Clock (GHz)	Turbo (GHz)	Cache220		Model	Config	Clock (MHz)	GFLOPS221
						L1	L2 (MB)
Pro A6-9500B	October 24, 2016	28nm	[1]2	2.3	3.2	96 KB inst.per module32 KB dataper core	1	R5	256:16:44 CU	800	409.6	1866	12- 15
Pro A8-9600B	October 24, 2016		[2]4	2.4	3.3		2× 1 MB	R5	384:24:66 CU	720	552.9	1866	12– 15
A10-9600P	June 2016													AM960PADY44AB
A10-9620P222	2017 (OEM)			2.5	3.4					758	582.1
Pro A10-9700B	October 24, 2016							R7
A12-9700P	June 2016													AM970PADY44AB
Pro A8-9630B	October 24, 2016			2.6	3.3			R5		800	614.4	2400	25– 45
A10-9630P	June 2016													AM963PAEY44AB
Pro A10-9730B	October 24, 2016			2.8	3.5			R7		900	691.2
A12-9730P	June 2016													AM973PAEY44AB
Pro A12-9800B	October 24, 2016			2.7	3.6			R7	512:32:88 CU	758	776.1	1866	12– 15
[1] FX-9800PA12-9720P223224	June 20162017 (OEM)													FM980PADY44AB?
Pro A12-9830B	October 24, 2016			3.0	3.7					900	921.6	2400	25– 45
FX-9830P	June 2016													FM983PAEY44AB

"Raven Ridge" (2017)

Main article: Ryzen

• Fabrication 14 nm by GlobalFoundries
• Transistors: 4.94 billion
• Socket FP5
• Die size: 210 mm²
• Zen CPU cores
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
• Fifth generation GCN-based GPU

Model	Releasedate	Fab	CPU						GPU				Socket	PCIelanes	Memorysupport	TDP
			Cores(threads)	Clock rate (GHz)		Cache			Model	Config225	Clock(MHz)	Processingpower(GFLOPS)226
				Base	Boost	L1	L2	L3
Athlon Pro 200U	2019	GloFo14LP	2 (4)	2.3	3.2	64 KB inst.32 KB dataper core	512 KBper core	4 MB	Radeon Vega 3	192:12:43 CU	1000	384	FP5	12 (8+4)	DDR4-2400dual-channel	12–25 W
Athlon 300U	Jan 6, 2019			2.4	3.3
Ryzen 3 2200U	Jan 8, 2018			2.5	3.4						1100	422.4
Ryzen 3 3200U	Jan 6, 2019			2.6	3.5						1200	460.8
Ryzen 3 2300U	Jan 8, 2018		4 (4)	2.0	3.4				Radeon Vega 6	384:24:86 CU	1100	844.8
Ryzen 3 Pro 2300U	May 15, 2018
Ryzen 5 2500U	Oct 26, 2017		4 (8)		3.6				Radeon Vega 8	512:32:168 CU		1126.4
Ryzen 5 Pro 2500U	May 15, 2018
Ryzen 5 2600H	Sep 10, 2018			3.2											DDR4-3200dual-channel	35–54 W
Ryzen 7 2700U	Oct 26, 2017			2.2	3.8				Radeon RX Vega 10	640:40:1610 CU	1300	1664			DDR4-2400dual-channel	12–25 W
Ryzen 7 Pro 2700U	May 15, 2018								Radeon Vega 10
Ryzen 7 2800H	Sep 10, 2018			3.3					Radeon RX Vega 11	704:44:1611 CU		1830.4			DDR4-3200dual-channel	35–54 W

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"Picasso" (2019)

Main article: Ryzen

• Fabrication 12 nm by GlobalFoundries
• Socket FP5
• Die size: 210 mm²
• Up to four Zen+ CPU cores
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
• Dual-channel DDR4 memory controller
• Fifth generation GCN-based GPU

Common features of Ryzen 3000 notebook APUs:

• Socket: FP5.
• All the CPUs support DDR4-2400 in dual-channel mode.
• L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
• L2 cache: 512 KB per core.
• All the CPUs support 16 PCIe 3.0 lanes.
• Includes integrated GCN 5th generation GPU.
• Fabrication process: GlobalFoundries 12LP (14LP+).

Branding and Model		CPU					GPU				TDP	Releasedate
		Cores(threads)	Clock rate (GHz)		L3 cache(total)	Coreconfig227	Model	Clock(GHz)	Config228	Processingpower(GFLOPS)229
			Base	Boost
Ryzen 7	3780U230	4 (8)	2.3	4.0	4 MB	1 × 4	RX Vega 11	1.4	704:44:1611 CU	1971.2	15 W	Oct 2019
	3750H231						RX Vega 10		640:40:1610 CU232	1792.0	35 W	Jan 6, 2019
	3700C233										15 W	Sep 22, 2020
	3700U234235											Jan 6, 2019
Ryzen 5	3580U236		2.1	3.7			Vega 9	1.3	576:36:169 CU	1497.6		Oct 2019
	3550H237						Vega 8	1.2	512:32:168 CU238	1228.8	35 W	Jan 6, 2019
	3500C239										15 W	Sep 22, 2020
	3500U240241											Jan 6, 2019
	3450U242			3.5								Jun 2020
Ryzen 3	3350U243	4 (4)					Vega 6		384:24:86 CU244	921.6		Jan 6, 2019
	3300U245246

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"Renoir" (2020)

Main article: Ryzen

• Fabrication 7 nm by TSMC^247248249
• Socket FP6
• Die size: 156 mm²
• 9.8 billion transistors on one single 7 nm monolithic die²⁵⁰
• Up to eight Zen 2 CPU cores
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 512 KB per core.
• Fifth generation GCN-based GPU
• Memory support: DDR4-3200 or LPDDR4-4266 in dual-channel mode.
• All the CPUs support 16 PCIe 3.0 lanes.

U

Branding and model		CPU					GPU				TDP	Releasedate
		Cores(threads)	Clock rate (GHz)		L3 cache(total)	Coreconfig251	Model	Clock(MHz)	Config252	Processingpower(GFLOPS)253
			Base	Boost
Ryzen 7	4980U	8 (16)	2.0	4.4	8 MB	2 × 4	RadeonGraphics254	1950	512:32:88 CU	1996.8	15 W	Apr 13, 2021
	4800U		1.8	4.2				1750		1792		Mar 16, 2020
	Pro 4750U		1.7	4.1				1600	448:28:87 CU	1433.6		May 7, 2020
	4700U	8 (8)	2.0									Mar 16, 2020
Ryzen 5	4680U	6 (12)	2.1	4.0		2 × 3		1500		1344		Apr 13, 2021
	Pro 4650U								384:24:86 CU	1152		May 7, 2020
	4600U											Mar 16, 2020
	4500U	6 (6)	2.3
Ryzen 3	Pro 4450U	4 (8)	2.5	3.7	4 MB	1 × 4		1400	320:20:85 CU	896		May 7, 2020
	4300U	4 (4)	2.7									Mar 16, 2020

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H

Branding and model		CPU					GPU				TDP	Releasedate
		Cores(threads)	Clock rate (GHz)		L3 cache(total)	Coreconfig255	Model	Clock(MHz)	Config256	Processingpower(GFLOPS)257
			Base	Boost
Ryzen 9	4900H	8 (16)	3.3	4.4	8 MB	2 × 4	RadeonGraphics258	1750	512:32:88 CU	1792	45 W	Mar 16, 2020
	4900HS		3.0	4.3							35 W
Ryzen 7	4800H		2.9	4.2				1600	448:28:87 CU	1433.6	45 W
	4800HS
Ryzen 5	4600H	6 (12)	3.0	4.0		2 × 3		1500	384:24:86 CU	1152
	4600HS259260261										35 W

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"Lucienne" (2021)

Main article: Ryzen

• Fabrication 7 nm by TSMC
• Socket FP6
• Die size: 156 mm²
• 9.8 billion transistors on one single 7 nm monolithic die
• Up to eight Zen 2 CPU cores
• Fifth generation GCN-based GPU (7 nm Vega)

Common features of Ryzen 5000 notebook APUs:

• Socket: FP6.
• All the CPUs support DDR4-3200 or LPDDR4-4266 in dual-channel mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 512 KB per core.
• All the CPUs support 16 PCIe 3.0 lanes.
• Includes integrated GCN 5th generation GPU.
• Fabrication process: TSMC 7FF.

Branding and Model		CPU					GPU				TDP	Releasedate
		Cores(threads)	Clock rate (GHz)		L3 cache(total)	Coreconfig262	Model	Clock(GHz)	Config263	Processingpower(GFLOPS)264
			Base	Boost
Ryzen 7	5700U	8 (16)	1.8	4.3	8 MB	2 × 4	RadeonGraphics265	1.9	512:32:88 CU	1945.6	10–25 W	Jan 12, 2021
Ryzen 5	5500U266	6 (12)	2.1	4.0		2 × 3		1.8	448:28:87 CU	1612.8
Ryzen 3	5300U	4 (8)	2.6	3.8	4 MB	1 × 4		1.5	384:24:86 CU	1152

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"Cezanne" (2021)

Main article: Ryzen

• Fabrication 7 nm by TSMC
• Socket FP6
• Die size: 180 mm²
• Up to eight Zen 3 CPU cores
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 512 KB per core.
• Fifth generation GCN-based GPU
• Memory support: DDR4-3200 or LPDDR4-4266 in dual-channel mode.
• All the CPUs support 16 PCIe 3.0 lanes.

U

Branding and model		CPU					GPU				TDP	Releasedate
		Cores (Threads)	Clock rate (GHz)		L3 cache(total)	Core config267	Model	Clock (GHz)	Config268	Processingpower(GFLOPS)269
			Base	Boost
Ryzen 7	5800U270271	8 (16)	1.9	4.4	16 MB	1 × 8	RadeonGraphics272	2.0	512:32:8 8 CUs	2048	10–25 W	Jan 12, 2021
Ryzen 5	5600U273274	6 (12)	2.3	4.2		1 × 6		1.8	448:28:8 7 CUs	1612.8
	5560U275			4.0	8 MB			1.6	384:24:8 6 CUs	1228.8
Ryzen 3	5400U276277278	4 (8)	2.7	4.1		1 × 4

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1. ^ a b c d Model also available as Pro version as 5450U,²⁷⁹ 5650U,²⁸⁰ 5850U,²⁸¹ released on March 16, 2021.

H

Branding and model		CPU					GPU				TDP	Releasedate
		Cores (Threads)	Clock rate (GHz)		L3 cache(total)	Core config282	Model	Clock(GHz)	Config283	Processingpower(GFLOPS)284
			Base	Boost
Ryzen 9	5980HX285	8 (16)	3.3	4.8	16 MB	1 × 8	RadeonGraphics286	2.1	512:32:8 8 CUs	2150.4	35–54 W	Jan 12, 2021
	5980HS287		3.0								35 W
	5900HX288		3.3	4.6							35–54 W
	5900HS289		3.0								35 W
Ryzen 7	5800H290291		3.2	4.4				2.0		2048	35–54 W
	5800HS292		2.8								35 W
Ryzen 5	5600H293294	6 (12)	3.3	4.2		1 × 6		1.8	448:28:8 7 CUs	1612.8	35–54 W
	5600HS295		3.0								35 W

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"Barceló" (2022)

Main article: Ryzen

• Fabrication 7 nm by TSMC
• Socket FP6
• Die size: 180 mm²
• Up to eight Zen 3 CPU cores
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 512 KB per core.
• Fifth generation GCN-based GPU
• Memory support: DDR4-3200 or LPDDR4-4266 in dual-channel mode.
• All the CPUs support 16 PCIe 3.0 lanes.

Branding and model		CPU					GPU				TDP	Releasedate
		Cores (Threads)	Clock rate (GHz)		L3 cache(total)	Core config296	Model	Clock (GHz)	Config297	Processingpower(GFLOPS)298
			Base	Boost
Ryzen 7	5825U299300301	8 (16)	2.0	4.5	16 MB	1 × 8	RadeonGraphics302	2.0	512:32:8 8 CUs	2048	15 W	Jan 4, 2022
Ryzen 5	5625U303304305	6 (12)	2.3	4.3		1 × 6		1.8	448:28:8 7 CUs	1612.8
Ryzen 3	5125C306	2 (4)	3.0	—	8 MB	1 × 2		?	192:12:83 CU	?		May 5, 2022

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1. ^ a b c Model also available as Pro version as 5475U,³⁰⁷ 5675U,³⁰⁸ 5875U,³⁰⁹ released on April 19, 2022.
2. ^ a b c Model also available as Chromebook optimized version as 5425C,³¹⁰ 5625C,³¹¹ 5825C,³¹² released on May 5, 2022.

"Rembrandt" (2022)

Main article: Ryzen

• Fabrication 6 nm by TSMC
• Socket FP7
• Die size: 210 mm²
• Up to eight Zen 3+ CPU cores
• Second generation RDNA-based GPU

Common features of Ryzen 6000 notebook APUs:

• Socket: FP7, FP7r2.
• All the CPUs support DDR5-4800 or LPDDR5-6400 in dual-channel mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 512 KB per core.
• All the CPUs support 16 PCIe 4.0 lanes.
• Native USB 4 (40Gbps) Ports: 2
• Native USB 3.2 Gen 2 (10Gbps) Ports: 2
• Includes integrated RDNA 2 GPU.
• Fabrication process: TSMC N6 FinFET.

Branding and model		CPU					GPU				TDP	Releasedate
		Cores(threads)	Clock (GHz)		L3 cache(total)	Coreconfig313	Model	Clock(GHz)	Config314	Processingpower(GFLOPS)315
			Base	Boost
Ryzen 9	6980HX	8 (16)	3.3	5.0	16 MB	1 × 8	680M	2.4	768:48:812 CUs	3686.4	45 W	Jan 4, 2022316
	6980HS										35 W
	6900HX317			4.9							45 W
	6900HS318										35 W
Ryzen 7	6800H319		3.2	4.7				2.2		3379.2	45 W
	6800HS320										35 W
	6800U321		2.7								15–28 W
Ryzen 5	6600H322	6 (12)	3.3	4.5		1 × 6	660M	1.9	384:24:86 CUs	1459.2	45 W
	6600HS323										35 W
	6600U324		2.9								15–28 W

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"Phoenix" (2023)

Main article: Ryzen

• Fabrication 4 nm by TSMC
• Up to eight Zen 4 CPU cores
• Dual-channel DDR5 or LPDDR5x memory controller
• RDNA3 iGPU
• XDNA accelerator

"Dragon Range" (2023)

Main article: Ryzen

• Fabrication 5 nm (CCD) and 6 nm (cIOD) by TSMC
• Up to sixteen Zen 4 CPU cores
• Dual-channel DDR5 memory controller
• Basic RDNA2 iGPU

Ultra-mobile APUs

Brazos: "Desna", "Ontario", "Zacate" (2011)

• Fabrication 40 nm by TSMC
• Socket FT1 (BGA-413)
• Based on the Bobcat microarchitecture³²⁵
• L1 Cache: 32 KB Data per core and 32 KB Instructions per core
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, AMD-V
• PowerNow!
• DirectX 11 integrated graphics with UVD 3.0
• Z-series denote Desna; C-series denote Ontario; and the E-series denotes Zacate
• 2.50 GT/s UMI (PCIe 1.0 ×4)

Model	Released	Fab	Step.	CPU					GPU					DDR3 Memorysupport	TDP (W)	Part number
				Cores(threads)	Clock (GHz)	Turbo (GHz)	Cache326		Model	Config	Clock (MHz)	Turbo (MHz)	GFLOPS327
							L1	L2
Z-01	June 1, 2011	40 nm	B0	2 (2)	1.0	—	32KB inst.32KB dataper core	2× 512KB	HD 6250	80:8:4	276	—	44.1	1066	5.9	XMZ01AFVB22GV
C-30	January 4, 2011			1 (1)	1.2			512KB							9	CMC30AFPB12GT
C-50				2 (2)	1.0			2× 512KB								CMC50AFPB22GT
C-60	August 22, 2011		C0			1.33			HD 6290			400				CMC60AFPB22GV
E-240	January 4, 2011		B0	1 (1)	1.5	—		512KB	HD 6310		500	—	80	1066	18	EME240GBB12GT
E-300	August 22, 2011			2 (2)	1.3			2× 512KB			488		78			EME300GBB22GV
E-350	January 4, 2011				1.6						492		78.7			EME350GBB22GT
E-450	August 22, 2011		B0C0		1.65				HD 6320		508	600	81.2	1333		EME450GBB22GV

Brazos 2.0: "Ontario", "Zacate" (2012)

• Fabrication 40 nm by TSMC
• Socket FT1 (BGA-413)
• Based on the Bobcat microarchitecture³²⁸
• L1 Cache: 32 KB Data per core and 32 KB Instructions per core
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, AMD-V
• PowerNow!
• DirectX 11 integrated graphics
• C-series denote Ontario; and the E-series denotes Zacate
• 2.50 GT/s UMI (PCIe 1.0 ×4)

Model	Released	Fab	Step.	CPU						GPU					DDR3 Memorysupport	TDP (W)	Part number
				Cores(threads)	Clock (GHz)	Turbo (GHz)	Cache329			Model	Config	Clock (MHz)	Turbo (MHz)	GFLOPS330
							L1	L2	L3
C-70	September 15, 2012	40 nm	C0	2 (2)	1.0	1.33	32 KB inst.32 KB dataper core	2× 512KB	—	HD 7290	80:8:4	276	400	44.1	1066	9	CMC70AFPB22GV
E1-1200	June 6, 2012		C0		1.4	—				HD 7310		500	—	80	1066	18	EM1200GBB22GV
E1-1500	January 7, 2013				1.48							529		84.6
E2-1800	June 6, 2012				1.7					HD 7340		523	680	83.6	1333		EM1800GBB22GV
E2-2000	January 7, 2013				1.75							538	700	86

Brazos-T: "Hondo" (2012)

• Fabrication 40 nm by TSMC
• Socket FT1 (BGA-413)
• Based on the Bobcat microarchitecture³³¹
• L1 Cache: 32 KB Data per core and 32 KB Instructions per core
• Found in tablet computers
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, AMD-V
• PowerNow!
• DirectX 11 integrated graphics
• 2.50 GT/s UMI (PCIe 1.0 ×4)

Model	Released	Fab	Step.	CPU				GPU				DDR3Memorysupport	TDP (W)	Part number
				Cores(threads)	Clock (GHz)	Cache332		Model	Config	Clock (MHz)	GFLOPS333
						L1	L2
Z-60	October 9, 2012	40 nm	C0	2 (2)	1.0	32KB inst.32KB dataper core	2× 512 KB	HD 6250	80:8:4	276	44.1	1066	4.5	XMZ60AFVB22GV

"Kabini", "Temash" (2013)

• Fabrication 28 nm by TSMC
• Socket FT3 (BGA)
• 2 to 4 CPU Cores (Jaguar (microarchitecture))
• L1 Cache: 32 KB Data per core and 32 KB Instructions per core
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
• Turbo Dock Technology, C6 and CC6 low power states
• GPU based on Graphics Core Next (GCN)
• AMD Eyefinity multi-monitor for up to two displays

Temash, Elite Mobility APU

Model	Released	Fab	Step.	CPU					GPU				DDR3L Memorysupport	TDP (W)	Part number
				Cores(threads)	Clock (GHz)	Turbo (GHz)	Cache334		Model	Config	Clock (MHz)	Turbo (MHz)
							L1	L2 (MB)
A4-1200	May 23, 2013	28 nm	KB-A1	2 (2)	1.0	—	32 KB inst.32 KB dataper core	1	HD 8180	128:8:42 CU	225	—	1066	4	AT1200IFJ23HM
A4-1250									HD 8210		300		1333	8	AT1250IDJ23HM
A4-1350				4 (4)				2					1066		AT1350IDJ44HM
A6-1450						1.4			HD 8250			400			AT1450IDJ44HM

Kabini, Mainstream APU

Model	Released	Fab	Step.	CPU					GPU			DDR3L Memorysupport	TDP (W)	Part number
				Cores(threads)	Clock (GHz)	Cache335			Model	Config	Clock (MHz)
						L1	L2 (MB)	L3
E1-2100	May 2013	28 nm	KB-A1	2 (2)	1.0	32KB inst.32KB dataper core	1	—	HD 8210	128:8:42 CU	300	1333	9	EM2100ICJ23HM
E1-2200	Feb 2014				1.05									EM2200ICJ23HM
E1-2500	May 2013				1.4				HD 8240		400		15	EM2500IBJ23HM
E2-3000					1.65				HD 8280		450	1600		EM3000IBJ23HM
E2-3800	Feb 2014			4	1.3		2							EM3800IBJ44HM
A4-5000	May 2013				1.5				HD 8330		497			AM5000IBJ44HM
A4-5100	Feb 2014				1.55									AM5100IBJ44HM
A6-5200	May 2013				2.0				HD 8400		600		25	AM5200IAJ44HM
A4 Pro-3340B	Nov 2014				2.2				HD 8240		400			AM334BIAJ44HM

"Beema", "Mullins" (2014)

• Fabrication 28 nm by GlobalFoundries
• Socket FT3b (BGA)
• CPU: 2 to 4 (Puma cores)
  • L1 Cache: 32 KB Data per core and 32 KB Instructions per core
• GPU based on Graphics Core Next (GCN)
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
• Intelligent Turbo Boost
• Platform Security Processor, with an integrated ARM Cortex-A5 for TrustZone execution

Mullins, Tablet/2-in-1 APU

Model	Released	Fab	Step.	CPU						GPU				DDR3L Memorysupport	TDP (W)	Part number
				Cores(threads)	Clock (GHz)	Turbo (GHz)	Cache336			Model	Config	Clock (MHz)	Turbo (MHz)
							L1	L2 (MB)	L3
E1 Micro-6200T	Q2 2014	28 nm	ML-A1	2 (2)	1.0	1.4	32 KB inst.32 KB dataper core	1	—	R2	128:8:42 CU	300	600	1066	3.95	EM620TIWJ23JB
A4 Micro-6400T				4 (4)		1.6		2		R3		350	686	1333	4.5	AM640TIVJ44JB
A10 Micro-6700T					1.2	2.2				R6		500	—			AM670TIVJ44JB

Beema, Notebook APU

Model	Released	Fab	Step.	CPU						GPU				DDR3 Memory support	TDP (W)	Part number
				Cores (threads) [FPUs]	Clock (GHz)	Turbo (GHz)	Cache337			Model	Config	Clock (MHz)	Turbo (MHz)
							L1	L2 (MB)	L3
E1-6010	Q2 2014	28 nm	ML-A1	2 (2)	1.35	—	32 KB inst. 32 KB data per core	1	—	R2	128:8:42 CU	300	600	(L)1333	10	EM6010IUJ23JB
E1-6015338	Q2 2015				1.4
E2-6110	Q2 2014			4 (4)	1.5			2						(L)1600	15	EM6110ITJ44JB
A4-6210					1.8					R3		350	686			AM6210ITJ44JB
A4-6250J339					2.0										25
A6-6310					1.8	2.4				R4		300	800	(L)1866	15	AM6310ITJ44JB
A8-6410					2.0					R5						AM6410ITJ44JB

"Carrizo-L" (2015)

• Fabrication 28 nm by GlobalFoundries
• Socket FT3b (BGA), FP4 (μBGA)³⁴⁰
• CPU: 2 to 4 (Puma+ cores)
  • L1 Cache: 32 KB Data per core and 32 KB Instructions per core
• GPU based on Graphics Core Next (GCN)
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
• Intelligent Turbo Boost
• Platform Security Processor, with an integrated ARM Cortex-A5 for TrustZone execution
• All models except A8-7410 available in both laptop and all-in-one desktop versions

Model	Released	Fab	Step.	CPU					GPU				DDR3Memorysupport	TDP (W)	Part number
				Cores(threads)[FPUs]	Clock (GHz)	Turbo (GHz)	Cache341		Model	Config	Clock	Turbo (MHz)
							L1	L2 (MB)
E1-7010	May 2015	28 nm	ML-A1	2	1.5	—	32 KB inst.32 KB dataper core	1	R2	128:8:42 CU		400	(L)1333	10	EM7010IUJ23JB EM7010JCY23JB EM7010JCY23JBD
E2-7110				4	1.8			2	R2			600	(L)1600	12–25	EM7110ITJ44JB EM7110JBY44JB EM7110JBY44JBD
A4-7210						2.2			R3			686			AM7210ITJ44JB AM7210JBY44JBD
A6-7310					2.0	2.4			R4			800	(L)1866		AM7310ITJ44JB AM7310JBY44JB AM7310JBY44JBD
A8-7410					2.2	2.5			R5			847		15	AM7410JBY44JB
A4 PRO-3350B	May 2016				2.0	2.4			R4			800	1600		AM335BITJ44JB

"Stoney Ridge" (2016)

• Fabrication 28 nm by GlobalFoundries
• Socket FP4³⁴² / FT4
• 2 "Excavator+" x86 CPU cores
• L1 Cache: 32 KB Data per core and 96 KB Instructions per module
• Single-channel DDR4 memory controller
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND, Turbo Core
• GPU based on Graphics Core Next 3rd Generation with VP9 decoding

Model number	Released	Fab	CPU					GPU				DDR4 Memorysupport	TDP (W)	Part number
			[Modules/FPUs] Cores/threads	Clock (GHz)	Turbo (GHz)	Cache343		Model	Config	Clock (MHz)	GFLOPS344
						L1	L2 (MB)
E2-9000e	November 2016	28 nm	[1]2	1.5	2.0	96 KB inst.per module32 KB dataper core	1	R2	128:8:42 CU	600	153.6	1866	6	EM900EANN23AC
E2-9000	June 2016			1.8	2.2								10	EM9000AKN23AC
E2-9010				2.0	2.2								10–15	EM9010AVY23AC
A4-9120	Q2 2017			2.2	2.5			R3		655	167.6	2133	10–15	AM9120AYN23AC
A4-9125	Q2 2018			2.3	2.6					686	175.6			AM9125AYN23AC
A4-9120C	January 6, 2019			1.6	2.4			R4	192:12:83 CU	600	230.4	1866	6	AM912CANN23AC
A6-9200e	November 2016			1.8	2.7							2133		AM920EANN23AC
A6-9200				2.0	2.8								10	AM9200AKN23AC
A6-9210	June 2016			2.4	2.8								10–15	AM9210AVY23AC
A6-9220	Q2 2017			2.5	2.9					655	251.5		10–15	AM9220AYN23AC
A6-9225	Q2 2018			2.6	3.0					686	263.4			AM9225AYN23AC
A6-9220C	January 6, 2019			1.8	2.7			R5		720	276.4	1866	6	AM922CANN23AC
A9-9400	November 2016			2.4	3.2					800	307.2	2133	10	AM9400AKN23AC
A9-9410	June 2016			2.9	3.5								10–25	AM9410AFY23AC
A9-9420	Q2 2017			3.0	3.6					847	325.2			AM9420AYN23AC
A9-9425	Q2 2018			3.1	3.7					900	345.6			AM9425AYN23AC
A9-9430345	Q2 2017			3.2	3.5					847	325.2	2400	25	AD9430AJN23AC
Pro A4-4350B	Q1 2018			2.5	2.9					655	251.5	2133	15
Pro A4-5350B	Q1 2020			3.0	3.6					847	325.2
Pro A6-7350B	Q1 2018
Pro A6-8350B	Q1 2020			3.1	3.7					900	345.6

"Dalí" (2020)

• Fabrication 14 nm by GlobalFoundries
• Socket FP5
• Two Zen CPU cores
• Over 30% die size reduction over predecessor (Raven Ridge)
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
• Dual-channel RAM

Model	Releasedate	Fab	CPU						GPU				Socket	PCIelanes	Memorysupport	TDP	Part number
			Cores(threads)	Clock rate (GHz)		Cache			Model	Config346	Clock(GHz)	Processingpower(GFLOPS)347
				Base	Boost	L1	L2	L3
AMD 3020e	Jan 6, 2020	14 nm	2 (2)	1.2	2.6	64 KB inst.32 KB dataper core	512 KBper core	4 MB	RadeonGraphics(Vega)	192:12:43 CU	1.0	384	FP5	12 (8+4)	DDR4-2400dual-channel	6 W	YM3020C7T2OFG
Athlon PRO 3045B	Q1 2021			2.3	3.2					128:8:42 CU	1.1	281.6				15 W	YM3045C4T2OFG
Athlon Silver 3050U	Jan 6, 2020																YM3050C4T2OFG
Athlon Silver 3050C	Sep 22, 2020																YM305CC4T2OFG
Athlon Silver 3050e	Jan 6, 2020		2 (4)	1.4	2.8					192:12:43 CU348	1.0	384				6 W	YM3050C7T2OFG
Athlon PRO 3145B	Q1 2021			2.4	3.3											15 W	YM3145C4T2OFG
Athlon Gold 3150U	Jan 6, 2020																YM3150C4T2OFG
Athlon Gold 3150C	Sep 22, 2020																YM315CC4T2OFG
Ryzen 3 3250U	Jan 6, 2020			2.6	3.5						1.2	460.8					YM3250C4T2OFG
Ryzen 3 3250C	Sep 22, 2020																YM325CC4T2OFG

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"Pollock" (2020)

• Fabrication 14 nm by GlobalFoundries
• Socket FT5
• Two Zen CPU cores
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
• Single-channel RAM

Model	Releasedate	Fab	CPU						GPU				Socket	PCIelanes	Memorysupport	TDP	Part number
			Cores(threads)	Clock rate (GHz)		Cache			Model	Config349	Clock(GHz)	Processingpower(GFLOPS)350
				Base	Boost	L1	L2	L3
AMD 3015e	Jul 6, 2020	14 nm	2 (4)	1.2	2.3	64 KB inst.32 KB dataper core	512 KBper core	4 MB	RadeonGraphics(Vega)	192:12:43 CU	0.6	230.4	FT5	12 (8+4)	DDR4-1600single-channel	6 W	AM3015BRP2OFJ
AMD 3015Ce	Apr 29, 2021																AM301CBRP2OFJ

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"Mendocino" (2022)

Main article: Ryzen

Common features:

• Socket: FT6
• All the CPUs support LPDDR5-5500 in dual-channel mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 512 KB per core.
• All the CPUs support 4 PCIe 3.0 lanes.
• Includes integrated RDNA2 GPU.
• Fabrication process: TSMC 6 nm FinFET.

Branding and Model		CPU					GPU		TDP	Releasedate
		Cores(threads)	Clock rate (GHz)		L3 cache(total)	Coreconfig351	Model	Clock
			Base	Boost
Athlon Gold	7220U352353	2 (4)	2.4	3.7	4 MB	1 x 2	610M2 CU	1900 MHz	8–15 W	Sep 20, 2022354
Athlon Silver	7120U355356	2 (2)		3.5	2 MB

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Embedded APUs

Further information: Embedded system

G-Series

Brazos: "Ontario" and "Zacate" (2011)

• Fabrication 40 nm
• Socket FT1 (BGA-413)
• CPU microarchitecture: Bobcat³⁵⁷
• L1 Cache: 32 KB Data per core and 32 KB Instructions per core
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, AMD-V
• GPU microarchitecture: TeraScale 2 (VLIW5) "Evergreen"
• Memory support: single-channel, support up to two DIMMs of DDR3-1333 or DDR3L-1066
• 5 GT/s UMI

Model	Released	Fab	Step.	CPU				GPU				DDR3 Memorysupport	TDP (W)	Part number
				Cores(threads)	Clock (GHz)	Cache358		Model	Config	Clock (MHz)	Processingpower(GFLOPS)359
						L1	L2
G-Series T24L	March 1, 2011May 23, 2011	40 nm	B0	1 (1)	0.81.0	32 KB inst.32 KB dataper core	512 KB	—				1066	5	GET24LFPB12GTEGET24LFQB12GVE
G-Series T30L	March 1, 2011May 23, 2011				1.4								18	GET30LGBB12GTEGET30LGBB12GVE
G-Series T48L	March 1, 2011May 23, 2011			2 (2)			2 × 512 KB							GET48LGBB22GTEGET48LGBB22GVE
G-Series T16R	June 25, 2012		B0	1 (1)	0.615		512 KB	HD 6250	80:8:4	276	44.1	(L)1066	4.5	GET16RFWB12GVE
G-Series T40R	May 23, 2011				1.0					280	44.8	1066	5.5	GET40RFQB12GVE
G-Series T40E				2 (2)			2 × 512 KB						6.4	GET40EFQB22GVE
G-Series T40N	January 19, 2011May 23, 2011							HD 6250HD 6290					9	GET40NFPB22GTEGET40NFPB22GVE
G-Series T40R	May 23, 2011			1 (1)			512 KB	HD 6250					5.5	GET40RFSB12GVE
G-Series T44R	January 19, 2011May 23, 2011				1.2								9	GET44RFPB12GTEGET44RFPB12GVE
G-Series T48E	June 25, 2012			2 (2)	1.4		2 × 512 KB						18	GET48EGBB22GVE
G-Series T48N	January 19, 2011 May 23, 2011							HD 6310		500520	80 83.2			GET48NGBB22GTEGET48NGBB22GVE
G-Series T52R	January 19, 2011 May 23, 2011			1 (1)	1.5		512 KB			500	80	1066 1333		GET52RGBB12GTEGET52RGBB12GVE
G-Series T56E	June 25, 2012			2 (2)	1.65		2 × 512 KB	HD 6250		275	44	1333		GET56EGBB22GVE
G-Series T56N	January 19, 2011 May 23, 2011				1.6 1.65			HD 6310HD 6320		500	80	10661333		GET56NGBB22GTEGET56NGBB22GVE

"Kabini" (2013, SoC)

• Fabrication 28 nm
• Socket FT3 (769-BGA)³⁶⁰
• CPU microarchitecture: Jaguar
• L1 Cache: 32 KB Data per core and 32 KB Instructions per core
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support. No support for FMA (Fused Multiply-Accumulate). Trusted Platform Module (TPM) 1.2 support
• GPU microarchitecture: Graphics Core Next (GCN) with Unified Video Decoder 3 (H.264, VC-1, MPEG2, etc.)
• Single channel DDR3-1600, 1.25 and 1.35 V voltage level support, support for ECC memory
• Integrates Controller Hub functional block, HD audio, 2 SATA channels, USB 2.0 and USB 3.0 (except GX-210JA)

Model	Released	Fab	Step.	CPU				GPU				DDR3 Memorysupport	TDP (W)	Junction temperature (°C)	Part number
				Cores(threads)	Clock (GHz)	Cache361		Model	Config	Clock (MHz)	Processingpower(GFLOPS)362
						L1	L2 (MB)
GX-210UA	Un­known	28 nm	B0	2 (2)	1.0	32 KB inst.32 KB dataper core	1	—				1333	8.5	0-90	GE210UIGJ23HM
GX-210JA	July 30, 2013							HD 8180E	128:8:42 CU	225	57.6	1066	6		GE210JIHJ23HM
GX-209HA	Un­known							HD 8400E		600	153.6		9	-40-105	GE209HISJ23HM
GX-210HA	June 1, 2013							HD 8210E		300	76.8	1333		0-90	GE210HICJ23HM
GX-217GA					1.65			HD 8280E		450	115.2	1600	15		GE217GIBJ23HM
GX-411GA	Un­known			4 (4)	1.1		2	HD 8210E		300	76.8	1066		-40-105	GE411GIRJ44HM
GX-415GA	June 1, 2013				1.5			HD 8330E		500	128	1600		0-90	GE415GIBJ44HM
GX-416RA					1.6			—							GE416RIBJ44HM
GX-420CA					2.0			HD 8400E	128:8:42 CU	600	153.6		25		GE420CIAJ44HM

"Steppe Eagle" (2014, SoC)

• Fabrication 28 nm
• Socket FT3b (769-BGA)
• CPU microarchitecture: Puma
• L1 Cache: 32 KB Data per core and 32 KB Instructions per core
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support

Model	Released	Fab	Step.	CPU				GPU				DDR3 Memorysupport	TDP (W)	Junction temperature (°C)	Part number
				Cores(threads)[FPUs]	Clock (GHz)	Cache363		Model	Config	Clock (MHz)	Processingpower(GFLOPS)364
						L1	L2 (MB)
GX-210JC	June 4, 2014	28 nm	ML-A1	2 (2) [1]	1.0	32 KB inst.32 KB dataper core	1	R1E	128:8:42 CU	267	68.3	1600	6	-40-105	GE210JIZJ23JB
GX-212JC					1.2			R2E		300	76.8	1333		0-90	GE212JIYJ23JB
GX-216HC					1.6			R4E				1066	10	-40-105	GE216HHBJ23JB
GX-222GC					2.2			R5E		655	167.6	1600	15	0-90	GE222GITJ23JB
GX-412HC				4 (4) [2]	1.2		2	R3E		300	76.8	1333	7		GE412HIYJ44JB
GX-424CC					2.4			R5E		497	127.2	1866	25		GE424CIXJ44JB

"Crowned Eagle" (2014, SoC)

• Fabrication 28 nm
• Socket FT3b (769-BGA)
• CPU microarchitecture: Puma
• L1 Cache: 32 KB Data per core and 32 KB Instructions per core
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
• no GPU

Model	Released	Fab	CPU				GPU	DDR3 Memorysupport	TDP (W)	Junction temperature (°C)	Part number
			Cores(threads)[FPUs]	Clock (GHz)	Cache365
					L1	L2 (MB)
GX-224PC	June 4, 2014	28 nm	2 (2) [1]	2.4	32 KB inst.32 KB dataper core	1	—	1866	25	0-90	GE224PIXJ23JB
GX-410VC			4 (4) [2]	1.0		2		1066	7	-40-105	GE410VIZJ44JB
GX-412TC				1.2				1600	6	0-90	GE412TIYJ44JB
GX-420MC				2.0					17.5		GE420MIXJ44JB

LX-Family (2016, SoC)

• Fabrication 28 nm
• Socket FT3b (769-BGA)
• 2 Puma x86 cores with 1MB shared L2 cache
• L1 Cache: 32 KB Data per core and 32 KB Instructions per core
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
• GPU microarchitecture: Graphics Core Next (GCN) (1CU) with support for DirectX 11.2
• Single channel 64-bit DDR3 memory with ECC
• Integrated Controller Hub supports: PCIe® 2.0 4×1, 2 USB3 + 4 USB2 ports, 2 SATA 2.0/3.0 ports

Model	Released	Fab	Step.	CPU				GPU				DDR3 Memorysupport	TDP (W)	Part number
				Cores(threads)[FPUs]	Clock (GHz)	Cache366		Model	Config	Clock (MHz)	Processingpower(GFLOPS)367
						L1	L2 (MB)
GX-208JL	February 23, 2016	28 nm	ML-A1	2	0.8	32 KB inst.32 KB dataper core	1	R1E	64:4:11 CU	267	34.1	1333	6	GE208JIVJ23JB
GX-210HL	2017				1.0							1066	7	GE208HIZJ23JB
GX-210JL	February 23, 2016											1333	6	GE210JIVJ23JB
GX-210KL	2017												4.5	GE210KIVJ23JB
GX-215GL	February 23, 2016				1.5					497	63.6	1600	15	GE215GITJ23JB
GX-218GL					1.8									GE218GITJ23JB

I-Family: "Brown Falcon" (2016, SoC)

• Fabrication 28 nm
• Socket FP4³⁶⁸
• 2 or 4 Excavator x86 cores with 1MB shared L2 cache
• L1 Cache: 32 KB Data per core and 96 KB Instructions per module
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND
• GPU microarchitecture: Graphics Core Next (GCN) (up to 4 CUs) with support for DirectX 12
• Dual channel 64-bit DDR4 or DDR3 memory with ECC
• 4K × 2K H.265 decode capability and multi format encode and decode
• Integrated Controller Hub supports: PCIe 3.0 1×4, PCIe 2/3 4×1, 2 USB3 + 2 USB2 ports, 2 SATA 2.0/3.0 ports

Model	Released	Fab	CPU					GPU				Memorysupport	TDP (W)	Part number
			[Modules/FPUs]Cores/threads	Clock (GHz)	Turbo (GHz)	Cache369		Model	Config370	Clock (MHz)	Processingpower(GFLOPS)371
						L1	L2 (MB)
GX-217GI	February 23, 2016	28 nm	[1] 2	1.7	2.0	96 KB inst.per module32 KB dataper core	1	R6E	256:16:44 CU	758	388	DDR3/DDR4-1600	15	GE217GAAY23KA
GX-420GI372	2016		[2] 4	2.0	2.2		2	R6ER7E	256:16:44 CU384:24:46 CU	758626	388480.7	DDR4-1866	16.1	GE420GAAY43KA

J-Family: "Prairie Falcon" (2016, SoC)

• Fabrication 28 nm
• Socket FP4³⁷³
• 2 "Excavator+" x86 cores with 1MB shared L2 cache
• L1 Cache: 32 KB Data per core and 96 KB Instructions per module
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND
• GPU microarchitecture: Radeon R5E Graphics Core Next (GCN) (up to 3 CUs) with support for DirectX 12
• Single channel 64-bit DDR4 or DDR3 memory
• 4K × 2K H.265 decode capability with 10-bit compatibility and multi format encode and decode
• Integrated Controller Hub supports: PCIe 3.0 1×4, PCIe 2/3 4×1, 2 USB3 + 2 USB2 ports, 2 SATA 2.0/3.0 ports

Model	Released	Fab	CPU					GPU					Memorysupport	TDP (W)	Junction temperature (°C)	Part number
			[Modules/FPUs]Cores/threads	Clock (GHz)	Turbo (GHz)	Cache374		Model	Config375	Clock (MHz)	Turbo	Processingpower(GFLOPS)376
						L1	L2 (MB)
GX-212JJ	2018	28 nm	[1] 2	1.2	1.6	96 KB inst.per module32 KB dataper core	1	R1E	64:4:11 CU	600	—	76.8	DDR3-1333DDR4-1600	6– 10	0-90	GE212JAWY23AC
GX-215JJ	2017			1.5	2.0			R2E	128:8:22 CU			153.6	DDR3-1600DDR4-1866			GE215JAWY23AC
GX-220IJ	2018			2.0	2.2									10– 15		GE220IAVY23AC
GX-224IJ	2017			2.4	2.8			R4E	192:12:33 CU			230.4	DDR3-1866DDR4-2133			GE224IAVY23AC

R-Series

Comal: "Trinity" (2012)

• Fabrication 32 nm
• Socket FP2 (BGA-827), FS1r2
• CPU microarchitecture: Piledriver
• L1 Cache: 16 KB Data per core and 64 KB Instructions per module
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AMD64, AMD-V, AES, CLMUL, AVX 1.1, XOP, FMA3, FMA4, F16C,³⁷⁷ ABM, BMI1, TBM
• GPU microarchitecture: TeraScale 3 (VLIW4) "Northern Islands"
• Memory support: dual-channel 1.35 V DDR3L-1600 memory, in addition to regular 1.5 V DDR3
• 2.5 GT/s UMI
• Die size: 246 mm²; Transistors: 1.303 billion
• OpenCL 1.1 and OpenGL 4.2 support

Model	Released	Fab	Step.	CPU					GPU					DDR3 Memorysupport	TDP (W)	Part number
				[Modules/FPUs]Cores/threads	Clock (GHz)	Turbo (GHz)	Cache378		Model	Config379	Clock (MHz)	Turbo (MHz)	Processingpower(GFLOPS)380
							L1	L2 (MB)
R-252F	May 21, 2012	32 nm	B0	[1] 2	1.9	2.4	64 KB inst.per module16 KB dataper core	1	HD 7400G	192:12:43 CU	333	417	127.8	1333	17	RE252FSHE23HJE
R-260H					2.1	2.6		2?	HD 7500G	256:16:84 CU	327	424	167.4			RE260HSHE24HJE
R-268D					2.5	3.0		1	HD 7420G	192:12:43 CU	470	640	180.4	1600	35	RE268DDEC23HJE
R-272F					2.7	3.2			HD 7520G		497	686	190.8			RE272FDEC23HJE
R-452L				[2] 4	1.6	2.4		2 × 2 MB	HD 7600G	256:16:84 CU	327	424	167.4		19	RE452LSHE44HJE
R-460H					1.9	2.8			HD 7640G		497	655	254.4		35	RE460HDEC44HJE
R-460L					2.0				HD 7620G	384:24:86 CU	360	497	276.4	1333	25	RE460LSIE44HJE
R-464L					2.3	3.2			HD 7660G		497	686	381.6	1600	35	RE464LDEC44HJE

"Bald Eagle" (2014)

• Fabrication 28 nm
• Socket FP3
• Up to 4 Steamroller x86 cores³⁸¹
• L1 Cache: 16 KB Data per core and 96 KB Instructions per module
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AMD64, AMD-V, AES, CLMUL, AVX 1.1, XOP, FMA3, FMA4, F16C,³⁸² ABM, BMI1, TBM
• GPU microarchitecture: Graphics Core Next (GCN) (up to 8 CUs) with support for DirectX 11.1 and OpenGL 4.2
• Dual channel DDR3 memory with ECC
• Unified Video Decode (UVD) 4.2 and Video Coding Engine (VCE) 2.0

Model	Released	Fab	CPU					GPU					DDR3 Memorysupport	TDP (W)	Junction temperature (°C)	Part number
			[Modules/FPUs]Cores/threads	Clock (GHz)	Turbo (GHz)	Cache383		Model	Config384	Clock (MHz)	Turbo (MHz)	Processingpower(GFLOPS)385
						L1	L2 (MB)
RX-219NB	May 20, 2014	28 nm	[1] 2	2.2	3.0	96 KB inst.per module16 KB dataper core	1	—					1600	15- 17	0-100	RE219NECH23JA
RX-225FB								R4	192:12:43 CU	464	533	178.1				RE225FECH23JA
RX-425BB			[2] 4	2.5	3.4		4	R6	384:24:86 CU	576	654	442.3	1866	30- 35		RE425BDGH44JA
RX-427BB				2.7	3.6			R7	512:32:88 CU	600	686	614.4	2133	30- 35		RE427BDGH44JA
RX-427NB								—								RE427NDGH44JA

"Merlin Falcon" (2015, SoC)

• Fabrication 28 nm
• Socket FP4
• Up to 4 Excavator x86 cores³⁸⁶
• L1 Cache: 32 KB Data per core and 96 KB Instructions per module
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND
• GPU microarchitecture: Graphics Core Next (GCN) (up to 8 CUs) with support for DirectX 12
• Dual channel 64-bit DDR4 or DDR3 memory with ECC
• Unified Video Decode (UVD) 6 (4K H.265 and H.264 decode) and Video Coding Engine (VCE) 3.1 (4K H.264 encode)
• Dedicated AMD Secure Processor supports secure boot with AMD Hardware Validated Boot (HVB)
• Integrated FCH featuring PCIe 3.0 USB3.0, SATA3, SD, GPIO, SPI, I2S, I2C, UART

Model	Released	Fab	Stepping	CPU						GPU					Memorysupport	TDP (W)	Junction temperature (°C)	Part number
				[Modules/FPUs]Cores/threads	Clock (GHz)	Turbo (GHz)	Cache387			Model	Config388	Clock (GHz)	Turbo	Processingpower(GFLOPS)389
							L1	L2 (MB)	L3
RX-216TD	October 21, 2015	28 nm		[1] 2	1.6	3.0	96 KB inst.per module32 KB dataper core	1	—	—					DDR3/DDR4-1600	12- 15	0-90	RE216TAAY23KA
RX-216GD										R5	256:?:?4 CU	0.8	—	409.6				RE216GAAY23KA
RX-416GD				[2] 4		2.4		2		R6	384:?:?6 CU	0.72		552.9		15	-40-105	RE416GATY43KA
RX-418GD	October 21, 2015				1.8	3.2					384:?:?6 CU	0.8		614.4	DDR3-2133DDR4-2400	12- 35	0-90	RE418GAAY43KA
RX-421BD					2.1	3.4				R7	512:?:?8 CU			819.2				RE421BAAY43KA
RX-421ND										—								RE421NAAY43KA

1000-Series

V1000-Family: "Great Horned Owl" (2018, SoC)

• Fabrication 14 nm by GlobalFoundries
• Up to 4 Zen cores
• Socket FP5
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
• Dual channel DDR4 memory with ECC
• Fifth generation GCN based GPU

Model	Releasedate	Fab	CPU						GPU				Memorysupport	TDP	Junctiontemp.range(°C)
			Cores(threads)	Clock rate (GHz)		Cache			Model	Config390	Clock(GHz)	Processingpower(GFLOPS)391
				Base	Boost	L1	L2	L3
V1202B	February 2018	GloFo14LP	2 (4)	2.3	3.2	64 KB inst.32 KB dataper core	512 KBper core	4 MB	Vega 3	192:12:163 CU	1.0	384	DDR4-2400dual-channel	12–25 W	0–105
V1404I	December 2018		4 (8)	2.0	3.6				Vega 8	512:32:168 CU	1.1	1126.4			-40–105
V1500B				2.2	—				—						0–105
V1605B	February 2018			2.0	3.6				Vega 8	512:32:168 CU	1.1	1126.4
V1756B				3.25									DDR4-3200dual-channel	35–54 W
V1780B	December 2018			3.35					—
V1807B	February 2018				3.8				Vega 11	704:44:1611 CU	1.3	1830.4

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R1000-Family: "Banded Kestrel" (2019, SoC)

• Fabrication 14 nm by GlobalFoundries
• Up to 2 Zen cores
• Socket FP5
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
• Dual channel DDR4 memory with ECC
• Fifth generation GCN based GPU

Model	Releasedate	Fab	CPU						GPU				Memorysupport	TDP
			Cores(threads)	Clock rate (GHz)		Cache			Model	Config392	Clock(GHz)	Processingpower(GFLOPS)393
				Base	Boost	L1	L2	L3
R1102G	February 25, 2020	GloFo14LP	2 (2)	1.2	2.6	64 KB inst.32 KB dataper core	512 KBper core	4 MB	Vega 3	192:12:43 CU	1.0	384	DDR4-2400single-channel	6 W
R1305G			2 (4)	1.5	2.8								DDR4-2400dual-channel	8-10 W
R1505G	April 16, 2019			2.4	3.3									12–25 W
R1606G				2.6	3.5						1.2	460.8

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2000-Series

V2000-Family: "Grey Hawk" (2020, SoC)

• Fabrication 7 nm by TSMC
• Up to 8 Zen 2 cores
• Fifth generation GCN based GPU

Model	Releasedate	Fab	CPU						GPU				Socket	PCIesupport	Memorysupport	TDP
			Cores(threads)	Clock rate (GHz)		Cache			Archi-tecture	Config394	Clock(GHz)	Processingpower395(GFLOPS)
				Base	Boost	L1	L2	L3
V2516396	November 10, 2020397	TSMC7FF	6 (12)	2.1	3.95	32 KB inst.32 KB dataper core	512 KBper core	8 MB	GCN 5	384:24:86 CU	1.5	1152	FP6	20(8+4+4+4)PCIe 3.0	DDR4-3200dual-channelLPDDR4X-4266quad-channel	10–25 W
V2546398				3.0	3.95											35–54 W
V2718399			8 (16)	1.7	4.15					448:28:87 CU	1.6	1433.6				10–25 W
V2748400				2.9	4.25											35–54 W

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R2000-Family: "River Hawk" (2022, SoC)

• Fabrication 12 nm by GlobalFoundries
• Up to 4 Zen+ cores
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core

Model	Releasedate	Fab	CPU						GPU				Socket	PCIesupport	Memorysupport	TDP
			Cores(threads)	Clock rate (GHz)		Cache			Archi-tecture	Config401	Clock(GHz)	Processingpower402(GFLOPS)
				Base	Boost	L1	L2	L3
R2312403	June 7, 2022404	GloFo12LP	2 (4)	2.7	3.5	64 KB inst.32 KB dataper core	512 KBper core	4 MB	GCN 5	192:12:43 CU	1.2	460.8	FP5	8 lanesGen 3	DDR4-2400dual-channel ECC	10–25 W
R2314405			4 (4)	2.1						384:24:86 CU		921.6		16 lanesGen 3	DDR4-2666dual-channel ECC	10–35 W

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Custom APUs

As of May 1, 2013, AMD opened the doors of their "semi-custom" business unit.⁴⁰⁶ Since these chips are custom-made for specific customer needs, they vary widely from both consumer-grade APUs and even the other custom-built ones. Some notable examples of semi-custom chips that have come from this sector include the chips from the PlayStation 4 and Xbox One.⁴⁰⁷ So far the size of the integrated GPU in these semi-custom APUs exceed by far the GPU size in the consumer-grade APUs.

Chip(device)	Release date	Fab	Die area (mm2)	CPU				GPU							Memory			Storage	API support	Special features
				Archi-tecture	Cores	Clock (GHz)	L2 cache	Archi-tecture	Core config408	Clock (MHz)	GFLOPS409	Pixel fillrate (GP/s)410	Texture fillrate (GT/s)411	Other	Size	Bus type & width	Band-width (GB/s)			Audio	Other
Liverpool(PS4)	Nov 2013	28 nm	348	Jaguar	8 cores	1.6	2× 2 MB	GCN 2	1152:72:3218 CU	800	1843	25.6	57.6	8 ACEs	8 GB	GDDR5256-bit	176	3DBD/DVD1× 2.5" SATA hard driveEasily replaceable hard driveUSB 3.0	OpenGL 4.2, GNM, GNMX and PSSL	Dolby Atmos (BD)S/PDIF	PS VRPS4 additional modulesHDR10 (except discs)412CECOptional IR sensor
Durango(Xbox One)	Nov 2013		363			1.75			768:48:1612 CU	853	1310	13.6	40.9	2 ACEs	32 MB	ESRAM413	204	3DBD/DVD/CD1× 2.5" SATA hard driveUSB 3.0	Direct3D 11.2 and 12	Fully Dolby Atmos, DTS:X, and Windows SonicS/PDIF	Xbox One additional modulesFreeSync (1)HDMI 1.4 throughIR sensor and IR out portKensington lock
															8 GB	DDR3256-bit	68
Edmonton(Xbox One S) 414	Jun 2016	16 nm	240							914	1404	14.6	43.9	2 ACEs	32 MB	ESRAM	219	4KBD/3DBD/DVD/CD4151× 2.5" SATA hard driveUSB 3.0		Fully Dolby Atmos, DTS:X, and Windows SonicS/PDIF	Xbox One S additional modulesFully HDR10Dolby Vision (streaming)FreeSync (1&2)HDMI 1.4 throughIR sensor and IR out portKensington lock
															8 GB	DDR3256-bit	68
(PS4 Slim)	Sep 2016		208			1.6			1152:72:3218 CU	800	1843	25.6	57.6	8 ACEs	8 GB	GDDR5256-bit	176	3DBD/DVD1× 2.5" SATA hard driveEasily replaceable hard driveUSB 3.0	OpenGL 4.2, GNM, GNMX and PSSL	Dolby Atmos (BD)	PS VRPS4 Slim additional modulesHDR10 (except discs)CECOptional IR sensor
Neo(PS4 Pro) 416417418	Nov 2016		325			2.13		GCN 4(Polaris) 419	2304:144:3236 CU	911	4198	58.3	131.2	4 ACEs and 2 HWSDouble-rate FP16420checkerboard rendering	8 GB421	GDDR5256-bit	218	3DBD/DVD1× 2.5" SATA hard driveEasily replaceable hard driveUSB 3.0	OpenGL 4.2 (4.5), GNM, GNMX and PSSL	Dolby Atmos (BD)S/PDIF	PS VRPS4 Pro additional modulesHDR10 (except discs)Up to 4K@60 HzCECOptional IR sensor
															1 GB	DDR3422	?
Scorpio(Xbox One X) 423424425	Nov 2017		359	CustomizedJaguar		2.3			2560:160:3240 CU	1172	6001	37.5	187.5	4 ACEs and 2 HWS	12 GB	GDDR5384-bit	326	4KBD/3DBD/DVD/CD1× 2.5" SATA hard driveUSB 3.0	Direct3D 11.2 and 12	Fully Dolby Atmos, DTS:X, and Windows SonicS/PDIF	Xbox One X additional modulesFully HDR10Dolby Vision (streaming)FreeSync (1&2)Up to 4K@60 HzHDMI 1.4b throughIR sensor and IR out port
Fenghuang(Subor Z+) 426427428	cancelled 429	14 nm 430	397	Zen	4 cores8 threads	3.0		GCN 5	1536:96:3224 CU	1300	3994	41.6	124.8	Double-rate FP16	8 GB	GDDR5256-bit	154	1× 2.5" SATA SSD1× 2.5" SATA hard driveEasily replaceable drivesUSB 3.0	Vulkan 1.1, Direct3D 12.1	S/PDIF	Subor Z Plus additional modulesWindows 10 Enterprise LTSC
Oberon(PS5)431	Nov 2020	7 nm	308	Zen 2	8 cores16 threads	3.5 (variable)	4 MB	RDNA 2	2304:144:6436 CU	2233 (variable)	10290 (variable)	142.9	321.6	Double-rate FP16Real-time ray tracingPrimitive shadersCustom 3D audio blocks	16 GB	GDDR6256-bit	448	4KBDCustom 5.5 GB/s PCIe 4.0 x4 NVMe SSDPCIe 4.0 M.2 slotEasily replaceable M.2 SSDUSB (except PS5 games)	Vulkan 1.2	PS5 TEMPEST 3D AudioTech	PS VRDedicated DMA controller and I/O coprocessorsCustom coherency engines and cache scrubbersCustom decompression blockHDRUp to 4K@120 HzUp to 8K@30 Hz
Anaconda(Xbox Series X)	Nov 2020		360			3.6(3.8 w/o SMT)			3328:208:6452 CU	1825	12147	116.8	379.6	Double-rate FP16Real-time ray tracingMesh shadersVariable rate shadingANN acceleration	10 GB	GDDR6320-bit	560	4KBDCustom 2.4 GB/s NVMe SSDCustom expansion cardUSB 3.1 (except XSX games)	DirectX 12 Ultimate	Custom spatial audio blockMS Project AcousticsFully Dolby Atmos, DTS:X, and Windows Sonic	Custom decompression blockHDRVRRUp to 4K@120 HzUp to 8K@30 HzCEC
															6 GB	GDDR6192-bit432	336
Lockhart(Xbox Series S)			197			3.4(3.6 w/o SMT)			1280:80:3220 CU	1565	4006	50.1	125.2		8 GB	GDDR6128-bit	224
															2 GB	GDDR632-bit	56
Van Gogh"Aerith"(Steam Deck)433	Dec 2021		163		4 cores8 threads	2.4-3.5	2 MB		512:32:168 CU	1000-1600	1000-1600	16-25.6	32-51.2	Double-rate FP16Real-time ray tracingVariable rate shading	16 GB	LPDDR5128-bit	88	64 GB eMMC (PCIe Gen 2 × 1)256 GB NVMe SSD (PCIe Gen 3 × 4)512 GB NVMe SSD (PCIe Gen 3 × 4)microSD card slot	DirectX 9-12 Ultimate, OpenGL 4.6, Vulkan 1.2
Van Gogh"Sephiroth" (Steam Deck OLED)	Nov 2023	6 nm	131														102	256 GB NVMe SSD (PCIe Gen 3 × 4)512 GB NVMe SSD (PCIe Gen 3 × 4)1 TB NVMe SSD (PCIe Gen 3 × 4)microSD card slot
Viola(PS5 Pro)	Nov 2024	4 nm	260		8 cores16 threads	3.85(variable)	4 MB	RDNA 3	3840:240:12060 CU	2180(variable)	16742(variable)	261.6	523.2	Double-rate FP16Real-time ray tracingPrimitive shadersCustom 3D audio blocksHardware-accelerated upscaling	16 GB	GDDR6256-bit	576	4KBD2 TB NVMe SSD (PCIe Gen 4 × 4)PCIe 4.0 M.2 slotUSB	Vulkan 1.2	PS5 TEMPEST 3D AudioTech	PS VRDedicated DMA controller and I/O coprocessorsCustom coherency engines and cache scrubbersCustom decompression blockHDRUp to 4K@120 HzUp to 8K@60 Hz
															2 GB	DDR5	?

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See also

• List of AMD chipsets
• List of AMD FX microprocessors
• List of AMD graphics processing units
• Ryzen

Notes

External links

• AMD Accelerated Processing Units official website
• Technical specification AMD products
• AMD products and technologies

References

1. "AMD Announces the 7th Generation APU: Excavator mk2 in Bristol Ridge and Stoney Ridge for Notebooks". May 31, 2016. Retrieved January 3, 2020. https://www.anandtech.com/show/10362/amd-7th-generation-apu-bristol-ridge-stoney-ridge-for-notebooks ↩

2. "AMD Mobile "Carrizo" Family of APUs Designed to Deliver Significant Leap in Performance, Energy Efficiency in 2015" (Press release). November 20, 2014. Retrieved February 16, 2015. https://www.amd.com/en-us/press-releases/Pages/amd-mobile-carrizo-2014nov20.aspx ↩

3. For FM2+ Excavator models: A8-7680, A6-7480 & Athlon X4 845. ↩

4. "The Mobile CPU Comparison Guide Rev. 13.0 Page 5 : AMD Mobile CPU Full List". TechARP.com. Retrieved December 13, 2017. https://www.techarp.com/guides/mobile-cpu-comparison-guide/5/ ↩

5. A PC would be one node. ↩

6. An APU combines a CPU and a GPU. Both have cores. ↩

7. Requires firmware support. ↩

8. Requires firmware support. ↩

9. Requires firmware support. ↩

10. No SSE4. No SSSE3. ↩

11. "AMD VEGA10 and VEGA11 GPUs spotted in OpenCL driver". VideoCardz.com. Retrieved June 6, 2017. http://videocardz.com/62250/amd-vega10-and-vega11-gpus-spotted-in-opencl-driver/ ↩

12. "AMD VEGA10 and VEGA11 GPUs spotted in OpenCL driver". VideoCardz.com. Retrieved June 6, 2017. http://videocardz.com/62250/amd-vega10-and-vega11-gpus-spotted-in-opencl-driver/ ↩

13. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single-precision_floating-point_format ↩

14. Unified shaders : texture mapping units : render output units /wiki/Unified_shader_model ↩

15. Cutress, Ian (February 1, 2018). "Zen Cores and Vega: Ryzen APUs for AM4 – AMD Tech Day at CES: 2018 Roadmap Revealed, with Ryzen APUs, Zen+ on 12nm, Vega on 7nm". Anandtech. Retrieved February 7, 2018. https://www.anandtech.com/show/12233/amd-tech-day-at-ces-2018-roadmap-revealed-with-ryzen-apus-zen-on-12nm-vega-on-7nm/3 ↩

16. Larabel, Michael (November 17, 2017). "Radeon VCN Encode Support Lands in Mesa 17.4 Git". Phoronix. Retrieved November 20, 2017. https://www.phoronix.com/scan.php?page=news_item&px=Radeon-VCN-Encode-Lands ↩

17. "AMD Ryzen 5000G 'Cezanne' APU Gets First High-Res Die Shots, 10.7 Billion Transistors In A 180mm2 Package". wccftech. August 12, 2021. Retrieved August 25, 2021. https://wccftech.com/amd-ryzen-5000g-cezanne-apu-first-high-res-die-shots-10-7-billion-transistors/ ↩

18. "AMD Ryzen 5000G 'Cezanne' APU Gets First High-Res Die Shots, 10.7 Billion Transistors In A 180mm2 Package". wccftech. August 12, 2021. Retrieved August 25, 2021. https://wccftech.com/amd-ryzen-5000g-cezanne-apu-first-high-res-die-shots-10-7-billion-transistors/ ↩

19. Tony Chen; Jason Greaves, "AMD's Graphics Core Next (GCN) Architecture" (PDF), AMD, retrieved August 13, 2016 http://meseec.ce.rit.edu/551-projects/fall2014/3-4.pdf ↩

20. "A technical look at AMD's Kaveri architecture". Semi Accurate. Retrieved July 6, 2014. http://semiaccurate.com/2014/01/15/technical-look-amds-kaveri-architecture/ ↩

21. To play protected video content, it also requires card, operating system, driver, and application support. A compatible HDCP display is also needed for this. HDCP is mandatory for the output of certain audio formats, placing additional constraints on the multimedia setup. ↩

22. To play protected video content, it also requires card, operating system, driver, and application support. A compatible HDCP display is also needed for this. HDCP is mandatory for the output of certain audio formats, placing additional constraints on the multimedia setup. ↩

23. To feed more than two displays, the additional panels must have native DisplayPort support.[10] Alternatively active DisplayPort-to-DVI/HDMI/VGA adapters can be employed. /wiki/DisplayPort ↩

24. DRM (Direct Rendering Manager) is a component of the Linux kernel. Support in this table refers to the most current version. /wiki/Direct_Rendering_Manager ↩

25. Airlie, David (November 26, 2009). "DisplayPort supported by KMS driver mainlined into Linux kernel 2.6.33". Retrieved January 16, 2016. http://airlied.livejournal.com/68805.html ↩

26. "Radeon feature matrix". freedesktop.org. Retrieved January 10, 2016. http://xorg.freedesktop.org/wiki/RadeonFeature/ ↩

27. DRM (Direct Rendering Manager) is a component of the Linux kernel. Support in this table refers to the most current version. /wiki/Direct_Rendering_Manager ↩

28. Deucher, Alexander (September 16, 2015). "XDC2015: AMDGPU" (PDF). Retrieved January 16, 2016. http://www.x.org/wiki/Events/XDC2015/Program/deucher_zhou_amdgpu.pdf ↩

29. Michel Dänzer (November 17, 2016). "[ANNOUNCE] xf86-video-amdgpu 1.2.0". lists.x.org. https://lists.x.org/archives/xorg-announce/2016-November/002741.html ↩

30. Michel Dänzer (November 17, 2016). "[ANNOUNCE] xf86-video-amdgpu 1.2.0". lists.x.org. https://lists.x.org/archives/xorg-announce/2016-November/002741.html ↩

31. "Conformant Products - The Khronos Group Inc". The Khronos Group. Retrieved June 6, 2019. https://www.khronos.org/conformance/adopters/conformant-products/vulkan ↩

32. "Conformant Products - The Khronos Group Inc". The Khronos Group. Retrieved June 6, 2019. https://www.khronos.org/conformance/adopters/conformant-products/opengl ↩

33. Radeon 7000 Series has programmable pixel shaders, but do not fully comply with DirectX 8 or Pixel Shader 1.0. See article on R100's pixel shaders. /wiki/Radeon_R100_series#R100's_pixel_shaders ↩

34. These series do not fully comply with OpenGL 2+ as the hardware does not support all types of non-power-of-two (NPOT) textures. ↩

35. "GPU-Tech.org - Catalyst 11.10 WHQL - First official Battlefield 3 driver for Radeon cards". GPU-Tech.org. October 31, 2011. http://www.gpu-tech.org/content.php/177-Catalyst-11-10-WHQL-First-official-Battlefield-3-driver-for-Radeon-graphics-cards ↩

36. "AMD Radeon Software Crimson Edition Beta". AMD. Retrieved April 20, 2018. https://support.amd.com/en-us/kb-articles/pages/amd-radeon-software-crimson-edition-beta.aspx ↩

37. "Mesamatrix". mesamatrix.net. Retrieved April 20, 2018. https://mesamatrix.net/ ↩

38. "RadeonFeature". X.Org Foundation. Retrieved April 20, 2018. https://www.x.org/wiki/RadeonFeature/ ↩

39. OpenGL 4+ compliance requires supporting FP64 shaders and these are emulated on some TeraScale chips using 32-bit hardware. ↩

40. Wallossek, Igor; Woligroski, Don (December 21, 2011). "Graphics Core Next: The Southern Islands Architecture". Tom's Hardware. Retrieved July 26, 2013. http://www.tomshardware.com/reviews/radeon-hd-7970-benchmark-tahiti-gcn,3104-2.html ↩

41. Broekhuijsen, Niels (February 20, 2013). "AMD Clarifies 2013 Radeon Plans". Tom's Hardware. Retrieved July 26, 2013. http://www.tomshardware.com/news/AMD-Sea-Islands-Radeon-GPU,21136.html ↩

42. "Radeon Vega Frontier Edition". AMD. December 30, 2022. Archived from the original on June 27, 2017. Retrieved July 30, 2017. https://web.archive.org/web/20170627182514/http://pro.radeon.com/en-us/product/radeon-vega-frontier-edition/ ↩

43. "AMD launches A-Series and the first 32nm Athlon II X4 CPUs". Archived from the original on May 3, 2012. Retrieved November 10, 2013. http://www.cpu-world.com/news_2011/2011081701_AMD_launches_A-Series_and_the_first_32nm_Athlon_II_X4_CPUs.html ↩

44. Theo Valich (May 28, 2012). "AMD Comes Clean on Transistor Numbers With FX, Fusion Processors". Retrieved August 23, 2013. http://www.brightsideofnews.com/news/2012/5/28/amd-comes-clean-on-transistor-numbers-with-fx2c-fusion-processors.aspx ↩

45. Anand Lal Shimpi (September 27, 2012). "AMD A10-5800K & A8-5600K Review: Trinity on the Desktop, Part 1". Archived from the original on August 13, 2013. Retrieved August 23, 2013. http://www.anandtech.com/show/6332/amd-trinity-a10-5800k-a8-5600k-review-part-1 ↩

46. Models with "K" suffixes feature an unlocked multiplier and overclockable GPU. ↩

47. AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27] ↩

48. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single-precision_floating-point_format ↩

49. "Trinity Improvements Include Updated Piledriver Cores and VLIW4 GPUs". May 4, 2012. Archived from the original on November 10, 2013. Retrieved November 10, 2013. http://www.pcper.com/news/Processors/Trinity-Improvements-Include-Updated-Piledriver-Cores-and-VLIW4-GPUs-0 ↩

50. "AMD detonates Trinity: Behold Bulldozer's second coming - ExtremeTech". Retrieved October 7, 2017. https://www.extremetech.com/computing/129363-amd-detonates-trinity-behold-bulldozers-second-coming ↩

51. "AMD Trinity On The Desktop: A10, A8, And A6 Get Benchmarked!—Trinity: Coming Soon To A Desktop Near You". Retrieved November 10, 2013. http://www.tomshardware.co.uk/a10-5800k-a8-5600k-a6-5400k,review-32463.html ↩

52. "AMD Trinity for Desktops. Part 1: Graphics Core". X-bit labs. September 27, 2012. Archived from the original on October 11, 2012. https://web.archive.org/web/20121011155319/http://www.xbitlabs.com/articles/graphics/display/amd-trinity-graphics.html ↩

53. "Review: AMD A10-5800K Dual Graphics evaluation—CPU". October 4, 2012. Archived from the original on November 10, 2013. Retrieved November 10, 2013. http://hexus.net/tech/reviews/cpu/46157-amd-a10-5800k-dual-graphics-evaluation/ ↩

54. "The AMD A8-3850 Review: Llano on the Desktop". Archived from the original on November 10, 2013. Retrieved November 10, 2013. http://www.anandtech.com/show/4476/amd-a83850-review/6 ↩

55. "Product Search Results—Bottom Line Telecommunications". Bottom Line Telecommunications Corporation. Archived from the original on September 19, 2019. Retrieved November 10, 2013. http://www.shopblt.com/cgi-bin/s.cgi?s_max=100&order_id=239797834&s_mfg=AMD ↩

56. AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27] ↩

57. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single-precision_floating-point_format ↩

58. "AMD Sempron CPU". Archived from the original on March 10, 2015. Retrieved March 2, 2015. https://www.amd.com/en-us/products/processors/desktop/sempron-cpu ↩

59. Альберт Шаповалов (September 10, 2014). "Обзор и тестирование процессора AMD Athlon X2 340". Ru.gecid.com/ (in Russian). Archived from the original on September 14, 2016. Retrieved September 12, 2016. http://ru.gecid.com/cpu/amd_athlon_x2_340/?s=all ↩

60. Hassan Mujtaba. "AMD A10-6800K and A10-6700 "Richland" APU Review". Wccftech. Archived from the original on March 20, 2020. Retrieved March 20, 2020. https://wccftech.com/review/amd-a10-6800k-a10-6700-richland-apu-review/ ↩

61. AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27] ↩

62. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single-precision_floating-point_format ↩

63. "AMD Sempron CPU". Archived from the original on March 10, 2015. Retrieved March 2, 2015. https://www.amd.com/en-us/products/processors/desktop/sempron-cpu ↩

64. "AMD Athlon Processors". Archived from the original on March 7, 2015. Retrieved March 2, 2015. https://www.amd.com/en-us/products/processors/desktop/athlon-cpu ↩

65. btarunr (March 23, 2014). "AMD FX-670K CPU Shows Up in the Wild". TechPowerUp. Archived from the original on April 4, 2016. Retrieved March 23, 2016. http://www.techpowerup.com/199179/amd-fx-670k-cpu-shows-up-in-the-wild.html ↩

66. AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27] ↩

67. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single-precision_floating-point_format ↩

68. Anton Shilov (May 30, 2013). "AMD's Next-Gen "Kaveri" APUs Will Require New Mainboards". Archived from the original on June 7, 2013. Retrieved December 17, 2014. https://web.archive.org/web/20130607163138/http://www.xbitlabs.com/news/cpu/display/20130530232155_AMD_s_Next_Gen_Kaveri_APUs_Will_Require_New_Mainboards.html ↩

69. "AMD Godavari core". www.cpu-world.com. Archived from the original on September 16, 2018. Retrieved September 16, 2018. http://www.cpu-world.com/Cores/Godavari.html ↩

70. Joel Hruska. "AMD Kaveri A10-7850K and A8-7600 review: Was it worth the wait for the first true heterogeneous chip?". ExtremeTech. Archived from the original on March 20, 2020. Retrieved March 20, 2020. https://www.extremetech.com/computing/174632-amd-kaveri-a10-7850k-and-a8-7600-review-was-it-worth-the-wait-for-the-first-true-heterogeneous-chip ↩

71. Hassan Mujtaba (July 4, 2013). "AMD Kaveri APU Architecture Detailed". Archived from the original on August 7, 2022. Retrieved March 15, 2015. http://wccftech.com/amd-kaveri-apu-architecture-detailed-generation-apu-featuring-steamroller-gcn-cores/ ↩

72. "A technical look at AMD's Kaveri architecture". SemiAccurate. January 15, 2014. Archived from the original on December 10, 2021. Retrieved June 25, 2014. http://semiaccurate.com/2014/01/15/technical-look-amds-kaveri-architecture/ ↩

73. "AMD to add ARM processors to boost chip security". June 14, 2012. Archived from the original on September 3, 2013. Retrieved September 3, 2013. https://arstechnica.com/information-technology/2012/06/amd-to-add-arm-processors-to-boost-chip-security/ ↩

74. "AMD and ARM Fusion redefine beyond x86". Archived from the original on November 5, 2013. Retrieved November 10, 2013. https://web.archive.org/web/20131105095352/http://technewspedia.com/amd-and-arm-fusion-redefine-beyond-x86/ ↩

75. "Carrizo presentation, page 12 - Carrizo is the 1st ARM Trustzone capable performance APU" (PDF). Retrieved January 13, 2020. http://www.ps-philgeps.gov.ph/home/images/BAD/PHILIPPINES_PS-DBM%20Event%20July%2015,%202016.pdf ↩

76. "AMD A10-7850K Graphics Performance". February 14, 2014. Archived from the original on April 5, 2014. Retrieved April 2, 2014. http://www.techspot.com/review/781-amd-a10-7850k-graphics-performance/ ↩

77. "AMD A8-7600 Kaveri APU review - The Embedded GPU - HSA & hUMA". January 14, 2014. Archived from the original on August 7, 2022. Retrieved June 25, 2014. https://web.archive.org/web/20220807161032/https://www.guru3d.com/articles_pages/amd_a8_7600_apu_review,3.html ↩

78. AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27] ↩

79. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single-precision_floating-point_format ↩

80. "AMD Athlon Processors". Archived from the original on March 7, 2015. Retrieved March 2, 2015. https://www.amd.com/en-us/products/processors/desktop/athlon-cpu ↩

81. "AMD Athlon Processors". Archived from the original on March 7, 2015. Retrieved March 2, 2015. https://www.amd.com/en-us/products/processors/desktop/athlon-cpu ↩

82. Gennadiy Shvets (October 18, 2014). "HP offers desktop PCs with AMD FX-770K Kaveri processor". OFweek. Archived from the original on May 13, 2018. Retrieved March 23, 2016. https://web.archive.org/web/20180513082437/http://en.ofweek.com/new-products/HP-offers-desktop-PCs-with-AMD-FX-770K-Kaveri-processor-19708 ↩

83. "ASRock - FM2+ CPU Support List". asrock.com. Archived from the original on October 20, 2020. Retrieved October 18, 2020. https://www.asrock.com/support/cpu.asp?s=FM2%2b ↩

84. 电脑维修技术网. "AMD APU A8-7500 CPU怎么样？". pc811.com. Archived from the original on October 19, 2020. Retrieved October 18, 2020. http://www.pc811.com/tuijian/26613.html ↩

85. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single-precision_floating-point_format ↩

86. AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27] ↩

87. Hassan Mujtaba (August 26, 2015). "AMD Details Carrizo APUs Energy Efficient Design at Hot Chips 2015 – 28nm Bulk High Density Design With 3.1 Billion Transistors, 250mm2 Die". Wccftech. Archived from the original on March 20, 2020. Retrieved March 20, 2020. https://wccftech.com/amd-carrizo-apu-architecture-hot-chips/ ↩

88. "AMD to add ARM processors to boost chip security". June 14, 2012. Archived from the original on September 3, 2013. Retrieved September 3, 2013. https://arstechnica.com/information-technology/2012/06/amd-to-add-arm-processors-to-boost-chip-security/ ↩

89. "AMD and ARM Fusion redefine beyond x86". Archived from the original on November 5, 2013. Retrieved November 10, 2013. https://web.archive.org/web/20131105095352/http://technewspedia.com/amd-and-arm-fusion-redefine-beyond-x86/ ↩

90. "Carrizo presentation, page 12 - Carrizo is the 1st ARM Trustzone capable performance APU" (PDF). Retrieved January 13, 2020. http://www.ps-philgeps.gov.ph/home/images/BAD/PHILIPPINES_PS-DBM%20Event%20July%2015,%202016.pdf ↩

91. With cooler if available. ↩

92. AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27] ↩

93. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single-precision_floating-point_format ↩

94. "AMD quietly launches new Carrizo APU: A8-7680 processor". October 26, 2018. Archived from the original on May 7, 2023. Retrieved June 29, 2019. https://www.reddit.com/r/hardware/comments/9rmj8t/amd_quietly_launches_new_carrizo_apu_a87680/ ↩

95. Cutress, Ian (October 28, 2018). "Day of the Dead: AMD Releases new Carrizo FM2+ APU, the A8-7680". Archived from the original on June 29, 2019. Retrieved June 29, 2019. https://www.anandtech.com/show/13524/amd-new-carrizo-fm2-apu-a8-7680 ↩

96. Cutress, Ian (September 23, 2016). "AMD 7th Gen Bristol Ridge and AM4 Analysis". Anandtech.com. Archived from the original on November 20, 2016. Retrieved September 23, 2016. http://www.anandtech.com/show/10705/amd-7th-gen-bristol-ridge-and-am4-analysis-a12-9800-b350-a320-chipset ↩

97. With cooler if available. ↩

98. AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27] ↩

99. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single-precision_floating-point_format ↩

100. "7th Gen AMD Athlon™ X4 940". AMD. Archived from the original on May 5, 2022. Retrieved June 14, 2022. https://www.amd.com/en/product/2081 ↩

101. "7th Gen AMD Athlon™ X4 940". AMD. https://www.amd.com/en/product/2076 ↩

102. "7th Gen AMD Athlon™ X4 940". AMD. https://www.amd.com/en/product/2071 ↩

103. "AMD A6-Series A6-9400 - AD9400AGM23AB / AD9400AGABBOX". CPU-World. Archived from the original on June 9, 2022. Retrieved June 14, 2022. https://www.cpu-world.com/CPUs/Bulldozer/AMD-A6-Series%20A6-9400.html ↩

104. "7th Gen A6-9500E APU". AMD. Archived from the original on May 5, 2022. Retrieved June 14, 2022. https://www.amd.com/en/product/2091 ↩

105. "7th Gen AMD PRO A6-9500E APU". AMD. Archived from the original on May 5, 2022. Retrieved June 14, 2022. https://www.amd.com/en/product/6186 ↩

106. "7th Gen A6-9500 APU". AMD. Archived from the original on May 5, 2022. Retrieved June 14, 2022. https://www.amd.com/en/product/2096 ↩

107. "7th Gen AMD PRO A6-9500 APU". AMD. Archived from the original on May 5, 2022. Retrieved June 14, 2022. https://www.amd.com/en/product/6181 ↩

108. "7th Gen A6-9550 APU". AMD. https://www.amd.com/en/product/2086 ↩

109. "7th Gen A8-9600 APU". AMD. Archived from the original on May 5, 2022. Retrieved June 14, 2022. https://www.amd.com/en/product/2101 ↩

110. "7th Gen AMD PRO A8-9600 APU". AMD. Archived from the original on May 5, 2022. Retrieved June 14, 2022. https://www.amd.com/en/product/6191 ↩

111. "7th Gen A10-9700E APU". AMD. Archived from the original on May 5, 2022. Retrieved June 14, 2022. https://www.amd.com/en/product/2106 ↩

112. "7th Gen AMD PRO A10-9700E APU". AMD. Archived from the original on August 22, 2024. Retrieved June 14, 2022. https://www.amd.com/en/product/6166 ↩

113. "7th Gen A10-9700 APU". AMD. Archived from the original on May 5, 2022. Retrieved June 14, 2022. https://www.amd.com/en/product/2111 ↩

114. "7th Gen AMD PRO A10-9700 APU". AMD. Archived from the original on May 5, 2022. Retrieved June 14, 2022. https://www.amd.com/en/product/6161 ↩

115. "7th Gen A12-9800E APU". AMD. Archived from the original on May 5, 2022. Retrieved June 14, 2022. https://www.amd.com/en/product/2116 ↩

116. Sang-ho, Lee (September 19, 2016). "AMD Final Heavy Equipment X Carrier ZEN Bristol Ridge A12-9800 platform change". BodNara Korea. Archived from the original on May 17, 2017. Retrieved November 12, 2016. https://translate.google.com/translate?sl=auto&tl=en&js=y&prev=_t&hl=en&ie=UTF-8&u=http%3A%2F%2Fwww.bodnara.co.kr%2Fbbs%2Farticle.html%3Fnum%3D134612%26mn%3D4&edit-text= ↩

117. "7th Gen AMD PRO A12-9800E APU". AMD. Archived from the original on August 22, 2024. Retrieved June 14, 2022. https://www.amd.com/en/product/6176 ↩

118. "7th Gen A12-9800 APU". AMD. https://www.amd.com/en/product/2121 ↩

119. "7th Gen AMD PRO A12-9800 APU". AMD. Archived from the original on August 22, 2024. Retrieved June 14, 2022. https://www.amd.com/en/product/6171 ↩

120. Unified shaders : Texture mapping units : Render output units and Compute units (CU) /wiki/Unified_shader_model ↩

121. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single-precision_floating-point_format ↩

122. Cutress, Ian (September 6, 2018). "AMD Announces New $55 Low-Power Processor: Athlon 200GE". AnandTech. Retrieved November 14, 2023. https://www.anandtech.com/show/13332/amd-athlon-200ge-55-usd ↩

123. Shilov, Anton (December 21, 2018). "AMD Athlon 220GE and Athlon 240GE with Radeon Vega Graphics Launched". AnandTech. Retrieved November 14, 2023. https://www.anandtech.com/show/13741/amd-athlon-220ge-and-athlon-240ge-with-radeon-vega-graphics-launched ↩

124. Shilov, Anton (December 21, 2018). "AMD Athlon 220GE and Athlon 240GE with Radeon Vega Graphics Launched". AnandTech. Retrieved November 14, 2023. https://www.anandtech.com/show/13741/amd-athlon-220ge-and-athlon-240ge-with-radeon-vega-graphics-launched ↩

125. Armasu, Lucian (November 19, 2019). "AMD's Unlocked Athlon 3000G APU Starts Shipping at $49". Tom's Hardware. Retrieved November 14, 2023. https://www.tomshardware.com/news/amd-athlon-3000g-apu-release-specs-price ↩

126. "HP Desktop Pro A G2 Specifications". HP Customer Support. Retrieved December 23, 2022. https://support.hp.com/ie-en/document/c06168908 ↩

127. Schiesser, Tim (January 8, 2018). "AMD's 2nd-gen Ryzen is coming in April, desktop Ryzen APUs arrive February 12". TechSpot. Retrieved June 10, 2019. https://www.techspot.com/news/72627-amd-2nd-gen-ryzen-coming-april-desktop-ryzen.html ↩

128. Schiesser, Tim (January 8, 2018). "AMD's 2nd-gen Ryzen is coming in April, desktop Ryzen APUs arrive February 12". TechSpot. Retrieved June 10, 2019. https://www.techspot.com/news/72627-amd-2nd-gen-ryzen-coming-april-desktop-ryzen.html ↩

129. Starting with 2020 releases, AMD stopped referring to integrated graphics as "Vega", therefore all Vega based iGPUs are branded as AMD Radeon Graphics (instead Radeon Vega 3 or Radeon Vega 10).[82][83][84] /wiki/AMD ↩

130. Unified shaders : Texture mapping units : Render output units and Compute units (CU) /wiki/Unified_shader_model ↩

131. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single-precision_floating-point_format ↩

132. Cutress, Dr.Ian (June 10, 2019). "AMD Ryzen 3000 APUs: Up to Vega 11, More MHz, Under $150, Coming July 7th". AnandTech. Retrieved November 16, 2023. https://www.anandtech.com/show/14523/amd-ryzen-3000-apus-up-to-vega-11-more-mhz-under-150 ↩

133. Cutress, Dr.Ian (June 10, 2019). "AMD Ryzen 3000 APUs: Up to Vega 11, More MHz, Under $150, Coming July 7th". AnandTech. Retrieved November 16, 2023. https://www.anandtech.com/show/14523/amd-ryzen-3000-apus-up-to-vega-11-more-mhz-under-150 ↩

134. Core complexes (CCXs) × cores per CCX ↩

135. Unified shaders : Texture mapping units : Render output units and Compute units (CU) /wiki/Unified_shader_model ↩

136. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single-precision_floating-point_format ↩

137. Model also available as PRO version as 4350GE,[87] 4350G,[88] 4650GE,[89] 4650G,[90] 4750GE,[91] 4750G,[92] released on July 21, 2020 for OEM only.[93] ↩

138. All of the iGPUs are branded as AMD Radeon Graphics. ↩

139. Model also available as PRO version as 4350GE,[87] 4350G,[88] 4650GE,[89] 4650G,[90] 4750GE,[91] 4750G,[92] released on July 21, 2020 for OEM only.[93] ↩

140. Model also available as PRO version as 4350GE,[87] 4350G,[88] 4650GE,[89] 4650G,[90] 4750GE,[91] 4750G,[92] released on July 21, 2020 for OEM only.[93] ↩

141. "AMD Spring 2022 Ryzen Desktop Processor Update Includes Six New Models Besides 5800X3D". TechPowerUp. March 16, 2022. Retrieved March 8, 2024. https://www.techpowerup.com/292954/amd-spring-2022-ryzen-desktop-processor-update-includes-six-new-models-besides-5800x3d ↩

142. Model also available as PRO version as 4350GE,[87] 4350G,[88] 4650GE,[89] 4650G,[90] 4750GE,[91] 4750G,[92] released on July 21, 2020 for OEM only.[93] ↩

143. Model also available as PRO version as 4350GE,[87] 4350G,[88] 4650GE,[89] 4650G,[90] 4750GE,[91] 4750G,[92] released on July 21, 2020 for OEM only.[93] ↩

144. Model also available as PRO version as 4350GE,[87] 4350G,[88] 4650GE,[89] 4650G,[90] 4750GE,[91] 4750G,[92] released on July 21, 2020 for OEM only.[93] ↩

145. All of the iGPUs are branded as AMD Radeon Graphics. ↩

146. Core Complexes (CCX) × cores per CCX ↩

147. Unified shaders : texture mapping units : render output units and compute units (CU) /wiki/Unified_shader_model ↩

148. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single-precision_floating-point_format ↩

149. Model also available as PRO version as 5350GE,[95] 5350G,[96] 5650GE,[97] 5650G,[98] 5750GE,[99] 5750G,[100] released June 1, 2021.[101] ↩

150. Model also available as PRO version as 5350GE,[95] 5350G,[96] 5650GE,[97] 5650G,[98] 5750GE,[99] 5750G,[100] released June 1, 2021.[101] ↩

151. Wallossek, Igor (January 8, 2024). "CES: And it goes on - even more Ryzen 5000 CPUs for the AM4 socket". igor´sLAB. Retrieved January 9, 2024. https://www.igorslab.de/en/ces-and-theres-still-more-ryzen-5000-cpus-for-the-am4-socket/ ↩

152. Model also available as PRO version as 5350GE,[95] 5350G,[96] 5650GE,[97] 5650G,[98] 5750GE,[99] 5750G,[100] released June 1, 2021.[101] ↩

153. Model also available as PRO version as 5350GE,[95] 5350G,[96] 5650GE,[97] 5650G,[98] 5750GE,[99] 5750G,[100] released June 1, 2021.[101] ↩

154. Wallossek, Igor (January 8, 2024). "CES: And it goes on - even more Ryzen 5000 CPUs for the AM4 socket". igor´sLAB. Retrieved January 9, 2024. https://www.igorslab.de/en/ces-and-theres-still-more-ryzen-5000-cpus-for-the-am4-socket/ ↩

155. Model also available as PRO version as 5350GE,[95] 5350G,[96] 5650GE,[97] 5650G,[98] 5750GE,[99] 5750G,[100] released June 1, 2021.[101] ↩

156. Model also available as PRO version as 5350GE,[95] 5350G,[96] 5650GE,[97] 5650G,[98] 5750GE,[99] 5750G,[100] released June 1, 2021.[101] ↩

157. Self identifies as "AMD Radeon Graphics". See RDNA 2 § Integrated graphics processors (iGPs). /wiki/RDNA_2#Integrated_graphics_processors_(iGPs) ↩

158. Core Complexes (CCX) × cores per CCX ↩

159. Only one of the two CCXes has additional 64 MB 3D V-Cache.[102] Only the CCX without 3D V-Cache will be able to reach the maximum boost clocks. The CCX with 3D V-Cache will clock lower.[103] ↩

160. Only one of the two CCXes has additional 64 MB 3D V-Cache.[102] Only the CCX without 3D V-Cache will be able to reach the maximum boost clocks. The CCX with 3D V-Cache will clock lower.[103] ↩

161. "AMD Extends its Leadership with the Introduction of its Broadest Portfolio of High-Performance PC Products for Mobile and Desktop". AMD (Press release). January 4, 2023. Retrieved January 5, 2023. https://www.amd.com/en/newsroom/press-releases/2023-1-4-amd-extends-its-leadership-with-the-introduction-o.html ↩

162. "AMD Extends its Leadership with the Introduction of its Broadest Portfolio of High-Performance PC Products for Mobile and Desktop". AMD (Press release). January 4, 2023. Retrieved January 5, 2023. https://www.amd.com/en/newsroom/press-releases/2023-1-4-amd-extends-its-leadership-with-the-introduction-o.html ↩

163. btarunr (August 30, 2024). "AMD Ryzen 5 7600X3D Launched in the US as a MicroCenter-exclusive for $300, Part of a Bundle". TechPowerUp. Retrieved September 6, 2024. https://www.techpowerup.com/326111/amd-ryzen-5-7600x3d-launched-in-the-us-as-a-microcenter-exclusive-for-usd-300-part-of-a-bundle ↩

164. Shilov, Anton (September 5, 2024). "AMD's Ryzen 5 7600X3D is no longer exclusive to the U.S. — the latest 3D V-Cache chip is now available in Germany for €329". Tom's Hardware. Retrieved September 6, 2024. https://www.tomshardware.com/pc-components/cpus/amds-ryzen-5-7600x3d-is-no-longer-exclusive-to-the-us-the-latest-3d-v-cache-chip-is-now-available-in-germany-for-euro329 ↩

165. Release date for US, where it is only sold though MicroCenter.[105] In Europe it is only available in Germany, and only through MindFactory, which released it on September 5, 2024.[106] ↩

166. "AMD Extends its Leadership with the Introduction of its Broadest Portfolio of High-Performance PC Products for Mobile and Desktop". AMD (Press release). January 4, 2023. Retrieved January 5, 2023. https://www.amd.com/en/newsroom/press-releases/2023-1-4-amd-extends-its-leadership-with-the-introduction-o.html ↩

167. WhyCry (July 23, 2023). "AMD Ryzen 5 7500F reviews are out, CPU to launch globally at $179". VideoCardz.com. Retrieved July 23, 2023. https://videocardz.com/newz/amd-ryzen-5-7500f-reviews-are-out-cpu-to-launch-globally-at-179 ↩

168. Core Complexes (CCX) × cores per CCX, or Zen 4 + Zen 4c cores ↩

169. Unified shaders : Texture mapping units : Render output units : Ray accelerators : AI accelerators and Compute units (CU) /wiki/Unified_shader_model ↩

170. GPUs based on RDNA 3 have dual-issue stream processors so that up to two shader instructions can be executed per clock cycle under certain parallelism conditions. /wiki/RDNA_3 ↩

171. Model also available as PRO version as 8300G[109], 8300GE[110], 8500G[111], 8500GE[112], 8600G[113], 8700G[114]. ↩

172. Bonshor, Gavin (January 8, 2024). "AMD Unveils Ryzen 8000G Series Processors: Zen 4 APUs For Desktop with Ryzen AI". AnandTech. Retrieved January 9, 2024. https://www.anandtech.com/show/21208/amd-unveils-ryzen-8000g-series-processors-zen-4-apus-for-desktop-with-ryzen-ai ↩

173. Model also available as PRO version as 8300G[109], 8300GE[110], 8500G[111], 8500GE[112], 8600G[113], 8700G[114]. ↩

174. Bonshor, Gavin (January 8, 2024). "AMD Unveils Ryzen 8000G Series Processors: Zen 4 APUs For Desktop with Ryzen AI". AnandTech. Retrieved January 9, 2024. https://www.anandtech.com/show/21208/amd-unveils-ryzen-8000g-series-processors-zen-4-apus-for-desktop-with-ryzen-ai ↩

175. Model also available as PRO version as 8300G[109], 8300GE[110], 8500G[111], 8500GE[112], 8600G[113], 8700G[114]. ↩

176. Zen 4 cores' base frequency / Zen 4c cores' base frequency ↩

177. Zen 4 cores' boost frequency / Zen 4c cores' boost frequency ↩

178. Model also available as PRO version as 8300G[109], 8300GE[110], 8500G[111], 8500GE[112], 8600G[113], 8700G[114]. ↩

179. Zen 4 cores' base frequency / Zen 4c cores' base frequency ↩

180. Model also available as PRO version as 8300G[109], 8300GE[110], 8500G[111], 8500GE[112], 8600G[113], 8700G[114]. ↩

181. Zen 4 cores' base frequency / Zen 4c cores' base frequency ↩

182. Zen 4 cores' boost frequency / Zen 4c cores' boost frequency ↩

183. Model also available as PRO version as 8300G[109], 8300GE[110], 8500G[111], 8500GE[112], 8600G[113], 8700G[114]. ↩

184. AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27] ↩

185. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single-precision_floating-point_format ↩

186. "AMD Opteron X1150 - OX1150IPJ44HM". CPUWorld. Archived from the original on November 13, 2023. Retrieved November 13, 2023. https://www.cpu-world.com/CPUs/Jaguar/AMD-Opteron%20X%20series%20X1150.html ↩

187. "AMD Launches the AMD Opteron X-Series Family: the Industry's Highest Performance Small Core x86 Server Processors". AMD (Press release). May 29, 2013. Archived from the original on August 22, 2024. Retrieved November 13, 2023. https://www.amd.com/en/press-releases/amd-launches-the-2013may29 ↩

188. Kennedy, Patrick (June 5, 2017). "New HPE ProLiant MicroServer Gen10 Powered by AMD Opteron X3000 APUs". Archived from the original on July 9, 2017. Retrieved June 5, 2017. https://www.servethehome.com/new-hpe-proliant-microserver-gen10-powered-amd-opteron-x3000-apus/ ↩

189. "Opteron Family". AMD. Archived from the original on May 20, 2017. Retrieved June 5, 2017. https://web.archive.org/web/20170520180537/https://www.amd.com/en/opteron ↩

190. AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27] ↩

191. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single-precision_floating-point_format ↩

192. "Opteron Family". AMD. Archived from the original on May 20, 2017. Retrieved June 5, 2017. https://web.archive.org/web/20170520180537/https://www.amd.com/en/opteron ↩

193. "AMD Opteron X3216 - OX3216AAY23KA". CPUWorld. Retrieved November 13, 2023. https://www.cpu-world.com/CPUs/Bulldozer/AMD-Opteron%20X3000%20series%20X3216.html ↩

194. "Opteron Family". AMD. Archived from the original on May 20, 2017. Retrieved June 5, 2017. https://web.archive.org/web/20170520180537/https://www.amd.com/en/opteron ↩

195. "AMD Opteron X3418 - OX3418AAY43KA". CPUWorld. Archived from the original on November 13, 2023. Retrieved November 13, 2023. https://www.cpu-world.com/CPUs/Bulldozer/AMD-Opteron%20X3000%20series%20X3418.html ↩

196. "Opteron Family". AMD. Archived from the original on May 20, 2017. Retrieved June 5, 2017. https://web.archive.org/web/20170520180537/https://www.amd.com/en/opteron ↩

197. "AMD Opteron X3421 - OX3421AAY43KA". CPUWorld. Archived from the original on November 13, 2023. Retrieved November 13, 2023. https://www.cpu-world.com/CPUs/Bulldozer/AMD-Opteron%20X3000%20series%20X3421.html ↩

198. AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27] ↩

199. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single-precision_floating-point_format ↩

200. AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27] ↩

201. Unified shader processors (USPs): Texture mapping units (TMUs): Render output units (ROPs). 1 CU (Compute Unit) = 64 USPs: 4 TMUs : 1 ROPs /wiki/Unified_shader_model ↩

202. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single-precision_floating-point_format ↩

203. "AMD lists A8-4557M and A10-4657M mobile APUs". www.cpu-world.com. Archived from the original on September 17, 2018. Retrieved September 17, 2018. http://www.cpu-world.com/news_2013/2013031901_AMD_lists_A8-4557M_and_A10-4657M_mobile_APUs.html ↩

204. "AMD lists A8-4557M and A10-4657M mobile APUs". www.cpu-world.com. Archived from the original on September 17, 2018. Retrieved September 17, 2018. http://www.cpu-world.com/news_2013/2013031901_AMD_lists_A8-4557M_and_A10-4657M_mobile_APUs.html ↩

205. "AMD intros 35W Richland mobile APUs". March 12, 2013. Archived from the original on March 14, 2013. Retrieved November 10, 2013. http://techreport.com/news/24482/amd-intros-35w-richland-mobile-apus ↩

206. Poeter, Damon. (March 12, 2013) AMD Bakes New Interface Capabilities Into Richland APUs | News & Opinion Archived July 12, 2017, at the Wayback Machine https://www.pcmag.com/article2/0,2817,2416506,00.asp ↩

207. AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27] ↩

208. Unified shader processors (USPs): Texture mapping units (TMUs): Render output units (ROPs). 1 CU (Compute Unit) = 64 USPs: 4 TMUs : 1 ROPs /wiki/Unified_shader_model ↩

209. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single-precision_floating-point_format ↩

210. "AMD Kaveri APU with SteamrollerB Core Features 20% CPU and 30% GPU Performance Uplift over Richland – Platform Details Unveiled | TechNationNews.com". Archived from the original on December 3, 2013. Retrieved November 26, 2013. https://web.archive.org/web/20131203121409/http://www.technationnews.com/2013/11/24/amd-kaveri-apu-with-steamrollerb-core-features-20-cpu-and-30-gpu-performance-uplift-over-richland-platform-details-unveiled/ ↩

211. Hassan Mujtaba (July 4, 2013). "AMD Kaveri APU Architecture Detailed". Archived from the original on August 7, 2022. Retrieved March 15, 2015. http://wccftech.com/amd-kaveri-apu-architecture-detailed-generation-apu-featuring-steamroller-gcn-cores/ ↩

212. "A technical look at AMD's Kaveri architecture". SemiAccurate. January 15, 2014. Archived from the original on December 10, 2021. Retrieved June 25, 2014. http://semiaccurate.com/2014/01/15/technical-look-amds-kaveri-architecture/ ↩

213. "AMD to add ARM processors to boost chip security". June 14, 2012. Archived from the original on September 3, 2013. Retrieved September 3, 2013. https://arstechnica.com/information-technology/2012/06/amd-to-add-arm-processors-to-boost-chip-security/ ↩

214. "AMD and ARM Fusion redefine beyond x86". Archived from the original on November 5, 2013. Retrieved November 10, 2013. https://web.archive.org/web/20131105095352/http://technewspedia.com/amd-and-arm-fusion-redefine-beyond-x86/ ↩

215. AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27] ↩

216. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single-precision_floating-point_format ↩

217. AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27] ↩

218. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single-precision_floating-point_format ↩

219. Cutress, Ian (June 1, 2016). "AMD Announces 7th Generation APU". Anandtech.com. Archived from the original on June 2, 2016. Retrieved June 1, 2016. http://www.anandtech.com/show/10362/amd-7th-generation-apu-bristol-ridge-stoney-ridge-for-notebooks ↩

220. AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27] ↩

221. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single-precision_floating-point_format ↩

222. "AMD A10-9620P SoC - Benchmarks and Specs". Notebookcheck.net. Archived from the original on August 25, 2017. Retrieved July 20, 2018. https://www.notebookcheck.net/AMD-A10-9620P-SoC-Benchmarks-and-Specs.234384.0.html ↩

223. "AMD A12-9720P SoC - Benchmarks and Specs". Notebookcheck.net. Archived from the original on August 25, 2017. Retrieved July 20, 2018. https://www.notebookcheck.net/AMD-A12-9720P-SoC-Benchmarks-and-Specs.234448.0.html ↩

224. "HP Pavilion 17 - HP® Official Store". Store.hp.com. Archived from the original on October 2, 2017. Retrieved July 20, 2018. http://store.hp.com/us/en/pdp/hp-pavilion-laptop---17z-touch-optional-1gz59av-1 ↩

225. Unified shaders : Texture mapping units : Render output units and Compute units (CU) /wiki/Unified_shader_model ↩

226. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single-precision_floating-point_format ↩

227. Core Complexes (CCX) × cores per CCX ↩

228. Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU) /wiki/Unified_shader_model ↩

229. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single_precision_floating-point_format ↩

230. "AMD Ryzen 7 3780U Microsoft Surface® Edition". https://www.amd.com/en/products/apu/amd-ryzen-7-3780u-microsoft-surface-edition ↩

231. "AMD Ryzen 7 3750H Mobile Processor with Radeon RX Vega 10 Graphics". https://www.amd.com/en/products/apu/amd-ryzen-7-3750h ↩

232. "AMD Radeon RX Vega 10 Mobile Specs | TechPowerUp GPU Database". Techpowerup.com. https://www.techpowerup.com/gpudb/3053/radeon-rx-vega-10-mobile ↩

233. "AMD Ryzen 7 3700C". https://www.amd.com/en/products/apu/amd-ryzen-7-3700c ↩

234. Model also available as PRO version[144][145][146], released April 8, 2019. ↩

235. "AMD Ryzen 7 3700U Mobile Processor with Radeon RX Vega 10 Graphics". https://www.amd.com/en/products/apu/amd-ryzen-7-3700u ↩

236. "AMD Ryzen 5 3580U Microsoft Surface® Edition". https://www.amd.com/en/products/apu/amd-ryzen-5-3580u-microsoft-surface-edition ↩

237. "AMD Ryzen 5 3550H Mobile Processor with Radeon Vega 8 Graphics". Retrieved January 8, 2018. https://www.amd.com/en/products/apu/amd-ryzen-5-3550h ↩

238. "AMD Radeon Vega 8 Specs | TechPowerUp GPU Database". Techpowerup.com. https://www.techpowerup.com/gpudb/3042/radeon-rx-vega-8-mobile ↩

239. "AMD Ryzen 5 3500C". https://www.amd.com/en/products/apu/amd-ryzen-5-3500c ↩

240. Model also available as PRO version[144][145][146], released April 8, 2019. ↩

241. "AMD Ryzen 5 3500U Mobile Processor with Radeon Vega 8 Graphics". https://www.amd.com/en/products/apu/amd-ryzen-5-3500u ↩

242. "AMD Ryzen 5 3450U Processor". https://www.amd.com/en/products/apu/amd-ryzen-5-3450u ↩

243. "AMD Ryzen 3 3350U". AMD. https://www.amd.com/en/products/apu/amd-ryzen-3-3350uhttps://www.amd.com/en/products/apu/amd-ryzen-3-3350u ↩

244. "AMD Radeon Vega 6 Mobile Specs | TechPowerUp GPU Database". Techpowerup.com. https://www.techpowerup.com/gpudb/3079/radeon-vega-6 ↩

245. Model also available as PRO version[144][145][146], released April 8, 2019. ↩

246. "AMD Ryzen 3 3300U Mobile Processor with Radeon Vega 6 Graphics". Retrieved January 6, 2019. https://www.amd.com/en/products/apu/amd-ryzen-3-3300u ↩

247. Cutress, Ian (January 6, 2020). "AMD Ryzen 4000 Mobile APUs: 7nm, 8-core on both 15W and 45W, Coming Q1". anandtech.com. AnandTech. Archived from the original on January 7, 2020. Retrieved January 7, 2020. https://www.anandtech.com/show/15324/amd-ryzen-4000-mobile-apus-7nm-8core-on-both-15w-and-45w-coming-q1 ↩

248. Alcorn, Paul (January 7, 2020). "AMD Launches Threadripper 3990X and Ryzen 4000 'Renoir' APUs". tomshardware.com. Tom's Hardware. Archived from the original on January 7, 2020. Retrieved January 7, 2020. https://www.tomshardware.com/news/amd-launches-threadripper-3990x-and-ryzen-4000-renoir-apus ↩

249. Gartenberg, Chaim (January 6, 2020). "AMD's 7nm Ryzen 4000 CPUs are here to take on Intel's 10nm Ice Lake laptop chips". theverge.com. The Verge. Archived from the original on January 6, 2020. Retrieved January 7, 2020. https://www.theverge.com/2020/1/6/21054007/amd-7nm-ryzen-4000-cpu-ces-2020-intel-competition-laptop-processors-zen-2 ↩

250. "AMD "Renoir" die Shot Pictured". March 16, 2020. Archived from the original on December 9, 2020. Retrieved June 25, 2021. https://www.techpowerup.com/264801/amd-renoir-die-shot-pictured ↩

251. Core Complexes (CCX) × cores per CCX ↩

252. Unified shaders : texture mapping units : render output units and compute units (CU) /wiki/Unified_shader_model ↩

253. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single-precision_floating-point_format ↩

254. All of the iGPUs are branded as AMD Radeon Graphics. ↩

255. Core Complexes (CCX) × cores per CCX ↩

256. Unified shaders : texture mapping units : render output units and compute units (CU) /wiki/Unified_shader_model ↩

257. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single-precision_floating-point_format ↩

258. All of the iGPUs are branded as AMD Radeon Graphics. ↩

259. "AMD Ryzen 5 4600HS". AMD. Retrieved November 10, 2023.[permanent dead link] https://www.amd.com/en/products/apu/amd-ryzen-5-4600HS ↩

260. "AMD Ryzen 5 4600HS Mobile processor". CPUWorld. Retrieved November 10, 2023. https://www.cpu-world.com/CPUs/Zen/AMD-Ryzen%205%20Mobile%204600HS.html ↩

261. "AMD Ryzen 7 4600HS Laptop Processor". Notebookcheck. Retrieved November 10, 2023. https://www.notebookcheck.com/AMD-Ryzen-7-4600HS-Laptop-Prozessor-Benchmarks-und-Specs.449836.0.html ↩

262. Core Complexes (CCX) × cores per CCX ↩

263. Unified shaders : texture mapping units : render output units and compute units (CU) /wiki/Unified_shader_model ↩

264. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single_precision_floating-point_format ↩

265. All of the iGPUs are branded as AMD Radeon Graphics. ↩

266. "AMD Ryzen 5 5500U Specs". TechPowerUp. Retrieved September 17, 2021. https://www.techpowerup.com/cpu-specs/ryzen-5-5500u.c2372 ↩

267. Core Complexes (CCX) × cores per CCX ↩

268. Unified shaders : texture mapping units : render output units and compute units (CU) /wiki/Unified_shader_model ↩

269. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single-precision_floating-point_format ↩

270. Model also available as Pro version as 5450U,[160] 5650U,[161] 5850U,[162] released on March 16, 2021. ↩

271. "AMD Ryzen 7 5800U". AMD. https://www.amd.com/en/products/apu/amd-ryzen-7-5800u ↩

272. All of the iGPUs are branded as AMD Radeon Graphics. ↩

273. Model also available as Pro version as 5450U,[160] 5650U,[161] 5850U,[162] released on March 16, 2021. ↩

274. "AMD Ryzen 5 5600U". AMD. https://www.amd.com/en/products/apu/amd-ryzen-5-5600u ↩

275. "AMD Ryzen 5 5560U". AMD. https://www.amd.com/en/products/apu/amd-ryzen-5-5560u ↩

276. Model also available as Pro version as 5450U,[160] 5650U,[161] 5850U,[162] released on March 16, 2021. ↩

277. "AMD Ryzen 3 5400U". AMD. https://www.amd.com/en/products/apu/amd-ryzen-3-5400u ↩

278. "AMD Ryzen 3 5400U Mobile processor - 100-000000288". CPU-World. Retrieved September 17, 2021. https://www.cpu-world.com/CPUs/Zen/AMD-Ryzen%203%20Mobile%205400U.html ↩

279. "AMD Ryzen 3 PRO 5450U". AMD. https://www.amd.com/en/products/apu/amd-ryzen-3-pro-5450u ↩

280. "AMD Ryzen 5 PRO 5650U". AMD. https://www.amd.com/en/products/apu/amd-ryzen-5-pro-5650u ↩

281. "AMD Ryzen 7 PRO 5850U". AMD. https://www.amd.com/en/products/apu/amd-ryzen-7-pro-5850u ↩

282. Core Complexes (CCX) × cores per CCX ↩

283. Unified shaders : texture mapping units : render output units and compute units (CU) /wiki/Unified_shader_model ↩

284. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single-precision_floating-point_format ↩

285. "AMD Ryzen 9 5980HX". AMD. https://www.amd.com/en/products/apu/amd-ryzen-9-5980hx ↩

286. All of the iGPUs are branded as AMD Radeon Graphics. ↩

287. "AMD Ryzen 9 5980HS". AMD. https://www.amd.com/en/products/apu/amd-ryzen-9-5980hs ↩

288. "AMD Ryzen 9 5900HX". AMD. https://www.amd.com/en/products/apu/amd-ryzen-9-5900hx ↩

289. "AMD Ryzen 9 5900HS". AMD. https://www.amd.com/en/products/apu/amd-ryzen-9-5900hs ↩

290. "AMD Ryzen 7 5800H". AMD. https://www.amd.com/en/products/apu/amd-ryzen-7-5800h ↩

291. "AMD Ryzen 7 5800H Specs". TechPowerUp. Retrieved September 17, 2021. https://www.techpowerup.com/cpu-specs/ryzen-7-5800h.c2368 ↩

292. "AMD Ryzen 7 5800HS". AMD. https://www.amd.com/en/products/apu/amd-ryzen-7-5800hs ↩

293. "AMD Ryzen 5 5600H". AMD. https://www.amd.com/en/products/apu/amd-ryzen-5-5600h ↩

294. "AMD Ryzen 5 5600H Mobile processor - 100-000000296". CPU-World. Retrieved September 17, 2021. https://www.cpu-world.com/CPUs/Zen/AMD-Ryzen%205%20Mobile%205600H.html ↩

295. "AMD Ryzen 5 5600HS". AMD. https://www.amd.com/en/products/apu/amd-ryzen-5-5600hs ↩

296. Core Complexes (CCX) × cores per CCX ↩

297. Unified shaders : texture mapping units : render output units and compute units (CU) /wiki/Unified_shader_model ↩

298. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single-precision_floating-point_format ↩

299. Model also available as Pro version as 5475U,[176] 5675U,[177] 5875U,[178] released on April 19, 2022. ↩

300. Model also available as Chromebook optimized version as 5425C,[179] 5625C,[180] 5825C,[181] released on May 5, 2022. ↩

301. "AMD Ryzen 7 5825U". AMD. https://www.amd.com/en/products/apu/amd-ryzen-7-5825u ↩

302. All of the iGPUs are branded as AMD Radeon Graphics. ↩

303. Model also available as Pro version as 5475U,[176] 5675U,[177] 5875U,[178] released on April 19, 2022. ↩

304. Model also available as Chromebook optimized version as 5425C,[179] 5625C,[180] 5825C,[181] released on May 5, 2022. ↩

305. "AMD Ryzen 5 5625U". AMD. https://www.amd.com/en/products/apu/amd-ryzen-5-5625u ↩

306. "AMD Ryzen 3 5125C". AMD. https://www.amd.com/en/products/apu/amd-ryzen-3-5125c ↩

307. "AMD Ryzen 3 PRO 5475U". AMD. https://www.amd.com/en/products/apu/amd-ryzen-3-pro-5475u ↩

308. "AMD Ryzen 5 PRO 5675U". AMD. https://www.amd.com/en/products/apu/amd-ryzen-5-pro-5675u ↩

309. "AMD Ryzen 7 PRO 5875U". AMD. https://www.amd.com/en/products/apu/amd-ryzen-7-pro-5875u ↩

310. "AMD Ryzen 3 5425C". AMD. https://www.amd.com/en/products/apu/amd-ryzen-3-5425C ↩

311. "AMD Ryzen 5 5625C". AMD. https://www.amd.com/en/products/apu/amd-ryzen-5-5625C ↩

312. "AMD Ryzen 7 5825C". AMD. https://www.amd.com/en/products/apu/amd-ryzen-7-5825C ↩

313. Core Complexes (CCX) × cores per CCX ↩

314. Unified shaders : texture mapping units : render output units and compute units (CU) /wiki/Unified_shader_model ↩

315. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single-precision_floating-point_format ↩

316. "AMD Unveils New Ryzen Mobile Processors Uniting "Zen 3+" core with AMD RDNA 2 Graphics in Powerhouse Design". AMD. https://www.amd.com/en/press-releases/2022-01-04-amd-unveils-new-ryzen-mobile-processors-uniting-zen-3-core-amd-rdna-2 ↩

317. Model also available as PRO version (6650U[183], 6650H[184], 6650HS[185], 6850U[186], 6850H[187], 6850HS[188], 6950H[189], 6950HS[190]), released on April 19, 2022. ↩

318. Model also available as PRO version (6650U[183], 6650H[184], 6650HS[185], 6850U[186], 6850H[187], 6850HS[188], 6950H[189], 6950HS[190]), released on April 19, 2022. ↩

319. Model also available as PRO version (6650U[183], 6650H[184], 6650HS[185], 6850U[186], 6850H[187], 6850HS[188], 6950H[189], 6950HS[190]), released on April 19, 2022. ↩

320. Model also available as PRO version (6650U[183], 6650H[184], 6650HS[185], 6850U[186], 6850H[187], 6850HS[188], 6950H[189], 6950HS[190]), released on April 19, 2022. ↩

321. Model also available as PRO version (6650U[183], 6650H[184], 6650HS[185], 6850U[186], 6850H[187], 6850HS[188], 6950H[189], 6950HS[190]), released on April 19, 2022. ↩

322. Model also available as PRO version (6650U[183], 6650H[184], 6650HS[185], 6850U[186], 6850H[187], 6850HS[188], 6950H[189], 6950HS[190]), released on April 19, 2022. ↩

323. Model also available as PRO version (6650U[183], 6650H[184], 6650HS[185], 6850U[186], 6850H[187], 6850HS[188], 6950H[189], 6950HS[190]), released on April 19, 2022. ↩

324. Model also available as PRO version (6650U[183], 6650H[184], 6650HS[185], 6850U[186], 6850H[187], 6850HS[188], 6950H[189], 6950HS[190]), released on April 19, 2022. ↩

325. Shimpi, Anand Lal. "Previewing AMD's Brazos, Part 1: More Details on Zacate/Ontario and Fusion". Anandtech.com. Archived from the original on June 23, 2015. Retrieved July 20, 2018. http://www.anandtech.com/show/4003/previewing-amds-brazos-part-1-more-details-on-zacateontario-and-fusion/2 ↩

326. AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27] ↩

327. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single-precision_floating-point_format ↩

328. Shimpi, Anand Lal. "Previewing AMD's Brazos, Part 1: More Details on Zacate/Ontario and Fusion". Anandtech.com. Archived from the original on June 23, 2015. Retrieved July 20, 2018. http://www.anandtech.com/show/4003/previewing-amds-brazos-part-1-more-details-on-zacateontario-and-fusion/2 ↩

329. AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27] ↩

330. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single-precision_floating-point_format ↩

331. Shimpi, Anand Lal. "Previewing AMD's Brazos, Part 1: More Details on Zacate/Ontario and Fusion". Anandtech.com. Archived from the original on June 23, 2015. Retrieved July 20, 2018. http://www.anandtech.com/show/4003/previewing-amds-brazos-part-1-more-details-on-zacateontario-and-fusion/2 ↩

332. AMD in its technical documentation uses KB, which it defines as "kilobyte" and as equal to 1024 B (i.e., 1 KiB), and MB, which it defines as "megabyte" and as equal to 1024 KB (1 MiB).[27] /wiki/Kibibyte ↩

333. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single-precision_floating-point_format ↩

334. AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27] ↩

335. AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27] ↩

336. AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27] ↩

337. AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27] ↩

338. "Archived copy". Archived from the original on May 27, 2015. Retrieved May 26, 2015.{{cite web}}: CS1 maint: archived copy as title (link) https://web.archive.org/web/20150527023525/http://h10032.www1.hp.com/ctg/Manual/c04655538 ↩

339. "HP ProDesk 405 G2 Microtower-PC". Archived from the original on February 24, 2015. Retrieved February 24, 2015. https://store.hp.com/GermanyStore/Merch/Product.aspx?id=J4B15EA&opt=ABD&sel=PBDT ↩

340. Cutress, Ian. "AMD's Carrizo-L APUs Unveiled: 12-25W Quad Core Puma+". Anandtech.com. Archived from the original on June 23, 2015. Retrieved July 20, 2018. http://www.anandtech.com/show/9246/amds-carrizo-l-apus-unveiled-12-25w-quad-core-puma ↩

341. AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27] ↩

342. Cutress, Ian (June 1, 2016). "AMD Announces 7th Generation APU". Anandtech.com. Archived from the original on June 2, 2016. Retrieved June 1, 2016. http://www.anandtech.com/show/10362/amd-7th-generation-apu-bristol-ridge-stoney-ridge-for-notebooks ↩

343. AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27] ↩

344. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single-precision_floating-point_format ↩

345. "HP Pavilion Desktops - HP® Official Store". Store.hp.com. Archived from the original on March 10, 2018. Retrieved July 20, 2018. http://store.hp.com/us/en/pdp/hp-pavilion-desktop-570-a135m ↩

346. Unified shaders : Texture mapping units : Render output units and Compute units (CU) /wiki/Unified_shader_model ↩

347. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single-precision_floating-point_format ↩

348. "AMD Radeon Vega 3 Mobile Specs". TechPowerUp. Retrieved April 25, 2023. https://www.techpowerup.com/gpu-specs/radeon-vega-3-mobile.c3592 ↩

349. Unified shaders : Texture mapping units : Render output units and Compute units (CU) /wiki/Unified_shader_model ↩

350. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single-precision_floating-point_format ↩

351. Core Complexes (CCX) × cores per CCX ↩

352. Model also available as Chromebook optimized version as 7220C[200] and 7120C[201] released on May 23, 2023 ↩

353. "AMD Athlon™ Gold 7220U". AMD. https://www.amd.com/en/products/apu/amd-athlon-gold-7220u ↩

354. "AMD Ryzen 7020 Series Processors for Mobile Bring High-End Performance and Long Battery Life to Everyday Users". September 20, 2022. Retrieved September 21, 2022. https://www.amd.com/en/press-releases/2022-09-20-amd-ryzen-7020-series-processors-for-mobile-bring-high-end-performance ↩

355. Model also available as Chromebook optimized version as 7220C[200] and 7120C[201] released on May 23, 2023 ↩

356. "AMD Athlon™ Silver 7120U". AMD. https://www.amd.com/en/products/apu/amd-athlon-silver-7120u ↩

357. "Welcome to AMD - Processors - Graphics and Technology - AMD". Amd.com. Archived from the original on December 2, 2013. Retrieved July 20, 2018. https://www.amd.com/us/press-releases/Pages/apu-embedded-systems-2011jan19.aspx ↩

358. AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27] ↩

359. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single-precision_floating-point_format ↩

360. "Embedded Products - High Performance GPU - AMD". Amd.com. Archived from the original on January 2, 2018. Retrieved July 20, 2018. https://www.amd.com/en-us/products/embedded/processors/g-series ↩

361. AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27] ↩

362. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single-precision_floating-point_format ↩

363. AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27] ↩

364. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single-precision_floating-point_format ↩

365. AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27] ↩

366. AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27] ↩

367. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single-precision_floating-point_format ↩

368. Family Product Brief Archived July 18, 2017, at the Wayback Machine amd.com https://www.amd.com/Documents/I-Family-Product-Brief.pdf ↩

369. AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27] ↩

370. Unified shader processors (USPs): Texture mapping units (TMUs): Render output units (ROPs). 1 CU (Compute Unit) = 64 USPs: 4 TMUs : 1 ROPs /wiki/Unified_shader_model ↩

371. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single-precision_floating-point_format ↩

372. "AMD G-Series GX-420GI - GE420GAAY43KA". Cpu-world.com. July 6, 2022. Archived from the original on September 7, 2018. Retrieved August 22, 2022. http://www.cpu-world.com/CPUs/Bulldozer/AMD-G-Series%20GX-420GI.html ↩

373. J Family Product Brief Archived July 18, 2017, at the Wayback Machine amd.com https://www.amd.com/Documents/J-Family-Product-Brief.pdf ↩

374. AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27] ↩

375. Unified shader processors (USPs): Texture mapping units (TMUs): Render output units (ROPs). 1 CU (Compute Unit) = 64 USPs: 4 TMUs : 1 ROPs /wiki/Unified_shader_model ↩

376. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single-precision_floating-point_format ↩

377. "AMD detonates Trinity: Behold Bulldozer's second coming - ExtremeTech". Retrieved October 7, 2017. https://www.extremetech.com/computing/129363-amd-detonates-trinity-behold-bulldozers-second-coming ↩

378. AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27] ↩

379. Unified shader processors (USPs): Texture mapping units (TMUs): Render output units (ROPs). 1 CU (Compute Unit) = 64 USPs: 4 TMUs : 1 ROPs /wiki/Unified_shader_model ↩

380. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single-precision_floating-point_format ↩

381. 'nd Generation R Series Product Brief Archived August 30, 2017, at the Wayback Machine amd.com https://www.amd.com/Documents/2nd_Gen_Rseries_Product_Brief.pdf ↩

382. "AMD detonates Trinity: Behold Bulldozer's second coming - ExtremeTech". Retrieved October 7, 2017. https://www.extremetech.com/computing/129363-amd-detonates-trinity-behold-bulldozers-second-coming ↩

383. AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27] ↩

384. Unified shader processors (USPs): Texture mapping units (TMUs): Render output units (ROPs). 1 CU (Compute Unit) = 64 USPs: 4 TMUs : 1 ROPs /wiki/Unified_shader_model ↩

385. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single-precision_floating-point_format ↩

386. Merlin Falcon Product Brief Archived September 9, 2017, at the Wayback Machine amd.com https://www.amd.com/Documents/merlin-falcon-product-brief.pdf ↩

387. AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[27] ↩

388. Unified shader processors (USPs): Texture mapping units (TMUs): Render output units (ROPs). 1 CU (Compute Unit) = 64 USPs: 4 TMUs : 1 ROPs /wiki/Unified_shader_model ↩

389. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single-precision_floating-point_format ↩

390. Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU) /wiki/Unified_shader_model ↩

391. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single-precision_floating-point_format ↩

392. Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU) /wiki/Unified_shader_model ↩

393. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single-precision_floating-point_format ↩

394. Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU) /wiki/Unified_shader_model ↩

395. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single-precision_floating-point_format ↩

396. "Product Brief: AMD Ryzen Embedded V2000 Processor Family" (PDF). AMD. https://www.amd.com/system/files/documents/v2000-product-brief.pdf ↩

397. "AMD Unveils AMD Ryzen Embedded V2000 Processors with Enhanced Performance and Power Efficiency". AMD. https://ir.amd.com/news-events/press-releases/detail/979/amd-unveils-amd-ryzen-embedded-v2000-processors-with ↩

398. "Product Brief: AMD Ryzen Embedded V2000 Processor Family" (PDF). AMD. https://www.amd.com/system/files/documents/v2000-product-brief.pdf ↩

399. "Product Brief: AMD Ryzen Embedded V2000 Processor Family" (PDF). AMD. https://www.amd.com/system/files/documents/v2000-product-brief.pdf ↩

400. "Product Brief: AMD Ryzen Embedded V2000 Processor Family" (PDF). AMD. https://www.amd.com/system/files/documents/v2000-product-brief.pdf ↩

401. Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU) /wiki/Unified_shader_model ↩

402. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Single-precision_floating-point_format ↩

403. "Product Brief: AMD Ryzen Embedded R2000 Series" (PDF). AMD. https://www.amd.com/content/dam/amd/en/documents/products/embedded/ryzen/r2000-product-brief.pdf ↩

404. Bonshor, Gavin (June 22, 2022). "AMD Updates Ryzen Embedded Series, R2000 Series With up to Four Cores and Eight Threads". www.anandtech.com. Retrieved August 18, 2024. https://www.anandtech.com/show/17460/amd-updates-ryzen-embedded-series-r2000-series-with-up-to-four-cores-and-eight-threads ↩

405. "Product Brief: AMD Ryzen Embedded R2000 Series" (PDF). AMD. https://www.amd.com/content/dam/amd/en/documents/products/embedded/ryzen/r2000-product-brief.pdf ↩

406. "AMD Establishes Semi-Custom Business Unit to Create Tailored Products with Customer-Specific IP". Archived from the original on October 1, 2013. Retrieved November 10, 2013. https://web.archive.org/web/20131001071304/http://www.xbitlabs.com/news/other/display/20130501231534_AMD_Establishes_Semi_Custom_Business_Unit_to_Create_Tailored_Products_with_Customer_Specific_IP.html ↩

407. "Three for three: How AMD won the war for the heart of next-gen consoles". Polygon. June 15, 2013. Archived from the original on November 8, 2013. Retrieved November 10, 2013. http://www.polygon.com/2013/6/15/4431474/amd-xbox-one-ps4-wii-u-e3-1023 ↩

408. Unified shaders : Texture mapping units : Render output units /wiki/Unified_shader_model ↩

409. Precision performance is calculated from the base (or boost) core clock speed based on a FMA operation. /wiki/Multiply%E2%80%93accumulate_operation#Fused_multiply–add ↩

410. Pixel fillrate is calculated as the number of ROPs multiplied by the base (or boost) core clock speed. ↩

411. Texture fillrate is calculated as the number of TMUs multiplied by the base (or boost) core clock speed. ↩

412. UHD BD is the only video disc format supporting HDR. ↩

413. Cache ↩

414. MACHKOVECH, SAM (August 2, 2016). "Microsoft hid performance boosts for old games in Xbox One S, told no one". Ars Technica. Retrieved August 2, 2016. https://arstechnica.com/gaming/2016/08/surprise-new-xbox-one-s-gpu-smooths-out-some-older-games/ ↩

415. "Digital" version does not have an optical drive. ↩

416. Walton, Mark (August 10, 2016). "PS4 Neo: Sony confirms PlayStation event for September 7". Ars Technica. Retrieved August 10, 2016. https://arstechnica.com/gaming/2016/08/sony-ps4-neo-event-details/ ↩

417. Walton, Mark (April 19, 2016). "Sony PS4K is codenamed NEO, features upgraded CPU, GPU, RAM—report". Ars Technica. Retrieved August 10, 2016. http://arstechnica.co.uk/gaming/2016/04/ps4k-neo-details-specs-revealed-rumours/ ↩

418. Smith, Ryan (September 8, 2016). "Analyzing Sony's Playstation 4 Pro Hardware Reveal: What Lies Beneath". Anandtech. Retrieved September 8, 2016. http://www.anandtech.com/show/10663/analyzing-sonys-playstation-4-pro-announcement ↩

419. Freedman, Andrew (November 3, 2017). "Xbox One X vs. PlayStation 4 Pro: Which Powerhouse Should You Get?". Tom's Guide. Retrieved November 3, 2017. https://www.tomsguide.com/us/xbox-one-x-vs-ps4-pro,review-4436.html ↩

420. Feature preview of Rapid Packed Math, introduced in GCN 5. /wiki/Graphics_Core_Next#GCN5 ↩

421. "PS4 Pro's additional RAM frees up memory for game developers". Polygon. Retrieved November 23, 2018. https://www.polygon.com/2016/10/21/13358416/ps4-pro-extra-ram-memory ↩

422. Swap ↩

423. Smith, Ryan (June 11, 2017). "Microsoft's Project Scorpio Gets a Launch Date: Xbox One X, $499, November 7th". AnandTech. Retrieved May 24, 2024. https://www.anandtech.com/show/11536/microsofts-project-scorpio-get-a-launch-date-xbox-one-x-499-november-7th ↩

424. Walton, Mark (April 6, 2017). "Xbox One Project Scorpio specs: 12GB GDDR5, 6 teraflops, native 4K at 60FPS". Ars Technica. Retrieved May 24, 2024. https://arstechnica.com/gaming/2017/04/xbox-scorpio-hardware-specs/ ↩

425. Cutress, Ian (August 21, 2017). "Hot Chips: Microsoft Xbox One X Scoprio Engine Live Blog". Anandtech. Retrieved August 21, 2017. http://www.anandtech.com/show/11740/hot-chips-microsoft-xbox-one-x-scorpio-engine-live-blog-930am-pt-430pm-utc ↩

426. Cutress, Ian (August 3, 2018). "AMD Creates Quad Core Zen SoC with 24 Vega CUs for Chinese Consoles". Anandtech. https://www.anandtech.com/show/13153/amd-creates-quad-core-zen-soc-with-24-vega-cus-for-chinese-consoles ↩

427. Cutress, Ian (August 6, 2018). "More Details About the ZhongShan Subor Z+ Console, with Custom AMD Ryzen SoC". Anandtech. https://www.anandtech.com/show/13163/more-details-about-the-zhongshan-subor-z-console-with-custom-amd-ryzen-soc ↩

428. Leadbetter, Richard (September 15, 2018). "Hands-on with the Subor Z-Plus: AMD tech tested in new Chinese console". Retrieved October 28, 2018. https://www.eurogamer.net/articles/digitalfoundry-2018-hands-on-with-subor-z-plus-ryzen-vega-chinese-console ↩

429. Judd, Will (May 16, 2019). "The Subor Z+ console team has disbanded - but it's not game over yet". Gamer Network. https://www.eurogamer.net/articles/2019-05-15-subor-z-games-console-team-has-been-disbanded ↩

430. Leadbetter, Leadbetter (September 15, 2018). Hands-On: Subor Z Plus Chinese PC/Console Hybrid - Ryzen+Vega AMD Analysis!. Eurogamer. Event occurs at 2 minutes 2 seconds. Retrieved October 28, 2018. https://www.youtube.com/watch?v=x0KSJg2sqJM ↩

431. Smith, Ryan (April 16, 2019). "Sony Teases Next-Gen PlayStation: Custom AMD Chip with Zen 2 CPU & Navi GPU, SSD Too". Anandtech. https://www.anandtech.com/show/14224/sony-teases-nextgen-playstation-custom-amd-chip-with-zen-2-cpu-navi-gpu-ssd-too ↩

432. A plain 320-bit 20 GB version could be made by just replacing four 1 GB GDDR6 chips by 2 GB ones. ↩

433. "Tech Specs". steamdeck.com. Retrieved July 18, 2021. https://www.steamdeck.com/en/tech ↩